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公开(公告)号：EP3954971A1
公开(公告)日：2022-02-16
申请号：EP21199845.5
申请日：2018-04-20
摘要： An apparatus comprises a cylinder that has a conductive material of a varying thickness around a circumference of the cylinder; wherein the thickness varies as a function of an angle of the cylinder, the varying thickness providing a varying response of the conductive material to a magnetic field having a non-zero frequency. The magnetic field produces an eddy current in the conductive material which generates a reflected magnetic field; wherein the varying response causes the reflected magnetic field to vary in strength around the circumference of the conductive material to permit detection of the angle of the cylinder.
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公开(公告)号：EP3783646A3
公开(公告)日：2021-03-10
申请号：EP20188658.7
申请日：2020-07-30
IPC分类号： H01L23/522 , H01L23/48 , H01L23/64 , H01L21/762 , H01L27/12
摘要： Methods and apparatus for a signal isolator IC package including a die having a first die portion isolated from a second die portion. The first die portion is surrounded on six sides by first insulative material and the second die portion is surrounded on six sides by second insulative material. The first die portion provides a first voltage domain and the second die portion provides a second voltage domain. The signal isolator comprises a first signal path between the first die portion and the second die portion, wherein the first signal path is isolated with respect to the first and second die portions.
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公开(公告)号：EP3783646A2
公开(公告)日：2021-02-24
申请号：EP20188658.7
申请日：2020-07-30
IPC分类号： H01L23/522
摘要： Methods and apparatus for a signal isolator IC package including a die having a first die portion isolated from a second die portion. The first die portion is surrounded on six sides by first insulative material and the second die portion is surrounded on six sides by second insulative material. The first die portion provides a first voltage domain and the second die portion provides a second voltage domain. The signal isolator comprises a first signal path between the first die portion and the second die portion, wherein the first signal path is isolated with respect to the first and second die portions.
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