公开(公告)号：EP3254800A4

公开(公告)日：2018-07-11

申请号：EP16746731

申请日：2016-02-05

申请人： KOKI COMPANY LTD

发明人： YUKIKATA KAZUHIRO ,  SATO YUUSUKE ,  AOKI JUNICHI ,  FURUSAWA MITSUYASU ,  MORI KIMIAKI

IPC分类号： B23K35/362 ,  B23K35/26 ,  B23K35/36 ,  C07C33/42 ,  C07C43/17 ,  C07C43/176 ,  C07C69/63 ,  C07C69/76 ,  C07C271/16 ,  C07C271/28 ,  C22C13/00

CPC分类号： B23K35/3616 ,  B23K35/26 ,  B23K35/262 ,  B23K35/362 ,  C07C33/423 ,  C07C43/17 ,  C07C43/176 ,  C07C69/63 ,  C07C69/76 ,  C07C271/16 ,  C07C271/28 ,  C22C13/00

摘要： Provided is a flux activator containing a halogen compound represented by formula 1 below: where X 1 and X 2 represent different halogen atoms, R 1 and R 2 are each a group represented by any one of formulas -OH, -O-R 3 , -0-C(=O)-R 4 , and -O-C(=O)-NH-R 5 , R 1 and R 2 optionally represent the same group or different groups, R 3 , R 4 , and R 5 are each an aromatic hydrocarbon group having 1 to 18 carbon atoms or an aliphatic hydrocarbon group having 1 to 18 carbon atoms, and R 3 , R 4 , and R 5 optionally represent the same group or different groups.

公开(公告)号：EP3112080A4

公开(公告)日：2017-11-29

申请号：EP15752620

申请日：2015-02-19

申请人： KOKI COMPANY LTD

发明人： IRISAWA ATSUSHI ,  WADA RIE

IPC分类号： B23K35/26 ,  B23K35/02 ,  B23K35/36 ,  C22C13/02 ,  H01L21/60 ,  H05K3/34

CPC分类号： B23K35/262 ,  B23K35/0222 ,  B23K35/26 ,  B23K35/36 ,  B23K2201/40 ,  C22C13/02 ,  H01L24/16 ,  H01L2224/13611 ,  H01L2224/1362 ,  H01L2224/13639 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2924/01032 ,  H01L2924/014 ,  H05K3/3463

摘要： Provided are a lead-free solder alloy which consists of Sb in an amount of more than 3.0% but 10% or less by mass, and the balance including Sn, and others.

公开(公告)号：EP2623253A4

公开(公告)日：2016-11-23

申请号：EP11828490

申请日：2011-03-09

申请人： KOKI COMPANY LTD ,  PANASONIC CORP

发明人： IRISAWA ATSUSHI ,  KASHIWABARA MASASHI ,  KONDO KENJI ,  HIDAKA MASAHITO

IPC分类号： B23K35/363 ,  B23K35/02 ,  B23K35/26 ,  B23K35/36 ,  B23K35/362 ,  C22C1/04 ,  C22C13/00 ,  C22C13/02 ,  H05K3/12 ,  H05K3/34

CPC分类号： B23K35/262 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3616 ,  B23K35/3618 ,  B23K35/362 ,  C22C1/0483 ,  C22C13/00 ,  H05K3/1216 ,  H05K3/3463 ,  H05K3/3484 ,  H05K3/3489

摘要： The object of the present invention is to provide a solder paste that enables to form a surface mounting structure for electronic components that exhibits crack resistance in a solder joint section even in 100 heat-shock cycles at -40°C to 150°C as required for use in the vicinity of engines for vehicular applications. A flux including an amine halogen salt and a dicarboxylic acid is kneaded with a Sn-Ag-Bi-In alloy powder. As a result, a solder paste exhibiting long continuous printability, little occurrence of solder balls, and excellent joining ability with no cracking in 100 heat-shock cycles at - 40°C to 150°C is obtained.

公开(公告)号：EP2524763A4

公开(公告)日：2016-10-05

申请号：EP10835925

申请日：2010-12-06

申请人： ARAKAWA CHEM IND ,  TOYOTA MOTOR CO LTD ,  DENSO CORP ,  FUJITSU TEN LTD ,  KOKI COMPANY LTD ,  HARIMA CHEMICALS INC

发明人： IWAMURA EIJI ,  GOTOH KAZUSHI ,  ISHIGA FUMIO ,  YOSHIOKA TAKAYASU ,  UTSUNO MASAYOSHI ,  NAKAMURA ATSUO ,  OKOCHI TERUO ,  SANJI MASAKI ,  SUKEKAWA TAKUJI ,  IKEDO KENSHI ,  ANDOH YOSHIYUKI ,  SHIRAI TAKESHI ,  MORI KIMIAKI ,  WADA RIE ,  NAKANISHI KENSUKE ,  AIHARA MASAMI ,  KUMAMOTO SEISHI

IPC分类号： B23K35/363 ,  B23K35/26 ,  C22C12/00 ,  C22C13/00 ,  H05K3/34

CPC分类号： B23K35/3613 ,  B23K35/362 ,  C22C12/00 ,  C22C13/00 ,  H05K3/3484

摘要： Disclosed is a solder paste that includes, within a flux, an activator that has: a dibasic acid with a molecular weight of no more than 250, a monobasic acid with a molecular weight in the range of 150 to 300, and a dibasic acid with a molecular weight in the range of 300 to 600; and at least one resin additive that is selected from among the group comprising high-density polyethylenes and polypropylenes. The solder paste has in the range of 4 wt% to 12 wt% resin additive within the flux, and the viscosity of the solder paste at 80°C is at least 400 Pa·s.

公开(公告)号：EP2511043A4

公开(公告)日：2016-06-29

申请号：EP10835926

申请日：2010-12-06

申请人： ARAKAWA CHEM IND ,  TOYOTA MOTOR CO LTD ,  DENSO CORP ,  FUJITSU TEN LTD ,  KOKI COMPANY LTD ,  HARIMA CHEMICALS INC

发明人： IWAMURA EIJI ,  GOTOH KAZUSHI ,  NAGASAKA SHINSUKE ,  YOSHIOKA TAKAYASU ,  UTSUNO MASAYOSHI ,  NAKAMURA ATSUO ,  OKOCHI TERUO ,  SANJI MASAKI ,  SUKEKAWA TAKUJI ,  IKEDO KENSHI ,  ANDOH YOSHIYUKI ,  SHIRAI TAKESHI ,  MORI KIMIAKI ,  WADA RIE ,  NAKANISHI KENSUKE ,  AIHARA MASAMI ,  KUMAMOTO SEISHI

IPC分类号： B23K35/363 ,  B23K35/02 ,  B23K35/26 ,  B23K35/36 ,  B23K35/362 ,  C22C13/00

CPC分类号： B23K35/362 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3613 ,  C22C13/00 ,  H05K3/3489

摘要： Disclosed is a solder paste which has adequate fluidity even after a shear force is repeatedly applied thereto by a screen printing method or the like. Specifically disclosed is a flux for a solder paste, which contains: an acrylic resin that is obtained by radically copolymerizing a (meth)acrylic acid ester having a C 6 -C 15 alkyl group and a (meth)acrylic acid ester other than the above-mentioned (meth)acrylic acid ester; and a rosin. When the weight of the rosin is taken as 1, the weight ratio of the acrylic resin is 0.5-1.2 (inclusive), and the flux for a solder paste is fluidized by the application of a shear force of 10-150 Pa (inclusive).

公开(公告)号：EP2826589A4

公开(公告)日：2016-04-20

申请号：EP13761926

申请日：2013-03-11

申请人： KOKI COMPANY LTD

发明人： ARAI KENJI ,  FURUSAWA MITSUYASU ,  AOKI JUNICHI ,  TAKADA MAYUMI ,  NAKATSUMA MUNEHIKO

IPC分类号： B23K35/36 ,  B23K35/362 ,  H05K1/03 ,  H05K3/34

CPC分类号： H05K3/3489 ,  B23K35/36 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/3618 ,  B23K35/362 ,  H05K1/0346 ,  H05K13/0465