公开(公告)号：EP2975638A1

公开(公告)日：2016-01-20

申请号：EP14177084.2

申请日：2014-07-15

申请人： Applied Materials Switzerland Sàrl

发明人： Straube, Ralph

IPC分类号： H01L21/673 ,  B28D5/00 ,  H01L21/677

CPC分类号： H01L21/67363 ,  B28D5/0082 ,  H01L21/67386 ,  H01L21/67772

摘要： A carrier for a semiconductor ingot is configured for top-loading and side-loading of a semiconductor ingot. The carrier includes a holder which attaches to the semiconductor ingot and can be placed at the top of a container. A side member is movable between an open position for side-loading and a closed position. A processing apparatus may move the side member of the carrier between the open and closed positions, and is configured to load and unload the semiconductor ingot from the carrier by side-loading and side-unloading.

摘要翻译： 一种用于半导体晶锭载波被配置为顶装式和半导体晶锭的侧载。 所述载体包括保持器在固定于半导体晶锭，并且可以在一个容器的顶部放置的位置。 甲侧构件为侧部装载在打开位置和闭合位置之间移动。 一种处理装置可以移动至打开和关闭位置之间的载体的侧部构件，并且被配置成加载和卸载由侧装载和侧卸载载体中的半导体晶锭。