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    MATCHING NETWORK FOR TRANSMISSION CIRCUITRY
    4.
    发明授权
    MATCHING NETWORK FOR TRANSMISSION CIRCUITRY 有权

    公开(公告)号：EP2636151B1

    公开(公告)日：2018-11-21

    申请号：EP11781932.6

    申请日：2011-10-28

    申请人： Cree, Inc.

    发明人： HARRIS, Christopher ,  PENGELLY, Raymond Sydney

    IPC分类号： H04B1/04 ,  H03H7/40 ,  H03F1/56

    CPC分类号： H03H7/38 ,  H03F1/0288 ,  H03F1/56 ,  H03F3/24 ,  H03F2200/222 ,  H03F2200/378 ,  H03F2200/387 ,  H03H7/40 ,  H04B1/0458

    摘要： The present disclosure relates to transmission circuitry of a wireless communication device. The transmission circuitry includes power amplifier circuitry, an output matching network, and impedance control circuitry. The power amplifier circuitry amplifies a radio frequency (RF) input signal to provide an amplified RF output signal, which is passed through the output matching network and transmitted via one or more antennas. As the center frequency of the RF input signal and conditions of operating parameters change, the impedance control circuitry adjusts the values of one or more variable impedance elements of the output matching network in a desired fashion. The values of the variable impedance elements are adjusted such that the output matching network concurrently and dynamically presents the desired load impedances at the center frequency and at one or more harmonics of the RF input signal to achieve a given performance specification.

    MMIC POWER AMPLIFIER
    6.
    发明授权
    MMIC POWER AMPLIFIER 有权

    公开(公告)号：EP3014766B1

    公开(公告)日：2018-09-12

    申请号：EP14816830.5

    申请日：2014-06-26

    申请人： Cree, Inc.

    发明人： PRIBBLE, William ,  MILLIGAN, James ,  WOOD, Simon

    IPC分类号： H03F3/195 ,  H03F1/02 ,  H03F1/56

    CPC分类号： H03F3/195 ,  H03F1/0288 ,  H03F1/56 ,  H03F3/245 ,  H03F2200/387 ,  H03H7/383

    摘要： A microwave integrated circuit includes a substrate and a power amplifier on the substrate. The power amplifier includes a power divider circuit having an input configured to receive an input RF signal, a base amplifier having an input coupled to a first output of the power divider circuit and a peaking amplifier having an input coupled to a second output of the power divider circuit and an output coupled to an output combining node. The power amplifier further includes an impedance inverter circuit coupling the output of the base amplifier to the output combining node and a load matching circuit having an input coupled to the output combining node and an output configured to be coupled to a load.

    SEMICONDUCTOR AMPLIFIER BIAS CIRCUIT AND SEMICONDUCTOR AMPLIFIER DEVICE
    8.
    发明授权
    SEMICONDUCTOR AMPLIFIER BIAS CIRCUIT AND SEMICONDUCTOR AMPLIFIER DEVICE 有权

    公开(公告)号：EP3016281B1

    公开(公告)日：2018-08-22

    申请号：EP15175539.4

    申请日：2015-07-06

    申请人： Kabushiki Kaisha Toshiba

    发明人： TAKAGI, Kazutaka

    IPC分类号： H03F1/56 ,  H03F3/193

    CPC分类号： H03F1/0205 ,  H03F1/56 ,  H03F1/565 ,  H03F3/193 ,  H03F2200/222 ,  H03F2200/387 ,  H03F2200/555

    摘要： A semiconductor bias circuit (34) includes a first transmission line (40), a second transmission line (30), means for grounding a fundamental signal and a power supply terminal (39). The second transmission line (30) has an electrical length of 90° at a center frequency of a band. The means for grounding a fundamental signal includes one of a grounded shunt capacitor (32) and an open stub line (31) having an electrical length of 90°. In case of the means including the grounded shunt capacitor (32), the second transmission line (30) includes one end part connected to the first transmission line (40) at a position apart from the output end part (19) by an electrical length of 45°, and the other end part connected to the grounded shunt capacitor (32). In case of the means including the open stub line (31), the open stub line (31) includes one end part connected the second transmission line (30), and other end part made open.

    AMPLIFIER ARCHITECTURE RECONFIGURATION
    10.
    发明公开
    AMPLIFIER ARCHITECTURE RECONFIGURATION 审中-公开
    放大器结构重构

    公开(公告)号：EP3319230A1

    公开(公告)日：2018-05-09

    申请号：EP17196438.0

    申请日：2017-10-13

    申请人： NXP USA, Inc.

    发明人： SZYMANOWSKI, Margaret A. ,  EMBAR, Ramanujam Srinidhi ,  McLAREN, Roy

    IPC分类号： H03F1/02 ,  H03F1/32 ,  H03F1/56 ,  H03F3/24

    CPC分类号： H03F1/0288 ,  H01L21/4825 ,  H03F1/3247 ,  H03F1/56 ,  H03F3/19 ,  H03F3/211 ,  H03F3/245 ,  H03F2200/222 ,  H03F2200/387 ,  H03F2200/451 ,  H03F2203/21103 ,  H03F2203/21106 ,  H03F2203/21142

    摘要： An amplifier includes first, second, and third inputs to receive an RF signal, first and second amplifiers, and an input phase adjustment circuit coupling the first, second, and third inputs to the first and second amplifiers, the input phase adjustment circuit having first and second outputs coupled to the first and second amplifiers, respectively. The input phase adjustment circuit includes a pair of inputs, where the pair of inputs includes the first and second inputs, for the first output and a pair of phase adjustment paths coupling the pair of inputs to the first output, respectively. The pair of phase adjustment paths are configured to adjust a phase of the RF signal differently for the first output.

    摘要翻译： 放大器包括用于接收RF信号的第一，第二和第三输入，第一和第二放大器以及将第一，第二和第三输入耦合到第一和第二放大器的输入相位调整电路，输入相位调整电路具有第一 以及分别耦合到第一和第二放大器的第二输出。 输入相位调整电路包括一对输入端，其中该对输入端包括用于第一输出端的第一和第二输入端以及分别将该对输入端耦合到第一输出端的一对相位调整路径。 该对相位调整路径被配置为针对第一输出不同地调整RF信号的相位。