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23 条记录 (耗时 0.015 秒)

    CLEANING AGENT
    1.
    发明公开
    CLEANING AGENT 有权
    清洗剂

    公开(公告)号：EP1688477A1

    公开(公告)日：2006-08-09

    申请号：EP04819365.0

    申请日：2004-11-24

    申请人： KISHIMOTO SANGYO CO., LTD. ,  Fine Polymers Corporation

    发明人： SUGA, S., FINE POLYMERS CORP. ,  KAMON, S., FINE POLYMERS CORP. ,  YATA, T., KISHIMOTO SANGYO CO., LTD. ,  TERAI, A., KISHIMOTO SANGYO CO., LTD.

    IPC分类号： C11D7/08 ,  C11D7/18 ,  C11D7/32 ,  C11D17/08

    CPC分类号： C11D11/0047 ,  C11D7/06 ,  C11D7/08 ,  C11D7/3209

    摘要： The invention has for its object the provision of a cleaner capable of removing particles and metal impurities present on the surface of a wafer without corrosion of wirings, gates or the like yet at normal temperature in a short period of time and with a one-pack type solution. To accomplish the above object, the invention provides a cleaner that is an aqueous solution containing phosphoric acid, hydrofluoric acid, and ammonia and/or amine, and having a pH ranging from 2 to 12, wherein the aqueous solution comprises 0.5 to 25 mass% of phosphoric acid, 0.1 to 10 mass% of ammonia and/or amine, and 5×10 -3 to 5.0 mass% of hydrofluoric acid.

    摘要翻译： 本发明的目的在于提供一种清洁器，该清洁器能够在短时间内在常温下和单包装中去除存在于晶片表面上的颗粒和金属杂质而不会腐蚀布线，浇口等 型解决方案。 为实现上述目的，本发明提供了一种清洁剂，其为含有磷酸，氢氟酸和氨和/或胺且pH范围为2至12的水溶液，其中所述水溶液包含0.5至25质量％ 的磷酸，0.1〜10质量％的氨和/或胺，以及5×10-3〜5.0质量％的氢氟酸。

    Flame retardant polyamide composition
    3.
    发明公开
    Flame retardant polyamide composition 失效
    Flammhemmende Polyamid-Zusammensetzung。

    公开(公告)号：EP0592942A1

    公开(公告)日：1994-04-20

    申请号：EP93116210.1

    申请日：1993-10-07

    申请人： KISHIMOTO SANGYO CO., LTD.

    发明人： Moriwaki, Takeshi, Kishimoto Sangyo Co., Ltd.

    IPC分类号： C08L77/00 ,  C08K7/14 ,  C08K3/02

    CPC分类号： C08L77/00 ,  C08K3/02 ,  C08K7/14 ,  C08L2666/14 ,  C08L61/04

    摘要： Halogen free non-dripping flame retardant polyamide composition comprising 100 weight parts of the mixture of 95-70 weight parts of aliphatic crystalline polyamide and 5-30 weight parts of semi-aromatic amorphous polyamide, 5-15 weight parts of flame retardant, 0-100 weight parts of glass fiber, 0-400 weight parts of high density filler, or 100 weight parts of the mixture of 60-90 weight parts of aliphatic crystalline polyamide, 5-20 weight parts of semi-aromatic amorphous polyamide and 5-20 weight parts of phenolic resin, 5-15 weight parts of red phosphorus, 0-100 weight parts of glass fiber, 0-400 weight parts of high density filler.

    摘要翻译： 含有100重量份95-70重量份脂族结晶聚酰胺和5-30重量份半芳族无定形聚酰胺的混合物，5-15重量份阻燃剂，0- 100重量份玻璃纤维，0-400重量份高密度填料或100重量份60-90重量份脂族结晶聚酰胺，5-20重量份半芳族无定形聚酰胺和5-20重量份的混合物 酚醛树脂重量份，红磷5-15重量份，玻璃纤维0-100重量份，高密度填料0-400重量份。

    Polymer thin film, its production method, binder for bio chip, bio chip, and its production method
    4.
    发明公开
    Polymer thin film, its production method, binder for bio chip, bio chip, and its production method 有权
    薄的聚合物层，制造过程中，对于有机芯片，生物芯片和过程及其制备粘合剂

    公开(公告)号：EP1260542A1

    公开(公告)日：2002-11-27

    申请号：EP02253423.4

    申请日：2002-05-16

    申请人： Kishimoto Sangyo Co., Ltd.

    发明人： Nakamura, Eiichi, c/o Kishimoto Sangyo Co. Ltd. ,  Shibayama, Kenichi, c/o Kishimoto Sangyo Co. Ltd. ,  Maruyama, Hiroshi, c/o Daisankasei Co., Ltd. ,  Inoue, Takashi, c/o Daisankasei Co., Ltd.

    IPC分类号： C08J5/18 ,  C08G61/02 ,  C09D165/04 ,  C12Q1/68 ,  B05D7/24

    CPC分类号： B05D1/60 ,  C08G61/02 ,  C08G61/025 ,  C08G2261/3424 ,  C08J5/18 ,  C08J2365/04 ,  Y10T428/29 ,  Y10T428/31504

    摘要： This invention provides a polymer thin film which is useful as a substrate for immobilizing a histocompatibility-imparting agent, an immunosuppressive agent, a bioreaction suppressive agent, or the like, and which can be used in imparting biocompatibility; its production method; a binder for a bio chip wherein loss of probe and sample substances in the washing step has been reduced to realize efficient use of such probe and sample; and its production method. In the present invention, the starting material represented by the following structural formula (I) is evaporated and heated to bring the material into monomer form. The material is then introduced into a vacuum deposition chamber maintained at a predetermined degree of vacuum wherein the material is deposited and polymerized on a substrate to obtain the polymer thin film. This polymer thin film is also used in producing the bio chip.
    wherein R 11 and R 12 independently represent -CH 2 NH 2 group or H, and at least one of the R 11 and R 12 is -CH 2 NH 2 group.

    摘要翻译： 本发明提供一种聚合物薄膜，其全部作为用于固定组织相容性赋予剂，免疫抑制剂，生物反应抑制剂，或类似的一个基板是有用的，并且可以在赋予生物相容性使用; 其生产方法; 对于在洗涤步骤中的样品和样品的物质的生物芯片worin损失的粘结剂已降低到实现高效利用搜索探针和样品的; 及其制造方法。 在本发明中，由以下结构式（I）表示的起始原料被蒸发并加热到使材料成单体形式。然后将该材料引入保持在预定的真空度的真空沉积腔室worin所述材料是 沉积并聚合在衬底以得到聚合物薄膜。 因此，该聚合物薄膜是用来在生产生物芯片。 worin R11和R12表示-CH 2 NH 2unabhängig基或H，和R 11中的至少一个，并且R 12是-CH 2 NH 2基团。

    Polyamide composition and the use
    6.
    发明公开
    Polyamide composition and the use 失效
    Polyamidzusammensetzung und Verwendung。

    公开(公告)号：EP0592941A2

    公开(公告)日：1994-04-20

    申请号：EP93116209.3

    申请日：1993-10-07

    申请人： KISHIMOTO SANGYO CO., LTD.

    发明人： Moriwaki, Takeshi, Kishimoto Sangyo Co., Ltd.

    IPC分类号： C08L77/00

    CPC分类号： C08L77/00 ,  C08L61/06 ,  C08L2666/02 ,  C08L61/04

    摘要： Polyamide composition comprising 70-95 weight % of aliphatic polyamide, 5-30 weight % of phenolic resin, and 0-20 % of semi-aromatic amorphous polyamide, and further high density polyamide composition comprising 100 parts by weight of the mixture of 60-95 parts by weight of aliphatic crystalline polyamide, 5-30 parts by weight of phenolic resin, and 200-1000 parts by weight of metal powder or metal oxide powder or inorganic filler having specific gravity of more than 2.6.

    摘要翻译： 包含70-95重量％脂肪族聚酰胺，5-30重量％酚醛树脂和0-20％半芳族无定形聚酰胺的聚酰胺组合物，以及另外的高密度聚酰胺组合物，其包含100重量份的60- 脂肪族结晶性聚酰胺95重量份，酚醛树脂5-30重量份，比重2.6以上的金属粉末或金属氧化物粉末或无机填料200〜1000重量份。

    METHOD FOR MANUFACTURING GLASS FIBER-REINFORCED RESIN MOLDINGS
    9.
    发明公开
    METHOD FOR MANUFACTURING GLASS FIBER-REINFORCED RESIN MOLDINGS 审中-公开
    VERFAHREN ZUR HERSTELLUNG VON MIT GLASFASERNVERSTÄRKTENKUNSTSTOFFGEGENSTÄNDEN

    公开(公告)号：EP1090946A1

    公开(公告)日：2001-04-11

    申请号：EP99922497.5

    申请日：1999-05-26

    申请人： Kishimoto Sangyo Co., Ltd.

    发明人： MORIWAKI, Takeshi, Kishimoto Sangyo Co., Ltd. ,  SAKAGUCHI, Toshiharu, Kishimoto Sangyo Co., Ltd.

    IPC分类号： C08J5/10 ,  B29B11/16 ,  B29C70/06 ,  B29C45/00

    CPC分类号： B29C45/0005 ,  C08J3/201

    摘要： In manufacturing glass fiber-reinforced resin moldings, it is important to uniformly disperse glass fibers in a resin. However, if the resin and glass fiber are strongly kneaded for the above purpose, the glass fibers may be finely cut, causing a problem that the reinforcing function of the glass fibers becomes insufficient.
    According to the present invention, a peroxide is mixed into a molding material prepared by mixing glass fibers with a thermoplastic resin, and such a molding material is molded. For example, the peroxide is fed together with the molding material in an injection molding machine, the molding material is heated and kneaded in the molding machine, and the glass fiber mixed molten resin is injected into a mold to obtain a molded body.

    摘要翻译： 在制造玻璃纤维增​​强树脂模制品时，重要的是将玻璃纤维均匀地分散在树脂中。 然而，如果为了上述目的强力捏合树脂和玻璃纤维，玻璃纤维可能被细切，导致玻璃纤维的增强功能不足的问题。 根据本发明，将过氧化物混合到通过将玻璃纤维与热塑性树脂混合制备的成型材料中，并且模制这种成型材料。 例如，将过氧化物与成型材料一起在注塑机中进料，将成型材料在成型机中加热混炼，将玻璃纤维混合熔融树脂注入模具中，得到成形体。