摘要:
The invention relates to a ceramic multilayered component which comprises a layer stack (101) having a plurality of ceramic layers (102, 103, 104). The multilayered component comprises a first (105) and a second (106) connecting contact as well as a first (107) and a second (108) inner electrode which are each arranged between two layers (102, 103; 103, 104) of the layer stack (101). The multilayered component comprises a first (109) and a second (110) via electrode for electrically coupling the first connecting contact (105) to the first inner electrode (107) and for electrically coupling the second connecting contact (106) to the second inner electrode (108).
摘要:
The invention relates to an electrical feedthrough component, which is provided for surface mounting, with a base (5), inside of which first inner electrodes (1) and second inner electrodes (2) are arranged. First inner electrodes (1) are connected to one another by means of a first outer electrode (10), which extends in a peripheral direction of the base (5). Second inner electrodes (2) are connected to one another in a conductive manner by means of a via hole (4) extending in the axial direction of the base (5). The invention also relates to a method for producing a feedthrough component.
摘要:
The invention relates to an electrical feedthrough component, which is provided for surface mounting, with a base (5), inside of which first inner electrodes (1) and second inner electrodes (2) are arranged. First inner electrodes (1) are connected to one another by means of a first outer electrode (10), which extends in a peripheral direction of the base (5). Second inner electrodes (2) are connected to one another in a conductive manner by means of a via hole (4) extending in the axial direction of the base (5). The invention also relates to a method for producing a feedthrough component.
摘要:
The invention relates to a sensor device comprising a flexible first film (1), the first surface of said film comprising structured strip conductors (21, 22). Said sensor device is also provided with a probe (3) which is electrically connected to the structured strip conductors (21, 22) and is arranged in such a way that it lies on the first surface of the first film (1), and a flexible second film (4) which envelops the probe (3) from above in a form-fitting manner and seals the same from the first surface of the first film (1). The invention is advantageous in that the probe head formed in this way does not require an additional housing.
摘要:
A heating module (1) is specified, which comprises a housing (3) with an opening (31) and at PTC ceramic heating element (2) which is arranged in the housing (3). The PTC ceramic heating element (2) has an inner face (21), which faces the opening (31), an outer face (22), which faces away from the opening (31), and two end faces (23, 24), which connect the inner face and the outer face (21, 22). The inner face (21) of the PTC ceramic heating element (2) is at least partially matched to the opening (31). Furthermore a vaporization apparatus (10) having a heating module (1) is specified.
摘要:
The invention relates to a high-frequency swinging choke that comprises at least two rod cores (5, 5') that are arranged next to each other in the longitudinal direction. The rod cores (5, 5') each comprise at least one coil (1, 1'), wherein the coils (1, 1') are connected in series.
摘要:
An anti-theft surveillance system, especially for one or more solar modules, comprises an input for supplying a time-varying control signal, two connecting terminals between which the article to be surveilled is connected, and a switch, controlled by the control signal, for supplying a surveillance signal to one of the connecting terminals. A comparator circuit is coupled to the input and to the other of the two connecting terminals and is used to detect a change in a time profile between the control and the surveillance signal.
摘要:
A capacitor element (1) is provided, comprising a capacitor base body (2) and an encapsulation (3) of the base body (2). The encapsulation (3) is injection-molded directly onto the base body (2). Furthermore, a method for encapsulating a capacitor base body (2) is provided.