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1.发明授权
公开(公告)号：EP1810554B1
公开(公告)日：2008-12-10
申请号：EP05775130.7
申请日：2005-08-30
发明人： REENTS, Bert , PLIET, Thomas , ROELFS, Bernd , FUJIWARA, Toshiya , WENZEL, René , YOUKHANIS, Markus , KIM, Soungsoo
IPC分类号： H05K3/42
CPC分类号： H05K3/423 , C25D3/38 , C25D5/18 , C25D7/12 , C25D21/12 , H05K1/115 , H05K3/427 , H05K2201/09563 , H05K2203/1476 , H05K2203/1492
摘要： The present invention relates to a galvanic process for filling through-holes with metals. The process is particularly suitable for filling through-holes of printed circuit boards with copper. The process comprises the following steps : (i) formation of a narrow part in the center of a through-hole by electroplating; and (ii) filling the through-hole obtained in step (i) with metal by electroplating
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公开(公告)号：EP2702189B1
公开(公告)日：2018-03-07
申请号：EP12716430.9
申请日：2012-04-25
发明人： DAMBROWSKY, Nina , HAUF, Uwe , EWERT, Ingo , DAMBROWSKY, Christof , WENZEL, René
摘要： The invention relates to an aqueous acidic bath for electrolytic deposition of copper, comprising, at least one source of copper ions, at least one acid, at least one brightener compound, and at least one leveler and/or promoter for copper-deposition, wherein at least one leveler and/or promoter is a ruthenium compound, and to a process for the electrolytic deposition of copper, in particular for filling blind micro vias, through hole vias, trenches and similar structures on printed circuit boards, chip carriers and semiconductor wafers.
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3.发明授权
公开(公告)号：EP2000013B1
公开(公告)日：2010-10-13
申请号：EP07723814.5
申请日：2007-03-30
发明人： REENTS, Bert , ROELFS, Bernd , MAGAYA, Tafadzwa , YOUKHANIS, Markus , WENZEL, René , KIM, Soungsoo
CPC分类号： H05K3/423 , C25D3/38 , C25D5/18 , H05K2201/09563 , H05K2203/1476 , H05K2203/1492
摘要： Disclosed is an electroplating method for filling cavities, through holes, pocket holes, or micropocket holes of a workpiece with metals. According to said method, the workpiece containing cavities, through holes, pocket holes, or micropocket holes is brought in contact with a metal deposition electrolyte, and a voltage is applied between the workpiece and at least one anode such that a current flow is fed to the workpiece. The inventive method is characterized in that the electrolyte encompasses a redox system.
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4.发明公开
公开(公告)号：EP2000013A2
公开(公告)日：2008-12-10
申请号：EP07723814.5
申请日：2007-03-30
发明人： REENTS, Bert , ROELFS, Bernd , MAGAYA, Tafadzwa , YOUKHANIS, Markus , WENZEL, René , KIM, Soungsoo
CPC分类号： H05K3/423 , C25D3/38 , C25D5/18 , H05K2201/09563 , H05K2203/1476 , H05K2203/1492
摘要： Disclosed is an electroplating method for filling cavities, through holes, pocket holes, or micropocket holes of a workpiece with metals. According to said method, the workpiece containing cavities, through holes, pocket holes, or micropocket holes is brought in contact with a metal deposition electrolyte, and a voltage is applied between the workpiece and at least one anode such that a current flow is fed to the workpiece. The inventive method is characterized in that the electrolyte encompasses a redox system.
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公开(公告)号：EP2702189A1
公开(公告)日：2014-03-05
申请号：EP12716430.9
申请日：2012-04-25
发明人： DAMBROWSKY, Nina , HAUF, Uwe , EWERT, Ingo , ERBEN, Christof , WENZEL, René
摘要： The invention relates to an aqueous acidic bath for electrolytic deposition of copper, comprising, at least one source of copper ions, at least one acid, at least one brightener compound, and at least one leveler and/or promoter for copper-deposition, wherein at least one leveler and/or promoter is a ruthenium compound, and to a process for the electrolytic deposition of copper, in particular for filling blind micro vias, through hole vias, trenches and similar structures on printed circuit boards, chip carriers and semiconductor wafers.
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6.发明公开GALVANIC PROCESS FOR FILLING THROUGH-HOLES WITH METALS, IN PARTICULAR OF PRINTED CIRCUIT BOARDS WITH COPPER 有权电镀工艺填充通过与铜尤其是电路板等具有金属HOLES
公开(公告)号：EP1810554A1
公开(公告)日：2007-07-25
申请号：EP05775130.7
申请日：2005-08-30
发明人： REENTS, Bert , PLIET, Thomas , ROELFS, Bernd , FUJIWARA, Toshiya , WENZEL, René , YOUKHANIS, Markus , KIM, Soungsoo
IPC分类号： H05K3/42
CPC分类号： H05K3/423 , C25D3/38 , C25D5/18 , C25D7/12 , C25D21/12 , H05K1/115 , H05K3/427 , H05K2201/09563 , H05K2203/1476 , H05K2203/1492
摘要： The present invention relates to a galvanic process for filling through-holes with metals. The process is particularly suitable for filling through-holes of printed circuit boards with copper. The process comprises the following steps : (i) formation of a narrow part in the center of a through-hole by electroplating; and (ii) filling the through-hole obtained in step (i) with metal by electroplating
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