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    Conductive polishing article for electrochemical mechanical polishing
    1.
    发明公开
    Conductive polishing article for electrochemical mechanical polishing 有权
    LeitenderPolierkörperzum elektrochemisch-mechanischen Polieren

    公开(公告)号：EP1640113A1

    公开(公告)日：2006-03-29

    申请号：EP05077958.6

    申请日：2002-04-10

    申请人： APPLIED MATERIALS, INC.

    发明人： Chen, Liang-Yuh ,  Wang, Yan ,  Wang, Yuchun ,  Duboust, Alain ,  Carl, Daniel A. ,  Birang, Manoocher ,  Mavliev, Rashid ,  Wadensweiler, Ralph ,  Butterfield, Paul D. ,  Tsai, Stan D.

    IPC分类号： B24B37/04 ,  B24D13/14 ,  B23H5/08

    CPC分类号： B24B37/26 ,  B23H5/08 ,  B24B37/24 ,  C25F7/00

    摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.

    摘要翻译： 提供了一种用于平坦化基板表面的制造和设备。 在一个方面，提供了一种用于抛光衬底的制品，所述衬底包括抛光制品，所述抛光制品包括具有适于抛光所述衬底和安装表面的至少部分导电表面的主体。 可以在抛光制品中形成多个穿孔，以使材料流过其中。 另一方面，用于抛光衬底的抛光制品包括具有抛光表面和设置在其中的导电元件的主体。 导电元件可以具有延伸超过由抛光表面限定的平面的接触表面。 抛光表面可以具有形成在其中的一个或多个凹穴。 导电元件可以设置在每个抛光槽中。

    In-situ endpoint detection and process monitoring method and apparatus for chemical mechanical polishing
    3.
    发明公开
    In-situ endpoint detection and process monitoring method and apparatus for chemical mechanical polishing 有权
    化学机械抛光的原位终点检测和过程监测方法和设备

    公开(公告)号：EP1618991A1

    公开(公告)日：2006-01-25

    申请号：EP05077315.9

    申请日：2001-05-18

    申请人： APPLIED MATERIALS, INC.

    发明人： Hanawa, Hiroji ,  Johansson, Nils ,  Swedek, Boguslaw A. ,  Birang, Manoocher ,  Redeker, Fritz C. ,  Bajaj, Rajeev

    IPC分类号： B24B37/04 ,  B24B49/02 ,  B24B49/12

    CPC分类号： B24B37/22 ,  B24B37/013 ,  B24B49/105

    摘要： A chemical mechanical polishing apparatus has a polishing pad (30), a carrier (70) to hold a substrate (10) against a first side of the polishing surface, and a motor coupled to at least one of the polishing pad (30) and carrier head (70) for generating relative motion therebetween. An eddy current monitoring system (40) is positioned to generate an alternating magnetic field in proximity to the substrate (10), an optical monitoring system (140) generates a light beam and detects reflections of the light beam from the substrate (10), and a controller (90) receives signals from the eddy current monitoring system (40) and the optical monitoring system (140).

    摘要翻译： 一种化学机械抛光设备具有抛光垫（30），将基板（10）保持在抛光表面的第一侧上的托架（70），以及与抛光垫（30）和 载体头（70），用于在它们之间产生相对运动。 涡电流监测系统（40）被定位成产生邻近的交变磁场，以在基板（10），光学监控系统（140）产生的光束，并检测从所述衬底的光束的反射（10）， 和控制器（90）接收来自涡流监视系统（40）和光学监视系统（140）的信号。

    Determining when to replace a retaining ring used in substrate polishing operations
    5.
    发明公开
    Determining when to replace a retaining ring used in substrate polishing operations 审中-公开
    确定用于替换在抛光方法中使用的基板的保持环

    公开(公告)号：EP1065030A3

    公开(公告)日：2003-06-11

    申请号：EP00304382.5

    申请日：2000-05-24

    申请人： Applied Materials, Inc.

    发明人： Chen, Hung Chih ,  Zuniga, Steven M. ,  Adams, Bret W. ,  Birang, Manoocher ,  Chew, Kean

    IPC分类号： B24B37/04 ,  B24B41/06 ,  B24B55/00 ,  B24B49/12

    CPC分类号： B24B37/32 ,  B24B49/12

    摘要： Apparatus and methods of polishing substrates are disclosed. A retaining ring (22) for a polishing apparatus includes an inner surface exposed to contact a peripheral edge of a substrate to be polished against a polishing surface, a bottom surface (32) exposed to contact the polishing surface while the substrate is being polished, and a wear marker (33) indicative of a preselected amount of wear of the bottom surface (32). The inner surface, bottom surface (32) and wear marker (38) may form part of a retaining ring (22) used in chemical mechanical polishing operations. In one method, one or more substrates may be polished against a polishing surface using the retaining ring (22), and at least a portion of the retainer may be replaced when the bottom surface (32) has been worn away by the preselected amount indicated by the wear marker (38). In another method, one or more substrate may be polished against a polishing surface with a substrate carrier that includes a substrate retaining ring with a wear marker indicative of a preselected amount of wear of the retaining ring, and a warning signal may be generated upon detection of the wear marker.

    Adaptive endpoint detection for chemical mechanical polishing
    6.
    发明公开
    Adaptive endpoint detection for chemical mechanical polishing 审中-公开
    自适应Endpunkterkennungfürchemisch-mechanisches Polieren

    公开(公告)号：EP1120694A2

    公开(公告)日：2001-08-01

    申请号：EP01300411.4

    申请日：2001-01-18

    申请人： Applied Materials, Inc.

    发明人： Birang, Manoocher ,  Swedek, Boguslaw

    IPC分类号： G05B19/18 ,  B24B37/04

    CPC分类号： B24B37/205 ,  B24B37/013 ,  G05B19/4163

    摘要： The disclosure relates to an apparatus (20) and method, for polishing a surface of a substrate using a polishing pad (30). A light beam is directed by an optical endpoint detection system (40), to impinge the surface of the substrate (10). A signal from the optical endpoint detection system is monitored, and if a first endpoint criterion is not detected within a first time window, polishing is stopped at a default polishing time. If the first endpoint criterion is detected within the first time window, the signal is monitored for the second endpoint criterion, and polishing stops if the second endpoint criterion is detected.

    摘要翻译： 本公开涉及一种用于使用抛光垫（30）抛光衬底的表面的设备（20）和方法。 光束由光学终点检测系统（40）引导，以撞击衬底（10）的表面。 监测来自光学终点检测系统的信号，并且如果在第一时间窗口内没有检测到第一端点标准，则在默认抛光时间停止抛光。 如果在第一时间窗口内检测到第一终点标准，则监视第二终点标准的信号，并且如果检测到第二端点标准，则抛光停止。

    System for chemical mechanical planarization
    8.
    发明公开
    System for chemical mechanical planarization 审中-公开
    用于化学机械Planarizieren的装置

    公开(公告)号：EP1052061A2

    公开(公告)日：2000-11-15

    申请号：EP00303716.5

    申请日：2000-05-03

    申请人： Applied Materials, Inc.

    发明人： Tietz, James T. ,  Li, Shijian ,  Birang, Manoocher ,  White, John M. ,  Rosenberg, Lawrence M. ,  Scales, Martin ,  Emami, Ramin

    IPC分类号： B24B37/04 ,  B24B49/14 ,  H01L21/306

    CPC分类号： B24B57/02 ,  B24B21/04 ,  B24B21/18 ,  B24B37/12 ,  B24B49/14 ,  B24B55/02 ,  H01L21/30625

    摘要： A semiconductor substrate processing system for polishing a substrate includes a platen (23) and a web (252) of polishing material disposed thereon. The system include a first fluid delivery arm (154) and a second fluid delivery arm (156) respectively adapted to dispose a first and a second polishing fluid on the polishing material. A sensor (226) produces a signal indicative of the temperature of the polishing process. An analyzer for determining a polishing metric from a polishing fluid disposed on the polishing material. A method for processing comprises the steps of sensing an indicia of a polishing metric, and regulating a rate of material removal. The step of regulating the rate of material removal may comprise steps such as changing the temperature of a fluid circulated and changing the chemistry of the polishing fluids. The step of sensing the indicia may include analyzing the effluent and sensing temperature.

    Electrostatic chuck
    10.
    发明公开
    Electrostatic chuck 失效
    静电吸盘

    公开(公告)号：EP0755066A1

    公开(公告)日：1997-01-22

    申请号：EP96111631.6

    申请日：1996-07-18

    申请人： APPLIED MATERIALS, INC.

    发明人： Sherstinsky, Semyon ,  Birang, Manoocher ,  Cameron, John F. ,  Mak, Alfred ,  Shamouilian, Shamouil ,  Tam, Simon W. ,  Ryan, Robert E.

    IPC分类号： H01L21/00 ,  C23C16/44

    CPC分类号： H02N13/00 ,  C23C16/4586 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6833 ,  Y10T279/23

    摘要： An electrostatic chuck 20 of the present invention is capable of maintaining substantially uniform temperatures across a substrate 30 . The chuck 20 comprises an electrostatic member 35 that includes (i) an insulator 45 covering an electrode 40 , (ii) a substantially planar and conformal contact surface 50 capable of conforming to a substrate 30 , and (iii) conduits 105 terminating at the contact surface 50 for providing heat transfer fluid to the contact surface 50 . Application of a voltage to the electrode 40 of the electrostatic member 35 electrostatically holds the substrate 30 on the conformal contact surface 50 to define an outer periphery 110 having (1) leaking portions 115 where heat transfer fluid leaks out, and (2) sealed portions 130 where heat transfer fluid substantially does not leak out. A fluid flow regulator 135 is provided for flowing heat transfer fluid at different flow rates through the conduits 105 in the electrostatic member 35 to provide (i) first flow rates of heat transfer fluid through the conduits 105 adjacent to the sealed portions 130 of the outer periphery 110 of the electrostatic member 35 , and (ii) second flow rates of heat transfer fluid through the conduits 105 adjacent to the leaking portions 115 , the second flow rates being higher than the first flow rates, to maintain substantially uniform temperatures across the substrate 30 held on the chuck 20 .

    摘要翻译： 本发明的静电吸盘20能够保持基片30上的基本上均匀的温度。吸盘20包括静电元件35，该静电元件35包括（i）覆盖电极40的绝缘体45，（ii）基本平坦的保形接触 （iii）终止于接触表面50的导管105，用于向接触表面50提供热传递流体。向静电构件35的电极40施加电压，静电地保持基底 30限定在共形接触表面50上以限定外周110，该外周110具有（1）传热流体泄漏出的泄漏部分115，以及（2）传热流体基本不泄漏的密封部分130。 提供流体流量调节器135，用于使不同流量的传热流体流过静电构件35中的导管105，以提供（i）传热流体通过邻近外部的密封部分130的导管105的第一流速 （ii）传热流体通过邻近泄漏部分115的导管105的第二流速，第二流速高于第一流速，以保持整个基底的基本上均匀的温度 30保持在卡盘20上。