公开(公告)号：EP3185664A1

公开(公告)日：2017-06-28

申请号：EP15201821.4

申请日：2015-12-22

Applicant: ABB Technology Oy

Inventor： Agostini, Francesco ,  Torresin, Daniele ,  Agostini, Bruno ,  Habert, Mathieu

IPC: H05K7/20

CPC classification number: H05K7/20336 ,  F28D15/025 ,  F28D15/0266 ,  F28F1/022 ,  F28F1/126 ,  F28F3/12 ,  F28F9/0243 ,  H05K7/20145 ,  H05K7/2029 ,  H05K7/20309 ,  H05K7/20318

Abstract: The invention relates to a cooling apparatus, comprising a first evaporator section (6) with first channels, and a first condenser section (8) with second channels. In order to provide adequate cooling for electric components the cooling apparatus further comprises a second evaporator section (10) with third channels, and a base plate (11) with a first surface (12) for receiving a heat load from electric components (13). The first condenser section (8) is in fluid communication with the second evaporator section (10) for receiving fluid from the second evaporator section, for passing heat from the fluid to surroundings and for returning fluid to the second evaporator section.

Abstract translation: 本发明涉及一种冷却装置，其包括具有第一通道的第一蒸发器部分（6）以及具有第二通道的第一冷凝器部分（8）。 为了给电子部件提供足够的冷却，冷却设备还包括具有第三通道的第二蒸发器部分（10）以及具有用于接收来自电气部件（13）的热负载的第一表面（12）的基板（11） 。 第一冷凝器部分（8）与第二蒸发器部分（10）流体连通，用于接收来自第二蒸发器部分的流体，用于将热量从流体传递到周围环境并且用于将流体返回到第二蒸发器部分。

公开(公告)号：EP2988578A1

公开(公告)日：2016-02-24

申请号：EP14181392.3

申请日：2014-08-19

Applicant: ABB Technology Oy

Inventor： Agostini, Francesco ,  Torresin, Daniele ,  Habert, Mathieu ,  Agostini, Bruno

IPC: H05K7/20 ,  H01L23/427 ,  F28F9/02 ,  F28D1/053 ,  F28D15/02

CPC classification number: F28D15/043 ,  F28D15/0233 ,  F28D15/0266 ,  F28F1/022 ,  F28F9/0278 ,  H01L23/427 ,  H01L2924/0002 ,  H05K7/20336 ,  H01L2924/00

Abstract: The invention relates to a cooling element (11) comprising: a fluid channel (1) providing a pulsating heat pipe, a first evaporator (14) for receiving heat from electric components (15) and for passing the heat into fluid in the fluid channel (1), and a first condenser (18) for receiving fluid from the first evaporator (14) via the fluid channel (1) and for cooling fluid in the fluid channel. In order to obtain an even temperature distribution at the first evaporator (14) an adiabatic zone where the temperature of the fluid in the fluid channel (1) remains unchanged or a cooling zone, with a second condenser (20) cooling fluid in the fluid channel (1), separates the first evaporator (14) from the loops (6) in the second end (12) of the fluid channel.

Abstract translation: 本发明涉及一种冷却元件（11），其包括：提供脉动热管的流体通道（1），用于从电部件（15）接收热量并且将热量传递到流体通道中的流体中的第一蒸发器（14） （1）以及用于经由流体通道（1）从第一蒸发器（14）接收流体并用于冷却流体通道中的流体的第一冷凝器（18）。 为了在第一蒸发器（14）处获得流体通道（1）中的流体的温度保持不变的绝热区域或冷却区域，使用第二冷凝器（20）冷却流体中的流体 通道（1）将第一蒸发器（14）与流体通道的第二端（12）中的环（6）分隔开。

公开(公告)号：EP2985788A1

公开(公告)日：2016-02-17

申请号：EP14181005.1

申请日：2014-08-14

Applicant: ABB Technology Oy

Inventor： Kearney, Daniel ,  Agostini, Francesco ,  Cottet, Didier ,  Torresin, Daniele ,  Habert, Mathieu

IPC: H01L23/473 ,  H01L23/538 ,  H05K1/02

CPC classification number: H01L23/473 ,  H01L23/3121 ,  H01L23/5389 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K1/185 ,  H05K3/4697 ,  H05K2201/0116 ,  H05K2201/064 ,  H01L2924/00

Abstract: The present disclosure relates to a power semiconductor module comprising a printed circuit board (PCB), and to method of cooling such a power semiconductor module. The module comprises a power semiconductor device and an island of thermally conducting foam embedded into the printed circuit board. The power semiconductor device and the island of thermally conducting foam are positioned on top of each other, and the island is arranged to form a path for a flowing coolant cooling the power semiconductor device.

Abstract translation: 本发明涉及包括印刷电路板（PCB）的功率半导体模块，以及冷却这种功率半导体模块的方法。 模块包括功率半导体器件和嵌入印刷电路板的导热泡沫岛。 功率半导体器件和导热泡沫岛位于彼此的顶部，并且岛被布置成形成冷却功率半导体器件的流动冷却剂的路径。

公开(公告)号：EP2985788B1

公开(公告)日：2017-10-04

申请号：EP14181005.1

申请日：2014-08-14

Applicant: ABB Technology Oy

Inventor： Kearney, Daniel ,  Agostini, Francesco ,  Cottet, Didier ,  Torresin, Daniele ,  Habert, Mathieu

IPC: H01L23/473 ,  H01L23/538 ,  H05K1/02 ,  H01L23/373

CPC classification number: H01L23/473 ,  H01L23/3121 ,  H01L23/5389 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K1/185 ,  H05K3/4697 ,  H05K2201/0116 ,  H05K2201/064 ,  H01L2924/00

Abstract: The present disclosure relates to a power semiconductor module comprising a printed circuit board (PCB), and to method of cooling such a power semiconductor module. The module comprises a power semiconductor device and an island of thermally conducting foam embedded into the printed circuit board. The power semiconductor device and the island of thermally conducting foam are positioned on top of each other, and the island is arranged to form a path for a flowing coolant cooling the power semiconductor device.

Abstract translation: 本公开涉及包括印刷电路板（PCB）的功率半导体模块，并且涉及冷却这种功率半导体模块的方法。 该模块包括功率半导体器件和嵌入印刷电路板中的导热泡沫岛。 功率半导体器件和导热泡沫岛被定位在彼此的顶部上，并且岛被布置为形成用于冷却功率半导体器件的流动冷却剂的路径。

公开(公告)号：EP3153808A1

公开(公告)日：2017-04-12

申请号：EP15188764.3

申请日：2015-10-07

Applicant: ABB Technology Oy

Inventor： Habert, Mathieu ,  Agostini, Bruno ,  Torresin, Daniele ,  Agostini, Francesco ,  Riedel, Gernot ,  Leppänen, Veli-Matti

IPC: F28F9/02 ,  F28D15/02 ,  F28D15/04 ,  F28F1/02 ,  H05K7/20

CPC classification number: F28F1/022 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28D15/04 ,  F28F9/02 ,  F28F9/0202 ,  F28F9/18 ,  F28F21/084 ,  F28F2255/00 ,  F28F2255/16 ,  H05K7/20336

Abstract: The invention relates to a cooling apparatus (1) comprising tubes (4) containing a plurality of channels (8), a first manifold (2) and a second manifold (3) in the second end (7) which provides a fluid path between predetermined channels (8) of the tubes (4). In order to obtain a cooling apparatus providing excellent cooling, the first (2) and second (3) manifolds are solid blocks providing channel loops (10, 11), and the channels (8) of the tubes (4) are connected by the channel loops (10, 11) to other predetermined channels (8) of the tubes (4).

Abstract translation: 本发明涉及一种包括在第二端（7）中包含多个通道（8），第一歧管（2）和第二歧管（3）的管（4）的冷却装置（1），其提供 管（4）的预定通道（8）。 为了获得提供优异冷却的冷却装置，第一（2）和第二（3）歧管是提供通道环（10,11）的实心块，并且管（4）的通道（8）通过 通道环（10,11）连接到管（4）的其它预定通道（8）。

公开(公告)号：EP3026990A1

公开(公告)日：2016-06-01

申请号：EP14195342.2

申请日：2014-11-28

Applicant: ABB Technology Oy

Inventor： Habert, Mathieu ,  Agostini, Bruno ,  Agostini, Francesco

IPC: H05K7/20 ,  F25B15/10

CPC classification number: H05K7/2029 ,  F25B15/10 ,  F25B33/00 ,  H05K7/20154 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20363 ,  H05K7/20936 ,  Y02A30/277 ,  Y02B30/62

Abstract: The invention relates to an apparatus (1) utilizing a diffusion-absortion cycle for cooling electric components, the apparatus comprising a generator (5), an evaporator (6), an absorber (8) and a condenser (9) circulating a refrigerant (R), an inert (I) and an absorbent (A) in a diffusion-absorption cycle. The generator (5) and the evaporator (6) are arranged in an electric cabinet (2) to receive a heat load from primary electric components (3) and secondary electric components (4) . The absorber (8) and the condenser (9) are arranged outside of the electric cabinet (2) and at a higher level than the evaporator (6) to receive fluid from the generator (5) and the evaporator (6) and for dissipating heat from the received fluid to the surrounding environment. The inert (I) and refrigerant (R) are selected such that the inert (I) is heavier than the refrigerant (R) in order to obtain fluid circulation where the inert (I) exiting the absorber (8) flows downwards to the evaporator (6) and the inert (I) exiting the evaporator (6) flows upwards to the absorber (8).

Abstract translation: 本发明涉及一种利用扩散 - 自发循环来冷却电气部件的装置（1），该装置包括发电机（5），蒸发器（6），吸收器（8）和循环制冷剂的冷凝器（9） R），惰性（I）和吸收剂（A）。 发电机（5）和蒸发器（6）布置在电气柜（2）中以接收来自主要电气部件（3）和次级电气部件（4）的热负荷。 吸收器（8）和冷凝器（9）布置在电气柜（2）的外部并且处于比蒸发器（6）更高的水平，以接收来自发电机（5）和蒸发器（6）的流体并且用于消散 从接收的流体到周围环境的热量。 选择惰性（I）和制冷剂（R）使得惰性（I）比制冷剂（R）重，以便获得流体循环，其中离开吸收器（8）的惰性（I）向下流动到蒸发器 （6）和离开蒸发器（6）的惰性（I）向上流向吸收器（8）。

公开(公告)号：EP3196932A1

公开(公告)日：2017-07-26

申请号：EP16152173.7

申请日：2016-01-21

Applicant: ABB Technology Oy

Inventor： Skibin, Stanislav ,  Agostini, Bruno ,  Agostini, Francesco ,  Habert, Mathieu ,  Torresin, Daniele

IPC: H01L23/40 ,  H01L23/552 ,  H01L25/07 ,  H01L23/367 ,  H01L23/427

CPC classification number: H01L23/4006 ,  H01L23/367 ,  H01L23/427

Abstract: A cooled electrical assembly comprising an electric component element (2; 2b) comprising at least one electric component (21, 22 ; 21 b, 22b), a grounding element (4; 4b) adapted to ground the electric component element (2; 2b) during normal operation of the cooled electrical assembly, and a cooling element (6; 6b) adapted for transferring heat out of the electric component element (2; 2b), the cooling element (6; 6b) comprising electrically conducting material, and being attached to the electric component element (2; 2b) through assembly attachment means. The assembly attachment means are adapted to substantially prevent any grounding current from flowing in the cooling element (6; 6b) during normal operation of the cooled electrical assembly.

Abstract translation: 一种冷却的电气组件，包括：包括至少一个电气部件（21,22; 21b，22b），适于将电气部件元件（2; 2b）接地的接地元件（4; 4b） ）和冷却元件（6; 6b），所述冷却元件适于将热量从所述电气元件元件（2; 2b）传递出去，所述冷却元件（6; 6b）包括导电材料，并且所述冷却元件 通过组件连接装置连接到电气元件（2; 2b）。 组件连接装置适于在冷却电气组件的正常操作期间基本上防止任何接地电流在冷却元件（6; 6b）中流动。