公开(公告)号：EP3180406A4

公开(公告)日：2018-04-11

申请号：EP15831838

申请日：2015-07-24

Applicant: BASF SE

Inventor： LAN YONGQING ,  NOLLER BASTIAN MARTEN ,  JIANG LIANG ,  SHEN DANIEL KWO HUNG ,  GOLZARIAN REZA

IPC: H01L21/321 ,  C09G1/02 ,  C09K3/14

CPC classification number: C09K3/14 ,  C09G1/02 ,  C09K3/1436 ,  C09K3/1463 ,  H01L21/3212

Abstract: Described are a chemical-mechanical polishing (CMP) composition comprising abrasive particles in the form of organic/inorganic composite particles as well as the use of said composite particles as abrasive particles in a CMP composition and processes for the manufacture of a semiconductor device comprising chemical mechanical polishing of a substrate in the presence said CMP composition.