摘要:
The present invention discloses a CMP pad dresser which has a plurality of uniformly spaced abrasive particles (180) protruding therefrom. The abrasive particles (180) are super hard materials, and are typically diamond, polycrystalline diamond (PCD), cubic boron nitride (cBN), or polycrystalline cubic boron nitride (PcBN). The abrasive particles (180) are attacked to a substrate (40) which may be then coated with an additional anti-corrosive layer (130). The anti-corrosive layer (130) is usually a diamond or diamond-like carbon which is coated over the surface of the disk to prevent erosion of the brazing alloy (90) by the chemical slurry used in conjunction with the CMP pad. This immunity to chemical attack allows the CMP pad dresser to dress the pad while it is polishing a workpiece. In addition to even spacing on the substrate (40), the abrasive particles (180) extend for a uniform distance away from the substrate (40), allowing for even grooming or dressing of a CMP pad both in vertical and horizontal directions. A method of producing such a CMP pad dresser is also disclosed.
摘要:
The present invention discloses a CMP pad dresser which has a plurality of uniformly spaced abrasive particles (180) protruding therefrom. The abrasive particles (180) are super hard materials, and are typically diamond, polycrystalline diamond (PCD), cubic boron nitride (cBN), or polycrystalline cubic boron nitride (PcBN). The abrasive particles (180) are attacked to a substrate (40) which may be then coated with an additional anti-corrosive layer (130). The anti-corrosive layer (130) is usually a diamond or diamond-like carbon which is coated over the surface of the disk to prevent erosion of the brazing alloy (90) by the chemical slurry used in conjunction with the CMP pad. This immunity to chemical attack allows the CMP pad dresser to dress the pad while it is polishing a workpiece. In addition to even spacing on the substrate (40), the abrasive particles (180) extend for a uniform distance away from the substrate (40), allowing for even grooming or dressing of a CMP pad both in vertical and horizontal directions. A method of producing such a CMP pad dresser is also disclosed.
摘要:
A diamond substrate and a method for fabricating the same are provided, wherein a protection layer is formed on one surface of a diamond layer in the process of forming the diamond layer by chemical vapor deposition process, for reducing the deformation of the diamond layer. Thereby the deformation of diamond substrate falls within the range of permitted tolerance of deformation, so that the performance of the diamond substrate is enhanced.
摘要:
A diamond substrate and a method for fabricating the same are provided wherein a SiC layer is formed on a lower surface of a diamond layer for preventing the diamond layer from being deformed after the process of forming the diamond substrate, and then a semiconductor layer is formed on the diamond layer or directly formed on the surface of the SiC layer. Thereby, the lattice mismatch between the diamond film layer and the semiconductor layer is mitigated by the SiC layer, and the crystalline quality of the semiconductor layer is improved, the fabricating process of the diamond substrate is simplified, and the performance and stability are enhanced.
摘要:
The present invention discloses a CMP pad dresser which has a plurality of uniformly spaced abrasive particles (180) protruding therefrom. The abrasive particles (180) are super hard materials, and are typically diamond, polycrystalline diamond (PCD), cubic boron nitride (cBN), or polycrystalline cubic boron nitride (PcBN). The abrasive particles (180) are attacked to a substrate (40) which may be then coated with an additional anti-corrosive layer (130). The anti-corrosive layer (130) is usually a diamond or diamond-like carbon which is coated over the surface of the disk to prevent erosion of the brazing alloy (90) by the chemical slurry used in conjunction with the CMP pad. This immunity to chemical attack allows the CMP pad dresser to dress the pad while it is polishing a workpiece. In addition to even spacing on the substrate (40), the abrasive particles (180) extend for a uniform distance away from the substrate (40), allowing for even grooming or dressing of a CMP pad both in vertical and horizontal directions. A method of producing such a CMP pad dresser is also disclosed.