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    LED LAMP WITH HEAT SINK OPTIC
    1.
    发明授权
    LED LAMP WITH HEAT SINK OPTIC 有权
    带散热片的LED灯泡

    公开(公告)号：EP2191198B1

    公开(公告)日：2017-04-26

    申请号：EP08833673.0

    申请日：2008-09-15

    申请人： Osram Sylvania Inc.

    发明人： MEYER, William, E.

    IPC分类号： F21V29/00

    CPC分类号： F21V29/00 ,  F21K9/232 ,  F21K9/64 ,  F21V3/02 ,  F21V3/049 ,  F21V3/10 ,  F21V5/00 ,  F21V5/045 ,  F21V7/0008 ,  F21V13/14 ,  F21V17/06 ,  F21V29/506 ,  F21V29/85 ,  F21Y2115/10

    摘要： An LED lamp may be made with a heat sink optic. The lamp has a base having a first electrical contact and a second electrical contact for receiving current. At least one LED is mounted on a thermally conductive support; that supports electrical connections for the LED and provides thermal conduction of heat from the LED to the optic. The LED support mounted in the base and electrically coupled through the first electrical contact to electrical current. The light transmissive, and heat diffusing optic has an external an internal wall defining a cavity with the LED positioned in the cavity. The optic is in thermal contact with the LED support and mechanically coupled to the base. The snap together structure enables rapid manufacture while allowing numerous variations.

    摘要翻译： LED灯可以由散热片制成。 该灯具有基座，该基座具有用于接收电流的第一电触点和第二电触点。 至少一个LED安装在导热支架上; 其支持LED的电连接并且提供从LED到光学器件的热量的热传导。 LED支架安装在底座中并通过第一电触点电耦合到电流。 透光且热扩散镜片具有限定腔的外部内壁，LED定位在腔中。 光学元件与LED支架热接触并机械耦合到基座。 搭扣结构可以实现快速制造，同时允许多种变化。