公开(公告)号：EP0740598B1

公开(公告)日：2005-03-23

申请号：EP95907448.5

申请日：1995-01-12

申请人： DYNATEX INTERNATIONAL (INC.)

发明人： TURNER, James, R.

IPC分类号： B26F3/00

CPC分类号： B28D5/0023 ,  B26F3/002 ,  B28D5/0011 ,  Y10T83/0356 ,  Y10T225/321 ,  Y10T225/325 ,  Y10T225/371

摘要： Apparatus for automatic scribing and breaking of semiconductor wafers wherein scribing is performed at a scribing station (S) and the scribed wafer transported in the X direction to a breaking station (B) on an X-Y table (3, 9). Scribing and breaking of parallel lines is accomplished by transporting the wafer step-wise in the Y direction by the Y table (3). Rotation of the wafer for scribing and breaking along sets of lines perpendicular to one another is accomplished by a theta table (18) carried on the Y table (3). An impulse bar (28) is carried by the X table (9) for applying force to the bottom surface of the wafer during both scribing and breaking. Scribing and breaking parameters needed to scribe and break the wafer are entered into computer memory and operated upon by computer controls to automate the scribing and/or breaking process.

公开(公告)号：EP0740598A1

公开(公告)日：1996-11-06

申请号：EP95907448.0

申请日：1995-01-12

申请人： DYNATEX INTERNATIONAL (INC.)

发明人： TURNER, James, R.

IPC分类号： B26F3 ,  B28D5

CPC分类号： B28D5/0023 ,  B26F3/002 ,  B28D5/0011 ,  Y10T83/0356 ,  Y10T225/321 ,  Y10T225/325 ,  Y10T225/371

摘要： Apparatus for automatic scribing and breaking of semiconductor wafers wherein scribing is performed at a scribing station (S) and the scribed wafer transported in the X direction to a breaking station (B) on an X-Y table (3, 9). Scribing and breaking of parallel lines is accomplished by transporting the wafer step-wise in the Y direction by the Y table (3). Rotation of the wafer for scribing and breaking along sets of lines perpendicular to one another is accomplished by a theta table (18) carried on the Y table (3). An impulse bar (28) is carried by the X table (9) for applying force to the bottom surface of the wafer during both scribing and breaking. Scribing and breaking parameters needed to scribe and break the wafer are entered into computer memory and operated upon by computer controls to automate the scribing and/or breaking process.

公开(公告)号：EP0740598A4

公开(公告)日：1997-04-23

申请号：EP95907448

申请日：1995-01-12

申请人： DYNATEX INTERNATIONAL INC

发明人： TURNER JAMES R

IPC分类号： B26F3/00 ,  B28D5/00

CPC分类号： B28D5/0023 ,  B26F3/002 ,  B28D5/0011 ,  Y10T83/0356 ,  Y10T225/321 ,  Y10T225/325 ,  Y10T225/371

摘要： Apparatus for automatic scribing and breaking of semiconductor wafers wherein scribing is performed at a scribing station (S) and the scribed wafer transported in the X direction to a breaking station (B) on an X-Y table (3, 9). Scribing and breaking of parallel lines is accomplished by transporting the wafer step-wise in the Y direction by the Y table (3). Rotation of the wafer for scribing and breaking along sets of lines perpendicular to one another is accomplished by a theta table (18) carried on the Y table (3). An impulse bar (28) is carried by the X table (9) for applying force to the bottom surface of the wafer during both scribing and breaking. Scribing and breaking parameters needed to scribe and break the wafer are entered into computer memory and operated upon by computer controls to automate the scribing and/or breaking process.