公开(公告)号：EP2090145A2

公开(公告)日：2009-08-19

申请号：EP08735041.9

申请日：2008-04-04

Applicant: ATOTECH Deutschland GmbH

Inventor： HÜLSMANN, Thomas ,  SPARING, Christian ,  BRUNNER, Heiko ,  FROESE, Bernd

IPC: H05K3/38 ,  B32B7/04 ,  B32B15/14 ,  B32B15/20 ,  B32B27/26 ,  B32B27/04

CPC classification number: B32B7/04 ,  B32B15/14 ,  B32B15/20 ,  B32B27/04 ,  B32B27/26 ,  C08G77/04 ,  C09J4/00 ,  H05K3/244 ,  H05K3/389

Abstract: The invention provides silane compositions which are useful as adhesives, in particular in the preparation of multi-layer laminates such as printed circuit boards. The silane compositions comprise at least one coupling agent selected from the group consisting of (A-1) a silane coupling agent of the formula A (4-x) SiB x (wherein A is a hydrolyzable group, x is 1 to 3, and B is as defined in the description); (A-2) a silane coupling agent of the formula X-{B-[R-Si(A) 3 ] z } x (wherein X is a linear or branched hydrocarbon chain containing from 5 to 10 carbon atoms, B is a divalent or trivalent hetero atom, A is a hydrolyzable group and R, z and x are as defined in the description); (A-3) a tetraorgano silane coupling agent of the formula Si(OR) 4 (wherein R is hydrogen, alkyl, aryl, aralkyl, allyl or alkenyl); and (A-4) a water soluble silicate coupling agent characterized by the formula SiO 2 €¢ x M 2 O (wherein x is 1 to 4, and M is an alkali metal or ammonium ion); and (B) a colloidal silica; with the proviso that (a) said colloidal silica (B) is optional if at least one of compounds (A-3) or (A-4) is present; and (b) said colloidal silica (B) is mandatory if none of compounds (A-3) or (A-4) is present. The invention further provides the use of such silane compositions for the production of multilayer circuit boards and the multilayer circuit boards thus obtained.

公开(公告)号：EP3380649B1

公开(公告)日：2019-10-30

申请号：EP16801528.7

申请日：2016-11-28

Applicant: Atotech Deutschland GmbH

Inventor： WALTER, Andreas ,  SUCHENTRUNK, Christof ,  BECK, Thomas ,  STEINBERGER, Gerhard ,  BERA, Holger ,  BRUNNER, Heiko ,  FROESE, Bernd

IPC: C23C18/44 ,  H01L21/288 ,  H05K3/24

公开(公告)号：EP2090145B1

公开(公告)日：2014-05-21

申请号：EP08735041.9

申请日：2008-04-04

Applicant: Atotech Deutschland GmbH

Inventor： HÜLSMANN, Thomas ,  SPARING, Christian ,  BRUNNER, Heiko ,  FROESE, Bernd

IPC: H05K3/38 ,  B32B7/04 ,  B32B15/14 ,  B32B15/20 ,  B32B27/26 ,  B32B27/04

CPC classification number: B32B7/04 ,  B32B15/14 ,  B32B15/20 ,  B32B27/04 ,  B32B27/26 ,  C08G77/04 ,  C09J4/00 ,  H05K3/244 ,  H05K3/389

Abstract: The invention provides silane compositions which are useful as adhesives, in particular in the preparation of multi-layer laminates such as printed circuit boards. The silane compositions comprise at least one coupling agent selected from the group consisting of (A-1) a silane coupling agent of the formula A (4-x) SiB x (wherein A is a hydrolyzable group, x is 1 to 3, and B is as defined in the description); (A-2) a silane coupling agent of the formula X-{B-[R-Si(A) 3 ] z } x (wherein X is a linear or branched hydrocarbon chain containing from 5 to 10 carbon atoms, B is a divalent or trivalent hetero atom, A is a hydrolyzable group and R, z and x are as defined in the description); (A-3) a tetraorgano silane coupling agent of the formula Si(OR) 4 (wherein R is hydrogen, alkyl, aryl, aralkyl, allyl or alkenyl); and (A-4) a water soluble silicate coupling agent characterized by the formula SiO 2 €¢ x M 2 O (wherein x is 1 to 4, and M is an alkali metal or ammonium ion); and (B) a colloidal silica; with the proviso that (a) said colloidal silica (B) is optional if at least one of compounds (A-3) or (A-4) is present; and (b) said colloidal silica (B) is mandatory if none of compounds (A-3) or (A-4) is present. The invention further provides the use of such silane compositions for the production of multilayer circuit boards and the multilayer circuit boards thus obtained.

公开(公告)号：EP3380649A1

公开(公告)日：2018-10-03

申请号：EP16801528.7

申请日：2016-11-28

Applicant: Atotech Deutschland GmbH

Inventor： WALTER, Andreas ,  SUCHENTRUNK, Christof ,  BECK, Thomas ,  STEINBERGER, Gerhard ,  BERA, Holger ,  BRUNNER, Heiko ,  FROESE, Bernd

IPC: C23C18/44 ,  H01L21/288 ,  H05K3/24

Abstract: The invention relates to an aqueous plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous plating bath composition according to the invention comprises a source for palladium ions, a reducing agent for palladium ions and an unsaturated compound. The aqueous plating bath composition according to the invention has an improved stability against undesired decomposition due to the unsaturated compounds while keeping the deposition rate for palladium at the desired satisfying value. The aqueous plating bath composition has also a prolonged life time. The unsaturated compounds of the invention allow for adjusting the deposition rate to a satisfying range over the bath life time and for electrolessly depositing palladium layers at lower temperatures.