SINGLE CHIP SIGNAL ISOLATOR
    1.
    发明公开

    公开(公告)号:EP3783646A3

    公开(公告)日:2021-03-10

    申请号:EP20188658.7

    申请日:2020-07-30

    摘要: Methods and apparatus for a signal isolator IC package including a die having a first die portion isolated from a second die portion. The first die portion is surrounded on six sides by first insulative material and the second die portion is surrounded on six sides by second insulative material. The first die portion provides a first voltage domain and the second die portion provides a second voltage domain. The signal isolator comprises a first signal path between the first die portion and the second die portion, wherein the first signal path is isolated with respect to the first and second die portions.

    SINGLE CHIP SIGNAL ISOLATOR
    2.
    发明公开

    公开(公告)号:EP3783646A2

    公开(公告)日:2021-02-24

    申请号:EP20188658.7

    申请日:2020-07-30

    IPC分类号: H01L23/522

    摘要: Methods and apparatus for a signal isolator IC package including a die having a first die portion isolated from a second die portion. The first die portion is surrounded on six sides by first insulative material and the second die portion is surrounded on six sides by second insulative material. The first die portion provides a first voltage domain and the second die portion provides a second voltage domain. The signal isolator comprises a first signal path between the first die portion and the second die portion, wherein the first signal path is isolated with respect to the first and second die portions.