公开(公告)号：EP3626795B1

公开(公告)日：2024-10-02

申请号：EP18801411.2

申请日：2018-05-16

IPC分类号： C08G77/14 ,  C09J183/06 ,  B32B27/00 ,  C08G59/32 ,  C09J7/20 ,  C09J11/06 ,  C09J163/00

CPC分类号： C08G59/32 ,  C08G77/14 ,  C09J163/00 ,  C09J183/06 ,  C09J7/30 ,  C09J2483/0020130101 ,  C09J2483/00320130101 ,  C09J2203/32620130101 ,  C09J2463/0020130101

公开(公告)号：EP3240849B1

公开(公告)日：2024-08-21

申请号：EP15828431.5

申请日：2015-12-18

IPC分类号： C09J143/02 ,  C09J7/38 ,  C08F220/18

CPC分类号： C08F265/06 ,  C09J2203/32620130101 ,  C09J7/385 ,  C09K21/14 ,  C09J143/02

公开(公告)号：EP3357607B1

公开(公告)日：2024-05-29

申请号：EP16851301.8

申请日：2016-09-21

IPC分类号： B22F1/10 ,  B22F7/06 ,  B22F7/08 ,  B32B5/16 ,  B32B7/06 ,  B32B7/12 ,  B32B9/04 ,  B32B27/14 ,  C09J7/10 ,  C09J9/00 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31 ,  C08K3/22 ,  C08K3/08

CPC分类号： B22F7/064 ,  H01L21/6836 ,  C09J2203/32620130101 ,  C09J9/00 ,  C08K2003/080620130101 ,  C08K2003/08520130101 ,  C08K2003/224820130101 ,  C08K2003/228620130101 ,  C09J2469/0020130101 ,  C09J7/10 ,  H01L2924/18120130101 ,  H01L2224/4809120130101 ,  H01L2224/7326520130101 ,  H01L2224/8319120130101 ,  H01L23/3121 ,  H01L24/83 ,  H01L2221/6832720130101 ,  H01L2221/6837720130101 ,  B22F7/08 ,  H01L2224/9420130101 ,  H01L2224/2743620130101 ,  H01L2224/2700320130101 ,  H01L2224/8320120130101 ,  H01L2224/8309720130101 ,  H01L2224/838420130101 ,  H01L24/27 ,  H01L24/32 ,  H01L24/29 ,  H01L2224/3224520130101 ,  H01L2224/1622520130101 ,  B32B2307/74820130101 ,  B32B2307/10220130101 ,  B32B2307/73220130101 ,  B32B2260/02520130101 ,  B32B7/12 ,  B32B2264/10520130101 ,  B32B7/06 ,  B32B9/048 ,  B32B2307/71820130101 ,  B32B2260/04620130101 ,  B32B2457/1420130101 ,  B32B5/16 ,  B32B27/14 ,  H01L2224/8539920130101 ,  H01L2224/2934720130101 ,  H01L2224/834920130101 ,  H01L2224/292920130101 ,  H01L2224/2934420130101 ,  H01L2224/4514720130101 ,  H01L2224/2933920130101 ,  H01L2224/4514420130101 ,  H01L2224/2938620130101 ,  H01L2224/4512420130101 ,  C09J2301/30420200801 ,  C09J2301/40820200801 ,  B22F1/10

公开(公告)号：EP3415583B1

公开(公告)日：2024-06-05

申请号：EP16889957.3

申请日：2016-12-16

IPC分类号： C09J7/10 ,  C09J9/02 ,  C09J11/02 ,  C09J179/08 ,  C09J157/12

CPC分类号： H01L2924/18120130101 ,  C09J157/12 ,  C09J201/00 ,  H01B1/22 ,  H01L2224/4824720130101 ,  H01L2224/4846520130101 ,  H01L2224/7326520130101 ,  H01L2224/8319120130101 ,  H01L2224/9224720130101 ,  C09J7/10 ,  C09J9/02 ,  C09J11/02 ,  C08K3/08 ,  C09J2203/32620130101 ,  C09J2461/0020130101 ,  C09J2463/0020130101 ,  C09J2479/0820130101 ,  C09J179/08 ,  C08K5/50 ,  C09J2301/31420200801 ,  C09J2301/30420200801 ,  C09J2301/40820200801

公开(公告)号：EP4307869A3

公开(公告)日：2024-05-22

申请号：EP23213968.3

申请日：2019-09-06

申请人： Samsung Display Co., Ltd.

发明人： Oh, Young Eun ,  Shin, Jai Ku ,  Ryou, Han Sun ,  Ahn, So Dam ,  Lee, Jang Doo

IPC分类号： C09J7/38 ,  B32B1/00 ,  G06F1/16 ,  H10K59/80 ,  H10K77/10

CPC分类号： C09J7/38 ,  C09J2203/32620130101 ,  C09J2203/31820130101 ,  G06F1/1652 ,  G06F1/1637 ,  Y02E10/549 ,  H10K77/111 ,  H10K59/8722 ,  H10K59/873

摘要： An electronic device comprises a body, a protection film (10, 11, 12) which includes a base layer (120) disposed over a first surface of the body and an adhesive layer (110) disposed between the body and the base layer (120), wherein a thickness of the adhesive layer (120) satisfies Inequality (1): z≤5.1x+57.4⋅lny−14.7x+140.5, where z is the thickness of the adhesive layer (120) in terms of micrometers, x is a modulus of the base layer (120) determined according to the conditions of ASTM D638 in terms of gigapascals, and y is a total thickness of the protection film in terms of micrometers, a temperature is about -40 °C to about 65 °C, the thickness of the adhesive layer (110) is about 25 micrometers or more, the body comprises at least one member, and a member of the body which is disposed on a fist surface the adhesive layer (110) opposite to a second surface of the adhesive layer (110) facing the base layer (120) has a modulus of 50 gigapascals or more.

公开(公告)号：EP3439024B1

公开(公告)日：2024-04-24

申请号：EP17774499.2

申请日：2017-03-21

IPC分类号： H01L21/304 ,  H01L21/683 ,  C09J7/29 ,  C09J7/30

CPC分类号： H01L21/304 ,  H01L21/683 ,  C09J7/30 ,  C09J2433/0020130101 ,  C09J2203/32620130101 ,  C09J7/29 ,  C09J2301/31220200801

公开(公告)号：EP4353760A1

公开(公告)日：2024-04-17

申请号：EP22201244.5

申请日：2022-10-13

申请人： Henkel AG & Co. KGaA

发明人： Chou, Kang Wei ,  Engels, Thomas ,  Stapf, Stefanie ,  Kamm, Thomas

IPC分类号： C08F285/00 ,  C08F287/00 ,  C08F290/04 ,  C09J4/06 ,  C09J5/00 ,  C09J9/02 ,  C09J151/04 ,  C09J151/06

CPC分类号： C09J4/06 ,  C09J2301/50220200801 ,  C09J5/00 ,  C09J9/02 ,  C09J2203/32620130101 ,  C08F290/048 ,  C08F287/00 ,  C08F285/00 ,  C09J151/04 ,  C09J151/06

摘要： The present invention relates to a curable and electrochemically debondable one-component (1K) structural adhesive composition comprising a) a (meth)acrylate monomer selected from the group consisting of hydroxypropyl acrylate, hydroxypropyl methacrylate, hydroxybutyl methacrylate, isobornyl acrylate, isobornyl methacrylate, methyl methacrylate and mixtures thereof; b) an electrolyte selected from the group consisting of 1-butyl-3-methylimidazolium bis(trifluoromethylsulfonyl) imide, 1-pentyl-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, 1-hexyl-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, 1-heptyl-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, 1-octyl-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, 1-nonyl-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, 1-decyl-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, 1-dodecyl-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, 1-tetradecyl-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, 1-hexadecyl-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, 1-octadecyl-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, trihexyltetradecylphosphonium bis (trifluoromethylsulfonyl) amide, and mixtures thereof; c) a co-polymerisable acid; d) an initiator; e) a core shell toughener; and f) a toughener. The composition according to the present invention can withstand harsh conditions (high temperature and high humidity) while maintaining adhesive and debonding properties.

公开(公告)号：EP3730568B1

公开(公告)日：2024-09-25

申请号：EP19885177.6

申请日：2019-11-01

IPC分类号： C09J7/30 ,  C09J133/06 ,  C09J133/20 ,  C08F220/18 ,  C09J163/00 ,  C08G59/40 ,  H01L21/683 ,  H01L23/00

CPC分类号： C09J163/00 ,  H01L21/78 ,  C09J7/30 ,  C09J2203/32620130101 ,  C09J2301/20820200801 ,  C09J2301/40820200801 ,  C09J2433/0020130101 ,  C09J2463/0020130101 ,  C08K9/06 ,  C09J133/066 ,  C09J133/20 ,  C08G59/4042 ,  H01L21/6836 ,  H01L2221/6832720130101 ,  H01L2221/6838120130101 ,  H01L2221/6837720130101 ,  H01L24/29 ,  H01L2224/8319120130101 ,  C08F220/1804 ,  C08F230/085 ,  H01L24/27 ,  H01L24/83 ,  H01L2224/838520130101 ,  H01L2224/2743620130101 ,  H01L2224/292920130101 ,  H01L2224/2938620130101

公开(公告)号：EP3118934B1

公开(公告)日：2024-09-25

申请号：EP15761023.9

申请日：2015-02-10

IPC分类号： C08L75/04 ,  H01B1/12 ,  C09J7/10 ,  C09J9/02 ,  H01B1/22

CPC分类号： C09J9/02 ,  H01B1/22 ,  C08L75/04 ,  C08K2201/00120130101 ,  C09J2203/32620130101 ,  C09J2467/0020130101 ,  C09J2475/0020130101 ,  C09J7/10 ,  H01B1/124 ,  C09J2301/31420200801 ,  C09J2301/30420200801 ,  C09J2301/40820200801 ,  C09J2301/31220200801

公开(公告)号：EP4426076A2

公开(公告)日：2024-09-04

申请号：EP24188167.1

申请日：2020-11-25

申请人： Noda Screen Co., Ltd

发明人： MORI, Yasumitsu ,  DOI, Akihiro

IPC分类号： H05K3/00

CPC分类号： H05K3/42 ,  H05K2203/013920130101 ,  H05K2201/095920130101 ,  H05K3/0094 ,  H05K2203/147620130101 ,  H05K2203/02520130101 ,  C09J7/20 ,  C09J2301/20420200801 ,  C09J2301/1820200801 ,  C09J2203/32620130101

摘要： A sealing film (12) that is to be attached to a print board (10) when supplying filling material (16) into through holes (11) of the print board (10) with a printing method under a vacuum atmosphere, the sealing film (12) being to be attached to the print board (10) from an opposite side from a filling material supplying side and separated from the print board (10) before starting a curing of the filling material (16), the sealing film (12) being made of synthetic resin and having a thickness being from 35 µm to 100 µm , the sealing film (12) comprising: a base film (12A) that has a smooth surface, the base film (12A) including micro holes (12C) having a diameter being from 10 µm to 100 µm and arranged at intervals of 2 mm to 4 mm; and an adhesive layer (12B) divided into adhesive layer (12B) portions that have a diameter being from 100 µm to 500 µm and are disposed on the base film at intervals of 10 µm to 400 µm.