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    HEAT SHRINKABLE MULTILAYER FILM
    1.
    发明公开
    HEAT SHRINKABLE MULTILAYER FILM 审中-公开
    WÄRMESCHRUMPFBARE，MEHRLAGIGE FOLIE

    公开(公告)号：EP2087994A1

    公开(公告)日：2009-08-12

    申请号：EP07832495.1

    申请日：2007-11-26

    申请人： PS Japan Corp.

    发明人： KAWASAKI, Toshiharu ,  YAMAMOTO, Takehiro

    IPC分类号： B32B27/30 ,  B29C55/12 ,  B29C61/06 ,  B65D23/08 ,  B65D65/40 ,  B29K105/02 ,  B29L7/00 ,  B29L9/00

    CPC分类号： B29C55/005 ,  B29C61/003 ,  B29C61/0616 ,  B29K2009/00 ,  B32B27/08 ,  B32B27/18 ,  B32B27/22 ,  B32B27/302 ,  B32B27/308 ,  B32B27/32 ,  B32B2264/0207 ,  B32B2270/00 ,  B32B2307/30 ,  B32B2307/306 ,  B32B2307/412 ,  B32B2307/50 ,  B32B2307/516 ,  B32B2307/54 ,  B32B2307/736 ,  B32B2307/75 ,  B32B2519/00 ,  Y10T428/1328 ,  Y10T428/24942 ,  Y10T428/254 ,  Y10T428/31909

    摘要： Disclosed is a heat shrinkable multilayer film obtained by at least uniaxially stretching a multilayer film which comprises outer layers mainly composed of a block copolymer resin (a) composed of a vinyl aromatic monomer and a conjugated diene monomer, and an intermediate layer mainly composed of a resin (c) wherein a component made from a rubber elastic body (b) is contained in the form of dispersed particles in a continuous phase of a styrene polymer which is composed or a vinyl aromatic monomer and an n-butyl acrylate. The rubber plastic body (b) is a block copolymer composed of 20-45% bey weight of a vinyl aromatic monomers and 80-55% by weight of a conjugated diene monomer, and the rubber elastic body (b) content in the resin (c) is 3-20% by weight. The resin composition of the continuous phase of the resin (c) is composed of 78-93% by weight of a vinyl aromatic monomer and 22-7% by weight of an n-butyl acrylate, and the resin (c) has a Vicat softening temperature of 60-85°C.

    摘要翻译： 公开了通过至少单轴拉伸多层膜获得的热收缩多层膜，该多层膜包括主要由乙烯基芳族单体和共轭二烯单体构成的嵌段共聚物树脂（a）和主要由乙烯基芳族单体组成的中间层 树脂（c），其中由橡胶弹性体（b）制成的组分以分散颗粒的形式包含在构成乙烯基芳族单体和丙烯酸正丁酯的苯乙烯聚合物的连续相中。 橡胶塑料体（b）是由乙烯基芳族单体的20-45％重量比和共轭二烯单体80-55重量％组成的嵌段共聚物，并且橡胶弹性体（b）树脂中的含量 c）为3-20重量％。 树脂（c）的连续相的树脂组合物由78-93重量％的乙烯基芳族单体和22-7重量％的丙烯酸正丁酯组成，树脂（c）具有维卡 软化温度为60-85℃。