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    PRODUCTION METHOD AND PRODUCTION DEVICE FOR STEREOSCOPIC DECORATION PIECE MADE OF THERMOPLASTIC SYNTHETIC RESIN
    2.
    发明公开
    PRODUCTION METHOD AND PRODUCTION DEVICE FOR STEREOSCOPIC DECORATION PIECE MADE OF THERMOPLASTIC SYNTHETIC RESIN 有权
    HERSTELLUNGSVERFAHREN UND HERSTELLUNGSVORRICHTUNGFÜREIN STEREOSKOPISCHES ZIERTEIL AUS THERMOPLASTISCHEM KUNSTHARZ

    公开(公告)号：EP2578382A4

    公开(公告)日：2017-01-04

    申请号：EP10852510

    申请日：2010-06-02

    申请人： KURODA NOBUO ,  KUWAHARA EIJI

    发明人： KUWAHARA EIJI

    IPC分类号： B29C43/40 ,  B29C35/08 ,  B29C59/02 ,  B29C65/04 ,  B29C65/74

    CPC分类号： B29C65/04 ,  B29C35/12 ,  B29C43/40 ,  B29C43/52 ,  B29C59/02 ,  B29C59/026 ,  B29C59/16 ,  B29C65/366 ,  B29C65/3676 ,  B29C65/7441 ,  B29C66/1122 ,  B29C66/30621 ,  B29C66/433 ,  B29C66/4724 ,  B29C66/71 ,  B29C66/72328 ,  B29C66/73921 ,  B29C66/81415 ,  B29C66/81427 ,  B29C66/81431 ,  B29C66/81457 ,  B29C66/8322 ,  B29C2035/0811 ,  B29L2031/722 ,  B29L2031/744 ,  B44C1/005 ,  Y10T156/1039 ,  B29K2027/06 ,  B29K2075/00 ,  B29K2067/00 ,  B29K2023/00

    摘要： It is an object of the invention to provide a method and an apparatus for producing a three-dimensional decoration piece which do not damage the tacky bonding or adhesion strength of the lower layer material of the decoration piece. The method comprises putting an upper layer material (11a, 12a) on a first table (31) operating as cathode; lowering an upper mold (21) operating as anode onto the first table (31) to press the upper layer material (11a), emitting a high frequency wave for induction heating, to form a three-dimensionally formed body (14b) from the upper layer material (11a) by molding and fusion-cutting and temporarily holding the three-dimensionally formed body (14b) to the upper mold; stopping the high frequency induction heating; moving a second table (41) carrying a lower layer material (13 a) having a tacky bonding property to below the upper mold (21) temporarily holding the three-dimensionally formed body (14b); and lowering said upper mold (21) onto the second table (41) to press the three-dimensionally formed body (14b), cutting the lower layer material (13a) and tacky bonding the three-dimensionally formed body (14b) and the lower layer material (13a). In the apparatus, the second table (41) or the lower mold (42) is provided on the top surface thereof with recessed sections (43), each of which being transversally and inwardly separated from a position where an edge of the first machining means (22) contacts, by 0.2mm to 1mm; and a cushion member (51) being arranged in the respective recessed sections (43).

    摘要翻译： 本发明的目的是提供一种用于制造三维装饰件的方法和装置，其不会损坏装饰件的下层材料的粘合或粘合强度。 该方法包括将上层材料（11a，12a）放置在作为阴极工作的第一台（31）上; 将作为阳极工作的上模（21）下降到第一工作台（31）上以按压上层材料（11a），发射用于感应加热的高频波，以从上部形成三维成形体（14b） 通过成型和熔融切割并将三维成形体（14b）临时保持在上模上; 停止高频感应加热; 将具有粘合性的下层材料（13a）的第二工作台（41）移动到暂时保持三维成形体（14b）的上模具（21）的下方; 并将所述上模（21）下降到所述第二工作台（41）上以按压所述三维成形体（14b），切割所述下层材料（13a）并使所述三维成形体（14b）和所述下模 层材料（13a）。 在该装置中，第二工作台（41）或下模具（42）在其顶面设置有凹部（43），每个凹部（43）从第一加工装置的边缘横向和向内分离 （22）接触，0.2mm〜1mm; 以及设置在各个凹部（43）中的缓冲部件（51）。

    DEVICE AND METHOD FOR MANUFACTURING EMBLEM WITH INCORPORATED IC CHIP
    6.
    发明公开
    DEVICE AND METHOD FOR MANUFACTURING EMBLEM WITH INCORPORATED IC CHIP 审中-公开
    VORRICHTUNG UND VERFAHREN ZUR HERSTELLUNG EINES EMBLEMS MIT EINGEBAUTEM IC-CHIP

    公开(公告)号：EP3138695A1

    公开(公告)日：2017-03-08

    申请号：EP14891113.4

    申请日：2014-05-02

    申请人： Kuroda, Nobuo ,  Kuwahara, Eiji

    发明人： Kuwahara Eiji

    IPC分类号： B44C5/00

    摘要： The object of the present invention to provide a device and a method for manufacturing an emblem of thermoplastic synthetic resin with an incorporated IC chip by high frequency induction heating without damaging the IC chip.
    A device for manufacturing and for manufacturing an emblem (1) of thermoplastic synthetic resin with an incorporated IC chip (6) by high frequency induction heating, the device comprising:
    an upper metal mold (11) having at least a fusion cutting blade;
    a support frame (41) disposed along the perimeter and on the upper surface of the table (31);
    a slide board (51) disposed on the upper surface of the table so as to be slidable in the axial directions relative to the table (31);
    a metal plate (61) arranged on the upper surface of the slide board (51); and
    wherein
    pressing the upper layer material (2a) by means of the upper metal mold (11) from above and subjecting the upper layer material (2a) to high frequency induction heating,
    the IC chip is placed in an upper position of the recessed section (65), then the slide board (61) is driven to axially slide so as to be located below the upper metal mold (11) and subsequently a high frequency induction heating operation is executed without any risk of applying pressure onto the IC chip (6) due to the provision of the recessed section (65) and the cushion member (67).

    摘要翻译： 本发明的目的是提供一种通过高频感应加热制造具有并入的IC芯片的热塑性合成树脂标志的装置和方法，而不会损坏IC芯片。 一种用于通过高频感应加热制造和制造具有并入的IC芯片（6）的热塑性合成树脂的标志（1）的装置，所述装置包括：至少具有熔融切割刀片的上金属模具（11） 沿桌子周边和上表面设置的支撑框架（41）; 设置在所述工作台的上表面上以能够相对于工作台（31）沿轴向滑动的滑板（51）; 布置在滑板（51）的上表面上的金属板（61）; 并且其中通过上金属模具（11）从上方按压上层材料（2a）并对上层材料（2a）进行高频感应加热，将IC芯片放置在凹部的上部位置 （65）中，滑动板（61）被驱动以轴向滑动以位于上金属模具（11）的下方，并且随后执行高频感应加热操作，而不会对IC芯片施加压力 由于设置了凹部65和缓冲部件67。

    Method of manufacturing three-dimensional decoration piece made of synthetic resin
    7.
    发明公开
    Method of manufacturing three-dimensional decoration piece made of synthetic resin 审中-公开
    制造由合成树脂制成的三维装饰件的方法

    公开(公告)号：EP2520413A3

    公开(公告)日：2018-01-24

    申请号：EP12005578.5

    申请日：2005-09-29

    申请人： Kuroda, Nobuo ,  Kuwahara, Eiji

    发明人： Kuwahara, Eijii

    IPC分类号： B29C59/02 ,  B29C43/02 ,  B29C43/40 ,  B29C65/48 ,  B29C65/04 ,  B44C1/24 ,  B32B38/06

    CPC分类号： B27N3/20 ,  B29C35/12 ,  B29C43/021 ,  B29C43/40 ,  B29C59/026 ,  B29C65/04 ,  B29C65/7441 ,  B29C66/1122 ,  B29C66/45 ,  B29C66/4724 ,  B29C66/71 ,  B29C66/81427 ,  B29C66/8322 ,  B29C2043/023 ,  B29K2105/256 ,  B29L2031/722 ,  B29L2031/723 ,  B32B38/06 ,  B44C1/24 ,  B44C3/046 ,  Y10T428/24479 ,  B29K2023/00 ,  B29K2023/083 ,  B29K2027/06 ,  B29K2067/00 ,  B29K2075/00 ,  B29K2077/00

    摘要： There are provided (1) a method of manufacturing a three-dimensional decoration piece having a flat rear surface, and (2) a method of manufacturing the decoration piece having a bonding or sticking feature on the rear surface.
    A method of manufacturing a three-dimensional decoration piece made of synthetic resin, wherein
    laying an intermediate layer material (212) of a thermoplastic synthetic resin and an upper layer material (211) of a thermoplastic synthetic resin on a protruding mold (233) of cathode;
    pressing the layers material from above by an indented mold (232) of anode, to melt and mold the materials by high frequency dielectric heating, so as to form a three-dimensional molded body (216), said molded body (216) being formed with a recessed section (244) on a lower surface thereof, said molded body (216) being temporarily anchored to the indented mold (232);
    pulling up the indented mold (232) with the molded body (216);
    laying a lower layer material (213) having a bonding or sticking feature on a cathode (234) having a flat surface;
    lowering the indented mold (232) onto the cathode (234) to press the layer materials; and
    melting the lower layer material (213) by high frequency dielectric heating, so that the lower layer material (213) flows into the recessed section (244), so as to weld the molded body (216) and the lower layer material (213).

    摘要翻译： 提供（1）制造具有平坦后表面的三维装饰件的方法，以及（2）制造在后表面上具有粘合或粘附特征的装饰件的方法。 一种制造由合成树脂制成的三维装饰件的方法，其中将热塑性合成树脂的中间层材料（212）和热塑性合成树脂的上层材料（211）铺设在突出模具（233）上的 阴极; 通过阳极的凹陷模具（232）从上方压制层材料，以通过高频电介质加热熔化并模制材料，从而形成三维模制体（216），所述模制体（216）形成 在其下表面上具有凹陷部分（244），所述模制主体（216）暂时锚定到凹进模具（232）; 用模制主体（216）拉起凹进的模具（232）; 在具有平坦表面的阴极（234）上铺设具有粘结或粘附特征的下层材料（213） 将凹陷模具（232）下降到阴极（234）上以压制层材料; 通过高频电介质加热使下层材料（213）熔融，使下层材料（213）流入凹陷部分（244），从而焊接成型体（216）和下层材料（213） ）。