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    SENSORELEMENT, SENSORANORDNUNG UND VERFAHREN ZUR HERSTELLUNG EINES SENSORELEMENTS
    2.
    发明公开
    SENSORELEMENT, SENSORANORDNUNG UND VERFAHREN ZUR HERSTELLUNG EINES SENSORELEMENTS 审中-公开
    SENSORELEMENT，SENSORANORDNUNG UND VERFAHREN ZUR HERSTELLUNG EINES SENSORELEMENTS

    公开(公告)号：EP3172544A1

    公开(公告)日：2017-05-31

    申请号：EP15738889.3

    申请日：2015-07-14

    申请人： Epcos AG

    发明人： STRALLHOFER, Heinz ,  KIRSTEN, Lutz ,  KLOIBER, Gerald ,  NEUBER, Danilo ,  IHLE, Jan

    IPC分类号： G01K1/08 ,  G01K7/22

    CPC分类号： H01C1/1413 ,  G01K1/08 ,  G01K7/22 ,  H01C7/008

    摘要： Disclosed is a sensor element comprising a ceramic base (2) and at least one electrode (4, 8) which is arranged on the base (2) and which is provided with at least one layer (5) containing nickel. Also disclosed is a method for manufacturing a sensor element (1), wherein at least one layer (5, 6) is sputtered onto a base (2) in order for an electrode (4, 8) to be formed.

    摘要翻译： 公开了一种传感器元件，其包括陶瓷基体（2）和布置在基体（2）上并且设置有至少一个含镍层（5）的至少一个电极（4,8）。 还公开了一种用于制造传感器元件（1）的方法，其中至少一个层（5,6）被溅射到基底（2）上以便形成电极（4,8）。

    TEMPERATURE SENSOR
    4.
    发明公开
    TEMPERATURE SENSOR 有权

    公开(公告)号：EP2894447A4

    公开(公告)日：2016-06-01

    申请号：EP13834457

    申请日：2013-09-03

    申请人： MITSUBISHI MATERIALS CORP

    发明人： NAGATOMO NORIAKI ,  INABA HITOSHI ,  TANAKA HIROSHI ,  TAKESHIMA KAZUTA

    IPC分类号： G01K7/22 ,  G01K13/08 ,  H01C1/14 ,  H01C7/00 ,  H01C7/04

    CPC分类号： G01K7/22 ,  G01K13/08 ,  H01C1/14 ,  H01C1/1413 ,  H01C7/006 ,  H01C7/008 ,  H01C7/04 ,  H01C7/041

    摘要： The temperature sensor is provided with a pair of lead frames, a sensor portion connected to the pair of lead frames, and an insulating holding portion which is fixed to the pair of lead frames and holds the lead frames. The sensor portion is provided with an insulating film; a thin film thermistor portion formed as a pattern on the surface of the insulating film with a thermistor material; a pair of interdigitated electrodes formed as patterns having multiple comb portions and facing each other on the thin film thermistor portion; and a pair of pattern electrodes connected to the pair of interdigitated electrodes and formed as patterns on the surface of the insulating film. The pair of lead frames is extended and adhered to the surface of the insulating film disposing the thin film thermistor portion therebetween and is connected to the pair of pattern electrodes.

    Ceramic electronic component
    5.
    发明公开
    Ceramic electronic component 审中-公开
    Keramisches Elektronikbauteil

    公开(公告)号：EP2410540A1

    公开(公告)日：2012-01-25

    申请号：EP11173108.9

    申请日：2011-07-07

    申请人： Murata Manufacturing Co. Ltd.

    发明人： Yoshida, Akihiro

    IPC分类号： H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01C7/18 ,  H01C1/142 ,  H01F17/00 ,  H01F27/29

    CPC分类号： H01G4/12 ,  H01C1/1406 ,  H01C1/1413 ,  H01C7/18 ,  H01F17/0013 ,  H01F27/292 ,  H01G4/012 ,  H01G4/232 ,  H01G4/30 ,  H01L41/0472

    摘要： A ceramic electronic component (1) includes a first reinforcement layer. The first reinforcement layer (17a) is formed in a first outer layer portion so as to extend in the length direction and in the width direction. Portions of the first reinforcement layer (17a) face a first portion (13a) of a first external electrode (13) and a first portion of a second external electrode in the thickness direction. The first reinforcement layer (17a) is not exposed from a first end surface or a second end surface of the ceramic electronic component. In a portion of a first main surface (10a) of the ceramic electronic component where the first portion (13a) of the first (13) or second external electrode is provided, a portion (10a1) that does not face the first reinforcement layer is closer to the center in the thickness direction than a portion that faces the first reinforcement layer is.

    摘要翻译： 陶瓷电子部件（1）包括第一加强层。 第一加强层（17a）形成在第一外层部分中，以沿长度方向和宽度方向延伸。 第一加强层（17a）的一部分面向厚度方向的第一外部电极（13）的第一部分（13a）和第二外部电极的第一部分。 第一加强层（17a）不从陶瓷电子部件的第一端面或第二端面露出。 在设置第一（13）或第二外部电极的第一部分（13a）的陶瓷电子部件的第一主表面（10a）的一部分中，不面对第一加强层的部分（10a1）是 比与第一加强层相对的部分更靠近中心的厚度方向。

    CONDUCTIVE POLYMER ELECTRONIC DEVICES WITH SURFACE MOUNTABLE CONFIGURATION AND METHODS FOR MANUFACTURING SAME
    6.
    发明公开
    CONDUCTIVE POLYMER ELECTRONIC DEVICES WITH SURFACE MOUNTABLE CONFIGURATION AND METHODS FOR MANUFACTURING SAME 审中-公开
    开展与表面高分子电子设备的安装结构和方法及其制备

    公开(公告)号：EP2014143A2

    公开(公告)日：2009-01-14

    申请号：EP07760729.9

    申请日：2007-04-16

    申请人： Bourns, Inc.

    发明人： BOURNS, Gordon L. ,  CHU, Stelar ,  GRINDELL, Daniel E. ,  HUANG, David ,  KELLY, John ,  MEIJER, Erik

    IPC分类号： H05K1/00

    CPC分类号： H01C7/021 ,  H01C1/016 ,  H01C1/1406 ,  H01C1/1413 ,  H01C7/005 ,  H01C7/028 ,  H01C7/041 ,  H01C7/049 ,  H01C7/18 ,  H01C17/02 ,  H01C17/281 ,  Y10T29/49165

    摘要： Surface-mountable conductive polymer electronic devices include at least one conductive polymer active layer laminated between upper and lower electrodes. Upper and lower insulation layers, respectively, sandwich the upper and lower electrodes. First and second planar conductive terminals are formed on the lower insulation layer. First and second cross-conductors are provided by plated through-hole vias, whereby the cross-conductors connect each of the electrodes to one of the terminals. Certain embodiments include two or more active layers, arranged in a vertically-stacked configuration and electrically connected by the cross-conductors and electrodes in parallel. Several embodiments include at least one cross-conductor having a chamfered or beveled entry hole through the upper insulation layer to provide enhanced adhesion between the cross-conductor and the insulation layer. Several methods for manufacturing the present surface-mountable conductive polymer electronic devices are also provided.

    摘要翻译： 表面安装的导电性高分子的装置包括第一和第二电极，在其上布置的第一和第二绝缘层之间分别一个导电聚合物层。 第一和第二平面的导电端子是第二绝缘层上。 第一横导体的第二电极连接到第一端子，并且由第一绝缘层的一部分与所述第一电极隔开。 第二横导体的第一电极连接到第二端子，并且由所述第二绝缘层的一部分从所述第二电极隔开。 在一些实施方案中，至少一个横导体包括穿过所述第一绝缘层上的倾斜部分，以提供跨导体和第一绝缘层之间的粘附增强，同时允许没有不适当的应力更大的热膨胀。 在其它实施方案中，本文的优点通过具有与所述第一绝缘层上的金属化锚定垫的物理接触的至少一个交叉的导体来实现的。

    KERAMISCHES BAUELEMENT MIT KLIMASTABILER KONTAKTIERUNG
    7.
    发明授权
    KERAMISCHES BAUELEMENT MIT KLIMASTABILER KONTAKTIERUNG 有权
    与空气中稳定接触的陶瓷部件

    公开(公告)号：EP1386331B1

    公开(公告)日：2005-07-27

    申请号：EP01944911.5

    申请日：2001-05-07

    申请人： EPCOS AG

    发明人： SCHRANK, Franz ,  KLOIBER, Gerald

    IPC分类号： H01C1/14

    CPC分类号： H01G4/228 ,  H01C1/14 ,  H01C1/1413

    摘要： The invention relates to a ceramic component with an increased resistance to the environment. A connection mass (V) containing a precious metal is used to connect the electric connections (AL) to the electrodes (E) of the component. The entire component is also covered with a protective casing (S) consisting of a particularly hydrophobic plastic material.

    Method of securing leads to a thermistor
    9.
    发明公开
    Method of securing leads to a thermistor 失效
    Verfahren zum Kontaktieren eines Thermistors an Anschlusselemente。

    公开(公告)号：EP0171877A1

    公开(公告)日：1986-02-19

    申请号：EP85303525.1

    申请日：1985-05-20

    申请人： STC PLC

    发明人： Macklen, Eric Douglas

    IPC分类号： H01C1/144 ,  H01C17/28 ,  H01C7/02 ,  H01C7/04 ,  B23K11/10

    CPC分类号： B23K11/11 ,  H01C1/1406 ,  H01C1/1413 ,  H01C1/144 ,  H01C17/28

    摘要： To make a negative temperature coefficient thermistor, a chip (1) of thermistor material, which may be rectangular or square, is provided with planar metallic, e.g. film, electrodes (2,3) on its two parallel faces. To these electrodes the lead wires (4,5) are attached by parallel gap welding. In this method of welding the welding electrodes are placed on spaced apart points (see the arrows) on the lead. The welding current thus flows partly in the wire but also in the electrode and a weld occurs.
    After the leads are attached the device is encapsulated or sealed into an enclosure as needed.
    The method is also applicable to positive temperature coefficient thermistors.

    摘要翻译： 为了制造负温度系数热敏电阻，可以是矩形或正方形的热敏电阻材料的芯片（1）设置有平面金属，例如， 膜，电极（2,3）在其两个平行的面上。 引线（4,5）通过平行间隙焊接而连接到这些电极。 在这种焊接方法中，焊接电极放置在引线上的间隔开的点（见箭头）上。 因此，焊接电流部分地在电线中流动，但也在电极中发生焊接。 引线连接后，根据需要将设备封装或密封到外壳中。 该方法也适用于正温度系数热敏电阻。