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公开(公告)号：EP1022093A3
公开(公告)日：2003-04-02
申请号：EP00300520.4
申请日：2000-01-25
CPC分类号： B24B49/12 , B24B37/013 , B24B49/04
摘要： A chemical mechanical polishing apparatus includes two optical systems which are used serially to determine polishing endpoints. The first optical system includes a first light source to generate a first light beam which impinges on a surface of the substrate, and a first sensor to measure light reflected from the surface of the substrate to generate a measured first interference signal. The second optical system includes a second light source to generate a second light beam which impinges on a surface of the substrate and a second sensor to measure light reflected from the surface of the substrate to generate a measured second interference signal. The second light beam has a wavelength different from the first light beam.
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2.发明公开Method and apparatus for detecting polishing endpoint with optical monitoring 审中-公开对于终点检测与光控制的方法和装置
公开(公告)号：EP1118431A3
公开(公告)日：2003-10-15
申请号：EP00310991.5
申请日：2000-12-08
CPC分类号： B24B37/013 , B24B49/04 , B24B49/12 , H01L21/3212
摘要： An apparatus, as well as a method, brings a surface of a substrate into contact with a polishing pad that has a window, causes relative motion between the substrate and the polishing pad, and directs a light beam through the window so that the motion of the polishing pad relative to the substrate causes the light beam to move in a path across the substrate. An extreme intensity measurement is derived from a plurality of intensity measurements made as the light beam moves across the substrate. The beam sweeps across the substrate a plurality of times to generate a plurality of extreme intensity measurements, and a polishing endpoint is detected based on the plurality of extreme intensity measurements.
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3.发明公开
公开(公告)号：EP1120194A3
公开(公告)日：2003-10-15
申请号：EP01300410.6
申请日：2001-01-18
发明人： Adams, Brett A. , Swedek, Boguslaw , Bajaj, Rajeev , Nanjangud, Savitha , Wiswesser, Andreas Norbert , Tsai, Stan D. Tsai , Chan, David A. , Redeker, Fred C. , Birang, Manoocher
CPC分类号： B24B37/013 , B24B37/042 , B24B49/04 , B24B49/12 , H01L21/30625
摘要： The disclosure relates to an optical monitoring system (40) for a two-step polishing process for polishing substrates which generates a reflectance trace for each of plurality of radial zones. The CMP apparatus (20) may switch from a high-selectivity slurry to a low-selectivity slurry when any of the reflectance traces indicate initial clearance of the metal layer (16) of the substrate, and polishing may halt when all of the reflectance traces indicate that oxide layer (14) has been completely exposed.
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4.发明公开Adaptive endpoint detection for chemical mechanical polishing 审中-公开自适应Endpunkterkennungfürchemisch-mechanisches Polieren
公开(公告)号：EP1120694A2
公开(公告)日：2001-08-01
申请号：EP01300411.4
申请日：2001-01-18
CPC分类号： B24B37/205 , B24B37/013 , G05B19/4163
摘要： The disclosure relates to an apparatus (20) and method, for polishing a surface of a substrate using a polishing pad (30). A light beam is directed by an optical endpoint detection system (40), to impinge the surface of the substrate (10). A signal from the optical endpoint detection system is monitored, and if a first endpoint criterion is not detected within a first time window, polishing is stopped at a default polishing time. If the first endpoint criterion is detected within the first time window, the signal is monitored for the second endpoint criterion, and polishing stops if the second endpoint criterion is detected.
摘要翻译： 本公开涉及一种用于使用抛光垫（30）抛光衬底的表面的设备（20）和方法。 光束由光学终点检测系统（40）引导，以撞击衬底（10）的表面。 监测来自光学终点检测系统的信号，并且如果在第一时间窗口内没有检测到第一端点标准，则在默认抛光时间停止抛光。 如果在第一时间窗口内检测到第一终点标准，则监视第二终点标准的信号，并且如果检测到第二端点标准，则抛光停止。
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公开(公告)号：EP1120694A3
公开(公告)日：2003-09-24
申请号：EP01300411.4
申请日：2001-01-18
CPC分类号： B24B37/205 , B24B37/013 , G05B19/4163
摘要： The disclosure relates to an apparatus (20) and method, for polishing a surface of a substrate using a polishing pad (30). A light beam is directed by an optical endpoint detection system (40), to impinge the surface of the substrate (10). A signal from the optical endpoint detection system is monitored, and if a first endpoint criterion is not detected within a first time window, polishing is stopped at a default polishing time. If the first endpoint criterion is detected within the first time window, the signal is monitored for the second endpoint criterion, and polishing stops if the second endpoint criterion is detected.
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6.发明公开Optical monitoring in a two-step chemical mechanical polishing process 审中-公开Optische Steuerung in einem zweistufigen chemisch-mechanischen Polierverfahren
公开(公告)号：EP1120194A2
公开(公告)日：2001-08-01
申请号：EP01300410.6
申请日：2001-01-18
发明人： Adams, Brett A. , Swedek, Boguslaw , Bajaj, Rajeev , Nanjangud, Savitha , Wiswesser, Andreas Norbert , Tsai, Stan D. Tsai , Chan, David A. , Redeker, Fred C. , Birang, Manoocher
CPC分类号： B24B37/013 , B24B37/042 , B24B49/04 , B24B49/12 , H01L21/30625
摘要： The disclosure relates to an optical monitoring system (40) for a two-step polishing process for polishing substrates which generates a reflectance trace for each of plurality of radial zones. The CMP apparatus (20) may switch from a high-selectivity slurry to a low-selectivity slurry when any of the reflectance traces indicate initial clearance of the metal layer (16) of the substrate, and polishing may halt when all of the reflectance traces indicate that oxide layer (14) has been completely exposed.
摘要翻译： 本公开涉及一种用于抛光基板的两步抛光工艺的光学监控系统（40），其产生多个径向区域中的每一个的反射迹线。 当任何反射迹线表示衬底的金属层（16）的初始间隙时，CMP装置（20）可以从高选择性浆料切换到低选择性浆料，并且当所有反射轨迹 表示氧化物层（14）已经完全暴露。
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7.发明公开Method and apparatus for detecting polishing endpoint with optical monitoring 审中-公开Verfahren und Vorrichtung zur Endpunktbestimmung mit optischer Steuerung
公开(公告)号：EP1118431A2
公开(公告)日：2001-07-25
申请号：EP00310991.5
申请日：2000-12-08
CPC分类号： B24B37/013 , B24B49/04 , B24B49/12 , H01L21/3212
摘要： An apparatus, as well as a method, brings a surface of a substrate into contact with a polishing pad that has a window, causes relative motion between the substrate and the polishing pad, and directs a light beam through the window so that the motion of the polishing pad relative to the substrate causes the light beam to move in a path across the substrate. An extreme intensity measurement is derived from a plurality of intensity measurements made as the light beam moves across the substrate. The beam sweeps across the substrate a plurality of times to generate a plurality of extreme intensity measurements, and a polishing endpoint is detected based on the plurality of extreme intensity measurements.
摘要翻译： 一种装置以及一种方法使衬底的表面与具有窗口的抛光垫接触，引起衬底和抛光垫之间的相对运动，并引导光束通过窗口，使得运动 抛光垫相对于衬底导致光束在穿过衬底的路径中移动。 当光束跨越衬底移动时，从多个强度测量得出极强度测量。 光束多次扫过衬底以产生多个极强度测量，并且基于多个极强度测量来检测抛光端点。
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8.发明公开Endpoint detection with light beams of different wavelenghts 审中-公开Endpunktdetektion手套LichtbündelverschiedenerWellenlängen
公开(公告)号：EP1022093A2
公开(公告)日：2000-07-26
申请号：EP00300520.4
申请日：2000-01-25
CPC分类号： B24B49/12 , B24B37/013 , B24B49/04
摘要： A chemical mechanical polishing apparatus includes two optical systems which are used serially to determine polishing endpoints. The first optical system includes a first light source to generate a first light beam which impinges on a surface of the substrate, and a first sensor to measure light reflected from the surface of the substrate to generate a measured first interference signal. The second optical system includes a second light source to generate a second light beam which impinges on a surface of the substrate and a second sensor to measure light reflected from the surface of the substrate to generate a measured second interference signal. The second light beam has a wavelength different from the first light beam.
摘要翻译： 化学机械抛光装置包括串联地用于确定抛光端点的两个光学系统。 第一光学系统包括产生撞击在基板的表面上的第一光束的第一光源和用于测量从基板的表面反射的光以产生测量的第一干涉信号的第一传感器。 第二光学系统包括第二光源，用于产生入射到衬底的表面上的第二光束和第二传感器，用于测量从衬底的表面反射的光以产生测量的第二干涉信号。 第二光束具有与第一光束不同的波长。
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