公开(公告)号：EP2754732A1

公开(公告)日：2014-07-16

申请号：EP13151243.6

申请日：2013-01-15

申请人： Atotech Deutschland GmbH

发明人： Lützow, Dr. Norbert ,  Schmidt, Gabriela ,  Tews, Dr. Dirk

IPC分类号： C23C22/52 ,  C23F1/18 ,  H05K3/06 ,  H05K3/38

CPC分类号： C23F1/18 ,  C23F1/02 ,  C23F1/46 ,  H05K3/067 ,  H05K2203/0789

摘要： The present invention relates to an aqueous composition for and a process for etching copper and copper alloys applying said aqueous composition. The aqueous composition comprises a source for Fe 3+ ions, at least one acid, at least one triazole or tetrazole derivative, and at least one etching additive selected from N-alkylated iminodipropionic acid, salts thereof, modified polyglycol ethers and quaternary ureylene polymers. The aqueous composition is particularly useful for making of fine structures in the manufacture of printed circuit boards, IC substrates and the like.

摘要翻译： 本发明涉及一种用于蚀刻应用所述含水组合物的铜和铜合金的水性组合物和方法。 含水组合物包含Fe 3+离子源，至少一种酸，至少一种三唑或四唑衍生物，以及至少一种选自N-烷基化亚氨基二丙酸，其盐，改性聚乙二醇醚和季戊烯聚合物的蚀刻添加剂。 含水组合物特别可用于制造印刷电路板，IC基板等中的精细结构。

公开(公告)号：EP3034654A1

公开(公告)日：2016-06-22

申请号：EP14199223.0

申请日：2014-12-19

申请人： Atotech Deutschland GmbH

发明人： Lager, Markku ,  Clicque, Arno ,  Tews, Dr. Dirk

IPC分类号： C23F1/18 ,  H05K3/06 ,  H05K3/38

CPC分类号： C23F1/18 ,  C23C28/321 ,  C23F1/46 ,  C23G1/103 ,  H05K3/062 ,  H05K3/064 ,  H05K3/383 ,  H05K2203/124

摘要： The present invention is related to a composition for micro etching of a copper or a copper alloy surface, wherein the composition comprises
i) at least a source of Fe 3+ ions,
ii) at least a source of Br- ions,
iii) at least an inorganic acid, and
iv) at least one etch refiner according to formula I

wherein R1 is selected from the group consisting of hydrogen, C 1 -C 5 -alkyl or a substituted aryl or alkaryl group; R2 is selected from the group consisting of hydrogen, C 1 -C 5 -alkyl or C 1 -C 5 -alkoxy; R3, R4 are selected from the group consisting of hydrogen and C 1 -C 5 -alkyl; and X- is a suitable anion.
Further, the present invention is directed to a method for micro etching of copper or copper alloy surfaces using such a composition.

摘要翻译： 本发明涉及一种用于铜或铜合金表面的微蚀刻的组合物，其中所述组合物包括：i）至少一种Fe 3+离子源，ii）至少一种Br离子源，iii）在 至少一种无机酸，和iv）至少一种根据式I的蚀刻精炼剂，其中R 1选自氢，C 1 -C 5 - 烷基或取代的芳基或烷芳基; R 2选自氢，C 1 -C 5 - 烷基或C 1 -C 5 - 烷氧基; R 3，R 4选自氢和C 1 -C 5 - 烷基; 而X-是合适的阴离子。 此外，本发明涉及使用这种组合物对铜或铜合金表面进行微蚀刻的方法。

公开(公告)号：EP2754732B1

公开(公告)日：2015-03-11

申请号：EP13151243.6

申请日：2013-01-15

申请人： Atotech Deutschland GmbH

发明人： Lützow, Dr. Norbert ,  Schmidt, Gabriela ,  Tews, Dr. Dirk

IPC分类号： C23C22/52 ,  C23F1/18 ,  H05K3/06 ,  C23F1/02 ,  C23F1/46 ,  H05K3/38

CPC分类号： C23F1/18 ,  C23F1/02 ,  C23F1/46 ,  H05K3/067 ,  H05K2203/0789

公开(公告)号：EP3034654B1

公开(公告)日：2017-10-25

申请号：EP14199223.0

申请日：2014-12-19

申请人： Atotech Deutschland GmbH

发明人： Lager, Markku ,  Clicque, Arno ,  Tews, Dr. Dirk

IPC分类号： C23F1/18 ,  H05K3/06 ,  H05K3/38

CPC分类号： C23F1/18 ,  C23C28/321 ,  C23F1/46 ,  C23G1/103 ,  H05K3/062 ,  H05K3/064 ,  H05K3/383 ,  H05K2203/124

摘要： The present invention is related to a composition for micro etching of a copper or a copper alloy surface, wherein the composition comprises i) at least a source of Fe 3+ ions, ii) at least a source of Br- ions, iii) at least an inorganic acid, and iv) at least one etch refiner according to formula I wherein R1 is selected from the group consisting of hydrogen, C 1 -C 5 -alkyl or a substituted aryl or alkaryl group; R2 is selected from the group consisting of hydrogen, C 1 -C 5 -alkyl or C 1 -C 5 -alkoxy; R3, R4 are selected from the group consisting of hydrogen and C 1 -C 5 -alkyl; and X- is a suitable anion. Further, the present invention is directed to a method for micro etching of copper or copper alloy surfaces using such a composition.

公开(公告)号：EP2603064A1

公开(公告)日：2013-06-12

申请号：EP11192516.0

申请日：2011-12-08

申请人： Atotech Deutschland GmbH

发明人： Tews, Dr. Dirk ,  Zee, Adrian ,  Hülsmann, Thomas ,  Kim, Kwonil

IPC分类号： H05K3/38 ,  H05K3/06

CPC分类号： H05K3/389 ,  H05K3/067 ,  H05K3/384 ,  H05K2203/0361 ,  H05K2203/073 ,  H05K2203/0793

摘要： The present invention relates to a method for manufacture of multilayer printed circuit boards and articles formed thereby, especially IC substrates. The method utilizes a copper-tin alloy layer coated with at least one silane binding agent to provide adhesion between a copper surface and a resin layer after lamination. This method leads to an enhanced adhesive strength, improved mechanical and thermal stress resistance as well as humidity resistance of multilayer printed circuit boards and IC substrates.

摘要翻译： 本发明涉及制造多层印刷电路板和由此形成的制品，特别是IC衬底的方法。 该方法利用涂覆有至少一种硅烷粘合剂的铜 - 锡合金层以在层压之后提供铜表面与树脂层之间的粘合。 该方法导致粘合强度提高，多层印刷电路板和IC基板的机械和热应力耐受性以及耐湿性提高。