公开(公告)号：EP1956114A1

公开(公告)日：2008-08-13

申请号：EP07090013.9

申请日：2007-01-30

申请人： ATOTECH Deutschland GmbH

发明人： Hirsekorn, Isabel-Roda ,  Rossenbeck, Britta, Dr. ,  Schreier, Hans-Jürgen, Dr. ,  Sebald, Christian ,  Wegricht, Jens ,  Beck, Thomas ,  Kuldip, Singh Johal

IPC分类号： C23C18/31 ,  C23C18/42 ,  H05K3/24

CPC分类号： H05K3/244 ,  C23C18/1651 ,  C23C18/32 ,  C23C18/44 ,  C23C18/54 ,  H01L24/11 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/3463 ,  H05K2201/0338 ,  H05K2203/072 ,  H05K2203/073 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： To achieve good solder performance with Pd-free solder to a BGA design, a layer assembly comprising first, second and, optionally, third sub-layers is provided, wherein said first sub-layer comprises a first material, said first material comprising nickel and phosphorus and said first sub-layer being in contact with said second sub-layer; said second sub-layer comprises a second material, said second material comprising palladium and phosphorus and said second sub-layer being in contact with said first sub-layer and said third sub-layer and wherein said second sub-layer is at least 0.1 µm thick; and said third sub-layer comprises a third material, said third material consisting of gold or a gold alloy and said third sub-layer being in contact with said second sub-layer. Such layer assembly is coated to the copper structure which is provided on one or on both sides of the carrier corpus of a circuit carrier.

摘要翻译： 为了实现用Pd-无铅焊料到BGA设计中，层组件包括第一，第二和任选的第三子层良好的焊料性能设置，worin所述第一子层包括第一材料，所述第一材料包含镍和 磷和所述第一子层与所述第二子层接触; 所述第二子层包括第二材料，所述第二材料包括钯，磷和所述第二子层具有与所述第一子层接触和所述第三子层和worin所述第二子层为至少0.1微米 厚; 和所述第三子层包括第三材料，所述第三材料由金或金合金，并且所述第三子层与所述第二子层接触。 搜索层组件被涂覆到铜结构中的所有其设置在一个或上的电路载波的载波语料库的bothsides。