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公开(公告)号：EP1681151A3
公开(公告)日：2006-07-26
申请号：EP06004768.5
申请日：1999-09-09
发明人： Mizuno, Toru Atock Co., Ltd., Fukushima Factory , Hattori, Ikuo c/o Atock Co., Ltd. , Sugama, Akihiko Shin-Etsu Quartz Products Co., Ltd , Matsuya, Toshikatsu Yamagata Shin-Etsu Quartz Co. , Ise, Yoshiaki Yamagata Shin-Etsu Quartz Co., Ltd.
IPC分类号： B28D1/04
CPC分类号： B28D1/041 , B28D1/121 , Y10T408/81
摘要： Provided is a core drill (211) and a core-drill processing machine (240) for forming a hole into hard material, whereby the mechanical processing with reduction in the cutting and/or contact resistance to the tools is realized, so that in the case of the core drill (211), not only are grinding powder of a workpiece (W) and loosed-off abrasive grains effectively removed to prevent those from being loaded between the drill (211) and the workpiece (W), but neither of cracking and chipping occur when the drill (211) passes through the workpiece (W).
A core drill (211) comprises: a shank (214); a base metal section (216) having a cup-like shape constructed of a disk-like top wall (216a) and a cylindrical side wall (216b) provided on a fore-end of the shank (214); a grinding stone portion (217) mounted on an outer end part of the base metal section (216); and abrasive grain layers (230a,230b) formed on inner and outer side surfaces of the cylindrical side wall (216b) of the base metal section (216).摘要翻译： 本发明提供一种用于在硬质材料上形成孔的芯钻（211）和芯钻加工机（240），由此实现了减少对刀具的切削和/或接触阻力的机械加工，从而在 （211）的情况下，不仅磨削工件（W）的磨削粉末和松散的磨粒被有效地去除以防止钻头（211）和工件（W）之间被加载，而且 当钻头（211）穿过工件（W）时发生裂纹和碎裂。 芯钻（211）包括：柄（214）; 由圆盘状的顶壁216a和设置在该柄214的前端的圆筒状的侧壁216b构成的杯状的基底金属部216; 磨石部分（217），其安装在所述基底金属部分（216）的外端部分上; 和形成在基体金属部分（216）的圆柱形侧壁（216b）的内侧和外侧表面上的磨粒层（230a，230b）。
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2.发明公开
公开(公告)号：EP4039659A1
公开(公告)日：2022-08-10
申请号：EP20871500.3
申请日：2020-09-18
申请人： Shin-Etsu Quartz Products Co., Ltd. , Yamagata Shin-Etsu Quartz Co., Ltd. , Heraeus Quarzglas GmbH & Co. KG
摘要： Provided are a heat reflective member, which is prevented from being broken even in a high-temperature environment at the time of its manufacturing and its use while maintaining a high reflectance, generates no dust at the time of its use, and can be washed with a chemical liquid, and a method of manufacturing a glass member with a heat reflective layer suitable as the heat reflective member. The heat reflective member is a heat reflective member having a laminated structure in which quartz glass layers are formed on an upper surface and a lower surface of a siliceous sintered powder layer, wherein the heat reflective member includes: an impermeable layer which is formed at a portion of the siliceous sintered powder layer at an end portion of the heat reflective member, which has a thickness at least larger than half of a thickness of the siliceous sintered powder layer, and through which a gas or a liquid is prevented from penetrating; and a buffer layer which is formed between the impermeable layer and the siliceous sintered powder layer, and which changes in density from the impermeable layer toward the sintered powder layer.
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公开(公告)号：EP4029838A1
公开(公告)日：2022-07-20
申请号：EP20863599.5
申请日：2020-08-17
申请人： Shin-Etsu Quartz Products Co., Ltd. , Yamagata Shin-Etsu Quartz Co., Ltd. , Heraeus Quarzglas GmbH & Co. KG
摘要： Provided are a reflective member, which can be prevented from being broken even in a high-temperature environment at the time of its production and its use while generating no dust at the time of its use, having a high fracture strength, and maintaining a high reflectance, and a method of manufacturing a glass laminate member suitable as the reflective member. The reflective member has a laminated structure in which transparent quartz glass members are formed on an upper surface and a lower surface of an opaque siliceous sintered powder layer, wherein the opaque siliceous sintered powder layer has a thickness of 0.1 mm or more and a thickness distribution of ±0.05 mm or less, wherein, when a load is applied to each of the transparent quartz glass members on an upper surface and a lower surface of the laminated structure in a direction parallel to the laminated structure, the reflective member is fractured at a load of 5 N or more per square centimeter, and wherein the laminated structure includes, in a boundary between the opaque siliceous sintered powder layer and each of the transparent quartz glass members of the laminated structure, a semi-transparent portion having a width of 0.01 mm or less, which has an intermediate opacity between an opacity of the opaque siliceous sintered powder layer and an opacity of each of the transparent quartz glass members.
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4.发明公开A core drill and processing machines using same 有权Hohlbohrwerkzeug und dieses Werkzeug verwendende Maschinen
公开(公告)号：EP1681151A2
公开(公告)日：2006-07-19
申请号：EP06004768.5
申请日：1999-09-09
发明人： Mizuno, Toru Atock Co., Ltd., Fukushima Factory , Hattori, Ikuo c/o Atock Co., Ltd. , Sugama, Akihiko Shin-Etsu Quartz Products Co., Ltd , Matsuya, Toshikatsu Yamagata Shin-Etsu Quartz Co. , Ise, Yoshiaki Yamagata Shin-Etsu Quartz Co., Ltd.
IPC分类号： B28D1/04
CPC分类号： B28D1/041 , B28D1/121 , Y10T408/81
摘要： Provided is a core drill (211) and a core-drill processing machine (240) for forming a hole into hard material, whereby the mechanical processing with reduction in the cutting and/or contact resistance to the tools is realized, so that in the case of the core drill (211), not only are grinding powder of a workpiece (W) and loosed-off abrasive grains effectively removed to prevent those from being loaded between the drill (211) and the workpiece (W), but neither of cracking and chipping occur when the drill (211) passes through the workpiece (W).
A core drill (211) comprises: a shank (214); a base metal section (216) having a cup-like shape constructed of a disk-like top wall (216a) and a cylindrical side wall (216b) provided on a fore-end of the shank (214); a grinding stone portion (217) mounted on an outer end part of the base metal section (216); and abrasive grain layers (230a,230b) formed on inner and outer side surfaces of the cylindrical side wall (216b) of the base metal section (216).摘要翻译： 提供了一种用于将硬孔材料形成孔的芯钻（211）和芯钻加工机（240），从而实现了减少对工具的切割和/或接触抵抗力的机械加工，从而在 芯钻（211）的情况下，不仅工件（W）的研磨粉末和脱落的磨粒有效地被去除，以防止钻头（211）和工件（W）之间的装载，而且 当钻头（211）通过工件（W）时发生破裂和碎裂。 芯钻（211）包括：柄（214）; 具有由盘状顶壁（216a）构成的杯状的贱金属部（216）和设置在柄（214）前端的圆筒形侧壁（216b）; 安装在所述基底金属部分（216）的外端部上的磨石部分（217）; 和形成在基体金属部分（216）的圆柱形侧壁（216b）的内侧和外侧表面上的磨粒层（230a，230b）。
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5.发明公开
公开(公告)号：EP1202328A2
公开(公告)日：2002-05-02
申请号：EP01125853.0
申请日：2001-10-30
申请人： Heraeus Quarzglas GmbH & Co. KG , Shin-Etsu Quartz Products Co.,Ltd. , Yamagata Shin-Etsu Quartz Co. Ltd.
发明人： Saito, Makoto , Konno, Toshiaki
IPC分类号： H01L21/00
CPC分类号： C23C16/4581 , C23C16/4401 , F27D5/0006 , H01L21/68735 , Y10T156/1052
摘要： An object of the present invention is to provide a novel wafer support jig and a process for producing the same, said wafer support jig capable of considerably suppressing the generation of particles in the wafer heat treatment process, e.g., a CVD process, during the production of semiconductors. In order to solve the problems a quartz glass wafer support jig is suggested comprising a plurality of support pillars having provided thereto a plurality of ring-shaped support plates for mounting thereon the wafers, said support plates being superposed one after another with a predetermined distance taken between the neighboring plates in the vertical direction, a quartz glass wafer support jig characterized in that it comprises said ring-shaped support plates each having its upper and lower surfaces precisely polished and each having provided with chamfered portions formed by chamfering the upper and lower edge portions of the outer and inner peripheries thereof.
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公开(公告)号：EP1681151B1
公开(公告)日：2008-12-17
申请号：EP06004768.5
申请日：1999-09-09
发明人： Mizuno, Toru Atock Co., Ltd., Fukushima Factory , Hattori, Ikuo c/o Atock Co., Ltd. , Sugama, Akihiko Shin-Etsu Quartz Products Co., Ltd , Matsuya, Toshikatsu Yamagata Shin-Etsu Quartz Co. , Ise, Yoshiaki Yamagata Shin-Etsu Quartz Co., Ltd.
IPC分类号： B28D1/04
CPC分类号： B28D1/041 , B28D1/121 , Y10T408/81
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7.发明公开Quartz glass wafer support jig and method for producing the same 审中-公开Waferhaltevorrichtung aus Quarglass und Verfahren zu ihrer Herstellung
公开(公告)号：EP1202328A3
公开(公告)日：2006-05-31
申请号：EP01125853.0
申请日：2001-10-30
申请人： Heraeus Quarzglas GmbH & Co. KG , SHIN-ETSU QUARTZ PRODUCTS CO., LTD. , Yamagata Shin-Etsu Quartz Co. Ltd.
发明人： Saito, Makoto , Konno, Toshiaki
CPC分类号： C23C16/4581 , C23C16/4401 , F27D5/0006 , H01L21/68735 , Y10T156/1052
摘要： An object of the present invention is to provide a novel wafer support jig and a process for producing the same, said wafer support jig capable of considerably suppressing the generation of particles in the wafer heat treatment process, e.g., a CVD process, during the production of semiconductors. In order to solve the problems a quartz glass wafer support jig is suggested comprising a plurality of support pillars having provided thereto a plurality of ring-shaped support plates for mounting thereon the wafers, said support plates being superposed one after another with a predetermined distance taken between the neighboring plates in the vertical direction, a quartz glass wafer support jig characterized in that it comprises said ring-shaped support plates each having its upper and lower surfaces precisely polished and each having provided with chamfered portions formed by chamfering the upper and lower edge portions of the outer and inner peripheries thereof.
摘要翻译： 本发明的目的是提供一种新颖的晶片支撑夹具及其制造方法，所述晶片支撑夹具能够显着地抑制晶片热处理过程中的颗粒的产生，例如在生产过程中的CVD工艺 的半导体。 为了解决这些问题，提出了一种石英玻璃晶片支撑夹具，其包括多个支撑柱，其中提供有多个环形支撑板用于在其上安装晶片，所述支撑板以预定距离一个接一个地重叠 在相邻的板之间的垂直方向上的石英玻璃晶片支撑夹具，其特征在于，其包括所述环形支撑板，每个所述环形支撑板的上表面和下表面精确抛光，并且每个都具有倒角部分，该倒角部分通过倒角上下边缘 其外周和外周的部分。
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