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1.发明公开Tool, method and machine for manufacturing multilayer printed circuit boards 有权Werkzeug，Verfahren undGerätzur Herstellung mehrlagiger Verdrahtungsplatinen
公开(公告)号：EP2693853A1
公开(公告)日：2014-02-05
申请号：EP12382312.2
申请日：2012-08-02
CPC分类号： H05K3/0097 , B23K13/01 , H05K3/4638 , H05K13/0069 , H05K2203/0165 , H05K2203/101 , Y10T29/53265
摘要： The invention relates to a tool for supporting multilayer printed circuit boards during manufacture comprising a frame in which there is fixed a pretensed, non-electrically conductive fabric which has a thickness less than 0.1 mm and can be accessed by its two faces. The present tool allows the induction bonding of the mentioned layers at internal points of the bundle following a method in which said bundle is placed on the tool of the invention and at least one of the welding electrodes used in the welding operation is applied on the lower face of a fabric of the tool supporting the bundle. A machine especially suitable for putting the method into practice comprises C-shaped magnetic cores the arms of which are long enough to reach the internal points of the bundle.
摘要翻译： 本发明涉及一种用于在制造过程中支撑多层印刷电路板的工具，其包括框架，其中固定有厚度小于0.1mm并且可由其两个面访问的预注射非导电织物。 本工具允许按照将所述束放置在本发明的工具上的方法将所述层的感应结合在束的内部点处，并且用于焊接操作的焊接电极中的至少一个施加在下部 面对支撑束的工具的织物。 特别适用于实施该方法的机器包括C形磁芯，其臂足够长以到达束的内部点。
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2.发明公开METHOD OF SOLDERING THE CONSTITUENT LAYERS OF A MULTILAYER PRINTED CIRCUIT AND THE MACHINE USED FOR SAME 有权方法焊接的层组分的多层电路板与ENSURE二手机械
公开(公告)号：EP1460890A1
公开(公告)日：2004-09-22
申请号：EP02732775.8
申请日：2002-05-27
CPC分类号： H05K1/0212 , B32B37/0084 , B32B37/065 , B32B2310/0812 , B32B2457/08 , H05K3/4638 , H05K2203/065 , H05K2203/101
摘要： Procedure for soldering the constituent layers of a multilayer printed circuit and machine for performing it.
The procedure is applicable to circuits made up of layers containing the circuit image (2, 3, 4, 5,) that have perimetral strips (9) including reserve areas (11), superimposed and separated from each other by isolating layers (6, 7 and 8). The procedure includes the following steps: i) place a heater circuit (13) composed of a flat winding with at least one turn in short-circuit (14) in each reserve area (11); ii) superimpose the layers that contain the circuit image (2, 3, 4, 5,) and the isolating layers (6, 7 and 8) in alternating order; iii) secure the position of the layers relative to the others, thereby creating groups (12) of reserve areas (11); iv) place induction electrodes (18) over the groups (12) of reserve areas; v) soldering each one of the groups (12) by application of a magnetic field of variable induction.摘要翻译： 程序用于焊接的多层印刷电路和机器的构成层，用于执行它。 的程序适用于包含在电路图像（2，3，4，5，）层的由电路thathave周界带（9）包括备用区域（11），叠加并通过隔离彼此分离 层（6，7和8）。 该程序包括以下步骤：i）将一个加热器电路（13）的平坦的组成与在每个保留区域（11）短路（14）的至少一匝绕组; ⅱ）叠加层确实含有电路的图像（2，3，4，5，）和隔离层（6，7和8）以交替的顺序; ⅲ）固定相对于其他层的位置，由此产生的储备区域的组（12）（11）; ⅳ）代替感应电极（18）在保留区的组（12）; v）的焊接组（12）由可变感应的磁场的应用中的每一个。
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3.发明授权PROCESS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AND A MACHINE FOR THIS PURPOSE 有权制造印刷电路板的方法和用于此目的的机器
公开(公告)号：EP1609340B1
公开(公告)日：2018-05-09
申请号：EP04716227.6
申请日：2004-03-02
IPC分类号： H05K3/46
CPC分类号： B32B15/14 , B32B37/04 , B32B37/06 , B32B2260/021 , B32B2260/046 , B32B2309/68 , B32B2310/0812 , B32B2457/08 , H05K3/022 , H05K3/4611 , H05K2203/101 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155
摘要： Process and machine for manufacturing printed circuit boards wherein a press packet comprised of at least two press plates of metal material between which is arranged a printed circuit board composition formed by one or more metal sheets, by one or more layers of insulating material impregnated with polymerizable resins and/or by one or more printed circuit boards with an engraved image of a circuit, are arranged between the press plates of a press and is pressed, subjecting said press packet to the action of a variable induction magnetic field which generates induced currents in each metal plate and sheet of the press packet, causing the heating of said plates and sheets, in turn causing the heating by thermal conduction of the layers of insulating material, melting and liquefying the resins in said layers of insulating material and adhering the insulating material to the metal sheets, so that, on raising the temperature even more, the polymerizable resins in the layers of insulating material are then polymerized, resulting, after the cooling of the press packet, in one or more rigid boards suitable for making printed electronic circuits. The machine to carry out the above process comprises a variable induction magnetic field generating device adapted to generate induced currents in the press packet's metal plates and sheets, causing them to heat, and means of controlling the operation of the magnetic field generating device and controlling the temperature and pressure to which the press packet is subjected.
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4.发明公开ELECTRODE FOR MACHINE FOR ELECTROMAGNETIC INDUCTION WELDING OF THE LAYERS FORMING A MULTI-LAYER PRINTED CIRCUIT 有权电极用于机器用于电磁感应焊接的多层电路板的层; 感应装置用于机电磁感应焊这样的电极
公开(公告)号：EP1628799A1
公开(公告)日：2006-03-01
申请号：EP04725629.2
申请日：2004-05-03
CPC分类号： B23K35/0205 , B23K13/00 , B23K2201/42 , H05B6/10 , H05B6/365 , H05K3/4638 , H05K2203/065
摘要： The machine (1) comprise at least one U-shaped magnetic circuit (2) provided with a field winding (3), comprising at the outer end of each arm of the magnetic circuit (2) one respective induction electrode (5s, 5i), both electrodes being perpendicularly arranged as regards the multi-layer printed circuit, coaxially to each other ans capable-of vertical movement in both directions. the end of each induction electrode (5s, 5i) that comes into contact with the multi-layer printed circuit is provided with a thermal barrier, in order to prevent, during the welding, heat transmission by thermal conductivity from the welding zone to the induction electrode (5s,5i).
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5.发明公开PROCESS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AND A MACHINE FOR THIS PURPOSE 有权VERFAHREN UND VORRICHTUNG ZUR HERSTELLUNG VON LEITERPLATTEN
公开(公告)号：EP1609340A1
公开(公告)日：2005-12-28
申请号：EP04716227.6
申请日：2004-03-02
CPC分类号： B32B15/14 , B32B37/04 , B32B37/06 , B32B2260/021 , B32B2260/046 , B32B2309/68 , B32B2310/0812 , B32B2457/08 , H05K3/022 , H05K3/4611 , H05K2203/101 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155
摘要： Process and machine for manufacturing printed circuit boards wherein a press packet comprised of at least two press plates of metal material between which is arranged a printed circuit board composition formed by one or more metal sheets, by one or more layers of insulating material impregnated with polymerizable resins and/or by one or more printed circuit boards with an engraved image of a circuit, are arranged between the press plates of a press and is pressed, subjecting said press packet to the action of a variable induction magnetic field which generates induced currents in each metal plate and sheet of the press packet, causing the heating of said plates and sheets, in turn causing the heating by thermal conduction of the layers of insulating material, melting and liquefying the resins in said layers of insulating material and adhering the insulating material to the metal sheets, so that, on raising the temperature even more, the polymerizable resins in the layers of insulating material are then polymerized, resulting, after the cooling of the press packet, in one or more rigid boards suitable for making printed electronic circuits. The machine to carry out the above process comprises a variable induction magnetic field generating device adapted to generate induced currents in the press packet's metal plates and sheets, causing them to heat, and means of controlling the operation of the magnetic field generating device and controlling the temperature and pressure to which the press packet is subjected.
摘要翻译： 用于制造印刷电路板的工艺和机器，其中由至少两个金属材料压板组成的压力分布器，其间布置有由一个或多个金属板形成的印刷电路板组合物，所述绝缘材料浸渍有可聚合的 树脂和/或一个或多个印刷电路板，其具有电路的雕刻图像，被布置在印刷机的压板之间并被压制，使所述印刷包受到产生感应电流的可变感应磁场的作用 每个金属板和压片的片材，导致所述板和片材的加热，从而导致绝缘材料层的热传导的加热，熔化和液化所述绝缘材料层中的树脂并粘附绝缘材料 使得在提高温度的情况下，绝缘层中的可聚合树脂 然后将材料聚合，导致在压制包装冷却之后，在适于制造印刷电子电路的一个或多个刚性板中。 执行上述处理的机器包括可变感应磁场产生装置，适于在压力分组的金属板和片材中产生感应电流，使其发热，以及控制磁场产生装置的操作的装置，并控制 温度和压力的压力。
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6.发明授权
公开(公告)号：EP2693853B1
公开(公告)日：2015-03-25
申请号：EP12382312.2
申请日：2012-08-02
CPC分类号： H05K3/0097 , B23K13/01 , H05K3/4638 , H05K13/0069 , H05K2203/0165 , H05K2203/101 , Y10T29/53265
摘要： The invention relates to a tool for supporting multilayer printed circuit boards during manufacture comprising a frame in which there is fixed a pretensed, non-electrically conductive fabric which has a thickness less than 0.1 mm and can be accessed by its two faces. The present tool allows the induction bonding of the mentioned layers at internal points of the bundle following a method in which said bundle is placed on the tool of the invention and at least one of the welding electrodes used in the welding operation is applied on the lower face of a fabric of the tool supporting the bundle. A machine especially suitable for putting the method into practice comprises C-shaped magnetic cores the arms of which are long enough to reach the internal points of the bundle.
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7.发明授权
公开(公告)号：EP1628799B1
公开(公告)日：2007-07-18
申请号：EP04725629.2
申请日：2004-05-03
CPC分类号： B23K35/0205 , B23K13/00 , B23K2201/42 , H05B6/10 , H05B6/365 , H05K3/4638 , H05K2203/065
摘要： The machine (1) comprise at least one U-shaped magnetic circuit (2) provided with a field winding (3), comprising at the outer end of each arm of the magnetic circuit (2) one respective induction electrode (5s, 5i), both electrodes being perpendicularly arranged as regards the multi-layer printed circuit, coaxially to each other ans capable-of vertical movement in both directions. the end of each induction electrode (5s, 5i) that comes into contact with the multi-layer printed circuit is provided with a thermal barrier, in order to prevent, during the welding, heat transmission by thermal conductivity from the welding zone to the induction electrode (5s,5i).
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8.发明授权METHOD OF SOLDERING THE CONSTITUENT LAYERS OF A MULTILAYER PRINTED CIRCUIT AND THE MACHINE USED FOR SAME 有权方法焊接的层组分的多层电路板与ENSURE二手机械
公开(公告)号：EP1460890B1
公开(公告)日：2005-05-04
申请号：EP02732775.8
申请日：2002-05-27
CPC分类号： H05K1/0212 , B32B37/0084 , B32B37/065 , B32B2310/0812 , B32B2457/08 , H05K3/4638 , H05K2203/065 , H05K2203/101
摘要： The invention relates to a method of soldering the constituent layers of a multilayer printed circuit and the machine used for same. The inventive method can be used for circuits of the type consisting of layers having a circuit image (2, 3, 4, 5) which are provided with peripheral strips (9) comprising reserve areas (11), said circuit image layers being stacked and separated from one another by isolating layers (6, 7, 8). Said method comprises the following steps: i) providing a heating circuit (13) in each reserve area (11), said heating circuit consisting of at least one short circuited turn (14); ii) stacking the circuit image layers (2, 3, 4, 5) and the isolating layers (6, 7, 8) in an alternating manner; iii) fixing the position of the layers (2, 3, 4, 5, 6, 7, 8) in relation to one another, the reserve areas (11) forming groups (12) of reserve areas; iv) providing induction electrodes (18) which rest on the groups (12) of reserve areas; and v) soldering each of said groups (12) by applying a variable-induction magnetic field.
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