公开(公告)号：EP2524763A4

公开(公告)日：2016-10-05

申请号：EP10835925

申请日：2010-12-06

申请人： ARAKAWA CHEM IND ,  TOYOTA MOTOR CO LTD ,  DENSO CORP ,  FUJITSU TEN LTD ,  KOKI COMPANY LTD ,  HARIMA CHEMICALS INC

发明人： IWAMURA EIJI ,  GOTOH KAZUSHI ,  ISHIGA FUMIO ,  YOSHIOKA TAKAYASU ,  UTSUNO MASAYOSHI ,  NAKAMURA ATSUO ,  OKOCHI TERUO ,  SANJI MASAKI ,  SUKEKAWA TAKUJI ,  IKEDO KENSHI ,  ANDOH YOSHIYUKI ,  SHIRAI TAKESHI ,  MORI KIMIAKI ,  WADA RIE ,  NAKANISHI KENSUKE ,  AIHARA MASAMI ,  KUMAMOTO SEISHI

IPC分类号： B23K35/363 ,  B23K35/26 ,  C22C12/00 ,  C22C13/00 ,  H05K3/34

CPC分类号： B23K35/3613 ,  B23K35/362 ,  C22C12/00 ,  C22C13/00 ,  H05K3/3484

摘要： Disclosed is a solder paste that includes, within a flux, an activator that has: a dibasic acid with a molecular weight of no more than 250, a monobasic acid with a molecular weight in the range of 150 to 300, and a dibasic acid with a molecular weight in the range of 300 to 600; and at least one resin additive that is selected from among the group comprising high-density polyethylenes and polypropylenes. The solder paste has in the range of 4 wt% to 12 wt% resin additive within the flux, and the viscosity of the solder paste at 80°C is at least 400 Pa·s.

公开(公告)号：EP2511043A4

公开(公告)日：2016-06-29

申请号：EP10835926

申请日：2010-12-06

申请人： ARAKAWA CHEM IND ,  TOYOTA MOTOR CO LTD ,  DENSO CORP ,  FUJITSU TEN LTD ,  KOKI COMPANY LTD ,  HARIMA CHEMICALS INC

发明人： IWAMURA EIJI ,  GOTOH KAZUSHI ,  NAGASAKA SHINSUKE ,  YOSHIOKA TAKAYASU ,  UTSUNO MASAYOSHI ,  NAKAMURA ATSUO ,  OKOCHI TERUO ,  SANJI MASAKI ,  SUKEKAWA TAKUJI ,  IKEDO KENSHI ,  ANDOH YOSHIYUKI ,  SHIRAI TAKESHI ,  MORI KIMIAKI ,  WADA RIE ,  NAKANISHI KENSUKE ,  AIHARA MASAMI ,  KUMAMOTO SEISHI

IPC分类号： B23K35/363 ,  B23K35/02 ,  B23K35/26 ,  B23K35/36 ,  B23K35/362 ,  C22C13/00

CPC分类号： B23K35/362 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3613 ,  C22C13/00 ,  H05K3/3489

摘要： Disclosed is a solder paste which has adequate fluidity even after a shear force is repeatedly applied thereto by a screen printing method or the like. Specifically disclosed is a flux for a solder paste, which contains: an acrylic resin that is obtained by radically copolymerizing a (meth)acrylic acid ester having a C 6 -C 15 alkyl group and a (meth)acrylic acid ester other than the above-mentioned (meth)acrylic acid ester; and a rosin. When the weight of the rosin is taken as 1, the weight ratio of the acrylic resin is 0.5-1.2 (inclusive), and the flux for a solder paste is fluidized by the application of a shear force of 10-150 Pa (inclusive).

公开(公告)号：EP2821451A4

公开(公告)日：2015-08-26

申请号：EP13754029

申请日：2013-03-02

申请人： ARAKAWA CHEM IND ,  PELNOX CO LTD

发明人： IWAMURA EIJI ,  KOBAYASHI MASAKI ,  MOROZUMI YASUTAKA ,  TAKAHASHI NAOYA

IPC分类号： C09D201/00 ,  C09D5/32 ,  C09D7/12

CPC分类号： C09K5/14 ,  C08K3/0033 ,  C08K3/0041 ,  C08K3/013 ,  C08K3/014 ,  C08L33/08 ,  C09D5/32 ,  C09D7/1283 ,  C09D7/69 ,  C09D133/00 ,  C09D161/28 ,  C09D163/00 ,  C09D167/00 ,  C09D175/04 ,  C09D201/00 ,  Y10T428/31511 ,  Y10T428/31609 ,  Y10T428/31663

摘要： The present invention provides a heat dissipating coating composition in a liquid or paste form for application to a heat generating article, comprising an infrared absorbing binder resin (A), infrared absorbing inorganic particles (B), and an organic solvent, having such proportions of the component (A) and the component (B) that the component (A) is 10 to 70 vol% and the component (B) is 90 to 30 vol% based on the total of both components being 100 vol%, and satisfying conditions 1, 2, and 3 specified herein, and also provides a heat dissipating coating film obtained by applying the heat dissipating coating composition to a heat dissipating article and then thermally curing the composition.

摘要翻译： 本发明提供一种液体或糊状形式的散热涂料组合物，用于发热制品，其包含红外吸收性粘合剂树脂（A），红外线吸收性无机颗粒（B）和有机溶剂，其比例为 组分（A）和组分（B）组分（A）为10至70体积％，组分（B）基于两种组分的总量为100体积％为90至30体积％，并满足条件 此外，还提供了通过将散热涂料组合物涂布在散热物品上，然后热固化该组合物而获得的散热涂膜。