公开(公告)号：EP3854502A1

公开(公告)日：2021-07-28

申请号：EP20153373.4

申请日：2020-01-23

申请人： ABB Schweiz AG

发明人： Manninen, Jorma ,  Silvennoinen, Mika ,  Pakarinen, Joni

IPC分类号： B22F1/00 ,  B22F1/02 ,  C01B32/15 ,  C01B32/182 ,  C01B32/194 ,  C01B32/198 ,  C08K3/04 ,  C22C1/05 ,  C22C1/10 ,  C22C26/00

摘要： The present invention relates to a composite and a method of its preparation. The composite comprises particles of a metal or a metal alloy; and particles of graphene. In said composite and method at least one particle of metal or metal alloy is coated with at least one particle of graphene.

公开(公告)号：EP3937228A1

公开(公告)日：2022-01-12

申请号：EP20184712.6

申请日：2020-07-08

申请人： ABB Schweiz AG

发明人： Manninen, Jorma ,  Silvennoinen, Mika ,  Pakarinen, Joni

IPC分类号： H01L23/427

摘要： A power electronic assembly comprising a power electronic module having multiple of power electronic components and a cooling element. The cooling element is attached to a surface of the power electronic module and is arranged to transfer heat from the power electronic assembly to a cooling medium, wherein the assembly comprises multiple of vapour chambers arranged to transfer the heat generated by the multiple of power electronic components.

公开(公告)号：EP3637461A1

公开(公告)日：2020-04-15

申请号：EP18199846.9

申请日：2018-10-11

申请人： ABB Schweiz AG

发明人： Manninen, Jorma ,  Silvennoinen, Mika ,  Pakarinen, Joni

IPC分类号： H01L23/34

摘要： A power electronic component comprising a surface adapted to be attached to a heatsink, the surface forming a bottom surface of the power electronic component, one or more power electronic semiconductor chips (3) mounted on a substrate (4) above the bottom surface, and a housing (2) enclosing the one or more power electronic semiconductor chips. The power electronic component comprises a thermal insulator (21; 31; 41; 51) disposed above the one or more power electronic semiconductor chips, such that the bottom surface and the thermal insulator (21; 31; 41; 51) are on the opposite sides of the one or more power electronic semiconductor chips (3).

公开(公告)号：EP3633302A1

公开(公告)日：2020-04-08

申请号：EP18197860.2

申请日：2018-10-01

申请人： ABB Schweiz AG

发明人： Manninen, Jorma ,  Silvennoinen, Mika ,  Pakarinen, Joni

IPC分类号： F28D15/02 ,  H01L23/427 ,  H05K7/20

摘要： A method of manufacturing a heat exchanger and a heat-exchanger comprising a base chamber (11) and one or more condensers (12). The base chamber (11) comprises a top surface (13), a bottom surface (14) and side walls (15) attached to the top surface and the bottom surface, the top surface being adapted to receive one or more heat generating components and the bottom surface comprising one or more elongated openings (16) and the one or more condensers (12) are formed to the bottom surface (14) of the base chamber, extend from the bottom surface and are closed structures having an opening corresponding to the openings of the bottom surface such that the base chamber (11) forms together with the one or more condensers a gas-tight structure having a working fluid enclosed inside the volume of the structure.

公开(公告)号：EP3696849A1

公开(公告)日：2020-08-19

申请号：EP19157762.6

申请日：2019-02-18

申请人： ABB Schweiz AG

发明人： Manninen, Jorma ,  Silvennoinen, Mika ,  Pakarinen, Joni

IPC分类号： H01L23/367 ,  H01L23/373 ,  H01L21/48

摘要： 1. A heatsink comprising a heatsink base and cooling fins, wherein the heatsink base comprises a first surface which is adapted to be attached to a surface of a heat source and the cooling fins are attached to the heatsink base and arranged to extend from the heatsink base. The heatsink base comprises a second surface comprising grooves, the cooling fins comprise carbon-based material and a metallic base at one end of the fins, and the cooling fins are arranged to the grooves such that the metallic bases are in the grooves.

公开(公告)号：EP3893274A1

公开(公告)日：2021-10-13

申请号：EP20168470.1

申请日：2020-04-07

申请人： ABB Schweiz AG

发明人： Manninen, Jorma ,  Silvennoinen, Mika ,  Pakarinen, Joni

IPC分类号： H01L23/427 ,  F28D15/02

摘要： A cooling element and a method of manufacturing a cooling element. The cooling element comprises a body having a surface adapted to receive a heat source, wherein the body is formed of extrusion profile having open ends. The cooling element further comprises plugs attached to the open ends of the body to close the body, and a port for filling working fluid inside the closed body.

公开(公告)号：EP3589102A1

公开(公告)日：2020-01-01

申请号：EP19181416.9

申请日：2019-06-20

申请人： ABB Schweiz AG

发明人： Manninen, Jorma ,  Silvennoinen, Mika ,  Ingman, Kjell

IPC分类号： H05K7/20

摘要： A heat transfer structure, wherein the structure comprises a metallic body having a first surface and a second surface. The first surface and the second surface are opposing surfaces, one of the first surface and the second surface is adapted to receive a heat generating component, and the metallic body comprises a carbon based insert.

公开(公告)号：EP3588552A1

公开(公告)日：2020-01-01

申请号：EP19181121.5

申请日：2019-06-19

申请人： ABB Schweiz AG

发明人： Manninen, Jorma ,  Silvennoinen, Mika ,  Koivuluoma, Timo

IPC分类号： H01L23/34 ,  H01L23/42 ,  H01L23/373

摘要： A thermal interface material sheet, method of manufacturing a thermal interface material sheet and an electrical device. The thermal interface material sheet is to be disposed between a heat generating electrical component and a cooling device, the thermal interface material sheet comprising at least one thin film sensor and electrical conductors connected to the at least one thin film sensor for measuring a property related to the heat generating electrical component.

公开(公告)号：EP3113590B1

公开(公告)日：2020-11-18

申请号：EP15174490.1

申请日：2015-06-30

申请人： ABB Schweiz AG

发明人： Manninen, Jorma ,  Koivuluoma, Timo

IPC分类号： H05K7/20 ,  H01L23/427 ,  F28D15/02 ,  F04B17/03 ,  F04B19/00 ,  F04B19/20 ,  F04F99/00 ,  F28D1/02 ,  H01L23/467

公开(公告)号：EP3174093B1

公开(公告)日：2020-10-28

申请号：EP16199913.1

申请日：2016-11-22

申请人： ABB Schweiz AG

发明人： Silvennoinen, Mika ,  Manninen, Jorma ,  Pakarinen, Joni

IPC分类号： H01L23/427