公开(公告)号：EP2950882B1

公开(公告)日：2016-09-21

申请号：EP14704484.6

申请日：2014-01-29

申请人： Heraeus Deutschland GmbH & Co. KG ,  Glynn, Jeremy ,  Richter, Dan ,  Calander, Leroy

发明人： GLYNN, Jeremy ,  RICHTER, Dan ,  CALANDER, LeRoy

IPC分类号： A61N1/375 ,  B29C45/14 ,  B29C45/00

CPC分类号： H01R24/58 ,  A61N1/0563 ,  A61N1/3752 ,  B29C45/14065 ,  B29C45/14549 ,  B29C45/14639 ,  B29C2045/14131 ,  H01R13/04 ,  H01R24/38 ,  H01R2107/00 ,  H01R2201/12 ,  Y10T29/4922

摘要： A method of manufacturing a lead connector for an implantable medical device including connecting proximal ends of a plurality of conductive wires to an inner surface of a corresponding ring contact, placing a distal frame over distal ends of each of conducive wire of the plurality of conductive wires, the distal ends passing through corresponding shafts in the distal frame from a rear face of the distal frame and extending beyond a front face of the distal frame, arranging the distal frame along with the conductive wires and corresponding ring contacts within a mold cavity, filling the mold cavity with a mold material, the mold material abutting the rear face of the distal frame, and removing a resulting lead connector from the mold cavity.

公开(公告)号：EP2950882A1

公开(公告)日：2015-12-09

申请号：EP14704484.6

申请日：2014-01-29

申请人： Heraeus Deutschland GmbH & Co. KG ,  Glynn, Jeremy ,  Richter, Dan ,  Calander, Leroy

发明人： GLYNN, Jeremy ,  RICHTER, Dan ,  CALANDER, LeRoy

IPC分类号： A61N1/375 ,  B29C45/14 ,  B29C45/00

CPC分类号： H01R24/58 ,  A61N1/0563 ,  A61N1/3752 ,  B29C45/14065 ,  B29C45/14549 ,  B29C45/14639 ,  B29C2045/14131 ,  H01R13/04 ,  H01R24/38 ,  H01R2107/00 ,  H01R2201/12 ,  Y10T29/4922

摘要： A method of manufacturing a lead connector for an implantable medical device including connecting proximal ends of a plurality of conductive wires to an inner surface of a corresponding ring contact, placing a distal frame over distal ends of each of conducive wire of the plurality of conductive wires, the distal ends passing through corresponding shafts in the distal frame from a rear face of the distal frame and extending beyond a front face of the distal frame, arranging the distal frame along with the conductive wires and corresponding ring contacts within a mold cavity, filling the mold cavity with a mold material, the mold material abutting the rear face of the distal frame, and removing a resulting lead connector from the mold cavity.