DISPOSITIF DE MICROSTRUCTURATION DE SURFACE
    4.
    发明公开
    DISPOSITIF DE MICROSTRUCTURATION DE SURFACE 审中-公开
    DISPOSITIF德微观结构表面

    公开(公告)号:EP1779200A1

    公开(公告)日:2007-05-02

    申请号:EP05783993.8

    申请日:2005-07-01

    IPC分类号: G03F7/20 H01L21/00

    摘要: The invention concerns a device for microstructuring the surface of at least one substrate characterized in that it comprises a support frame (2) including at least means (6) for conveying the substrate (S) comprising preferably means (15) for supporting the substrate adapted to maintain the substrate in or relative to each of the modules so as to avoid any change of support when the substrate is shifted from one module to the other, a module for applying a photosensitive resin layer on the substrate, a module (20) for automatic exposure using a laser beam of the resin layer on the substrate based on a programmed scheme, a so-called developing module for removing the part of the resin layer which has been exposed of the part or the resin layer which has not been exposed, a module for chemically etching the substrate, a module for cleaning the substrate, and a control unit (7).

    摘要翻译: 本发明涉及一种用于对至少一个基底的表面进行微结构化的装置,其特征在于其包括至少包括用于输送基底(S)的装置(6)的支撑框架(2),优选地包括用于支撑基底的装置(15) 将衬底保持在或相对于每个模块,以便当衬底从一个模块移动到另一个模块时避免支撑的任何变化,用于在衬底上施加光敏树脂层的模块,用于模块(20)的模块 基于编程方案使用基板上的树脂层的激光束进行自动曝光,所谓的显影模块用于去除已曝光的部分树脂层或未曝光的树脂层, 用于化学蚀刻衬底的模块,用于清洁衬底的模块以及控制单元(7)。