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    VACUUM CUP FOR A ROBOTIC SYSTEM, ROBOTIC SYSTEM COMPRISING THE VACUUM CUP, AND METHOD FOR PROVIDING A TIGHT HOLD OF THE VACUUM CUP ON UNEVEN SURFACES
    2.
    发明公开
    VACUUM CUP FOR A ROBOTIC SYSTEM, ROBOTIC SYSTEM COMPRISING THE VACUUM CUP, AND METHOD FOR PROVIDING A TIGHT HOLD OF THE VACUUM CUP ON UNEVEN SURFACES 审中-公开

    公开(公告)号：EP4091778A1

    公开(公告)日：2022-11-23

    申请号：EP21174904.9

    申请日：2021-05-20

    申请人： Scuola universitaria professionale della Svizzera italiana (SUPSI)

    发明人： Gitardi, Diego ,  Sabbadini, Simone ,  Valente, Anna

    IPC分类号： B25J15/06 ,  B25J19/02 ,  B25J5/00 ,  B25J9/14 ,  B62D57/032

    摘要： A vacuum cup for a robotic system comprising an interface element (1) configured for interfacing with a robotic system, a tilting element (2), a floating element (3) defining an inner chamber (13) of the vacuum cup (100), an aspiration duct (5) provided at the interface element (1) to connect said inner chamber (13) to a vacuum system (17, 20) for generating, inside the inner chamber (13), a vacuum suitable for the gripping of the cup on a gripping surface (11), and a tilting joint (4). The tilting element (2) is connected to the interface element (1) by way of the tilting joint (4), the tilting element (2) being therefore tiltable with respect to the interface element (1). An intermediate element (8) is also provided fixed to the tilting element (2) and is sealably connected via a sliding fit connection to the floating element (3). At least one sliding connector (6) for connecting the tilting element (2) and the floating element (3) together is provided. The tilting element (2) and the floating element (3) are jointly tiltable with respect to the interface element (1) for the adaptable positioning thereof with respect to a gripping surface (11). A pressure chamber (9) is further provided, arranged in a bottom seat (12) of the floating element (3), and can be connected to pressure regulation means (20) suitable to control its internal pressure. The pressure chamber has an active side (14), and is deformable upon the action thereon of forces that are internal and/or external thereto. The internal and/or external forces are generated by the combined action of vacuum suction on a gripping surface (11), determined by the vacuum inside the inner chamber (13), and of pressure variation inside the pressure chamber (9).
    A sealing element (10) is arranged, bearing with a bearing side (15) thereof on the active side (14) of the pressure chamber (9) that has a sealing side (16), opposite to the bearing side (15), the sealing side (16) being for sealing on a gripping surface.

    DEVICE FOR GRIPPING AND WELDING ELECTRONIC COMPONENTS AND ASSOCIATED ACTUATING HEAD, ROBOT AND METHOD
    10.
    发明公开
    DEVICE FOR GRIPPING AND WELDING ELECTRONIC COMPONENTS AND ASSOCIATED ACTUATING HEAD, ROBOT AND METHOD 审中-公开

    公开(公告)号：EP3569370A1

    公开(公告)日：2019-11-20

    申请号：EP18173328.8

    申请日：2018-05-18

    申请人： SUPSI (Scuola Universitaria Professionale Della Svizzera Italiana)

    发明人： Valente, Anna ,  Brugnetti, Ivan ,  Colla, Marco

    IPC分类号： B25J15/06 ,  H05K3/34 ,  B23K1/00 ,  B23K3/08 ,  B23K37/04 ,  B23K3/047 ,  B23K20/16

    摘要： A device (100) for gripping and welding electronic components (1) of the Chip-On-Carrier type on a support, comprising first suction means able, during use, to retain the electronic component (1) and defining a first gripping area (111) for the electronic component (1), second suction means (122) able, during use, to retain a sheet (2) of welding material and defining a second gripping area (121), the second suction means (122) are disposed outside the first gripping area (111) of the electronic component (1), and welding means (130) of the sheet (2) of welding material, able, during use, to deliver an electrical impulse for melting the sheet (2) of welding material.
    The first gripping area (111) of the electronic component (1) and the second gripping area (121) of the sheet (2) of welding material are arranged on different and parallel planes, and the second suction means are movable between a gripping position (GP), retaining the sheet (2) of welding material spaced from the electronic component (1), and a welding position (WP), retaining the sheet (2) of welding material at the support and in contact with the electronic component (1) held by the first suction means during the delivery of the electrical impulse from the welding means (130).