公开(公告)号：EP2576441B1

公开(公告)日：2017-08-09

申请号：EP11724178.6

申请日：2011-06-01

申请人： Element Six Technologies Limited

发明人： TWITCHEN, Daniel, James ,  GEOGHEGAN, Sarah, Louise ,  PERKINS, Neil ,  SCARSBROOK, Geoffrey, Alan

IPC分类号： C09K3/14 ,  B24D18/00 ,  C30B33/04 ,  B24D99/00

CPC分类号： C09K3/14 ,  B24D18/00 ,  B24D99/00 ,  C01B32/28 ,  C09K3/1409 ,  C23C14/0611 ,  C23C14/48 ,  C30B29/04 ,  C30B33/04

公开(公告)号：EP3196272A1

公开(公告)日：2017-07-26

申请号：EP15842947.2

申请日：2015-09-10

申请人： Fujimi Incorporated

发明人： YAMADA, Eiichi ,  TAMAI, Kazusei

IPC分类号： C09K3/14 ,  B24B37/00 ,  C09G1/02

CPC分类号： C09K3/1454 ,  B24B37/00 ,  B24B37/11 ,  C09G1/02 ,  C09K3/14

摘要： Abrasives, a polishing composition , and a polishing method that can reduce undulation of an outer surface of a resin coating by polishing with reduced occurrence of polishing flaws. The polishing composition includes abrasives of aluminium oxide particles having a specific surface area of 5 m 2 /g or more and 50 m 2 /g or less and an average secondary particle diameter of 0.05 µm or more and 4.8 µm or less. This polishing composition can be used for polishing an outer surface of the resin coating.

摘要翻译： 抛光剂，抛光组合物和抛光方法，其能够通过抛光减少抛光缺陷的发生来减少树脂涂层的外表面的起伏。 研磨用组合物含有比表面积为5m 2 / g以上且50m 2 / g以下且平均二次粒径为0.05μm以上且4.8μm以下的氧化铝粒子的研磨材料。 该抛光组合物可用于抛光树脂涂层的外表面。

公开(公告)号：EP3176810A1

公开(公告)日：2017-06-07

申请号：EP15826876.3

申请日：2015-06-18

申请人： Shin-Etsu Handotai Co., Ltd.

发明人： NAGAOKA, Yasuo ,  AGA, Hiroji

IPC分类号： H01L21/304 ,  B24B37/00 ,  C09G1/02 ,  C09K3/14

CPC分类号： B24B37/20 ,  B24B37/00 ,  C09G1/02 ,  C09K3/14 ,  H01L21/02381 ,  H01L21/02532 ,  H01L21/304 ,  H01L21/30625

摘要： The present invention is a method for polishing a germanium wafer having a surface composed of germanium, including: adding aqueous hydrogen peroxide to a first polishing slurry of an aqueous alkaline solution containing colloidal silica to make a second polishing slurry, and polishing the surface of the germanium wafer by using the second polishing slurry; wherein the aqueous hydrogen peroxide is added to the first polishing slurry in a concentration such that 30 wt% aqueous hydrogen peroxide is added in a volume of more than 0 vol% and 0.1 vol% or less based on the volume of the first polishing slurry, and the polishing is performed by using the second polishing slurry. This provides a method for polishing a germanium wafer that can make the surface roughness of a polished Ge surface be sufficiently small, and can sufficiently suppress generation of interface defects such as voids and blisters when used for a wafer to be bonded.

摘要翻译： 本发明是一种研磨具有由锗构成的表面的锗晶片的方法，包括：向含有胶体二氧化硅的碱性水溶液的第一抛光浆料中加入过氧化氢水溶液以制备第二抛光浆料，并且抛光 通过使用第二抛光浆料来形成锗晶片; 其中，所述过氧化氢水溶液以基于第一抛光浆料的体积大于0体积％且0.1体积％以下的体积添加30重量％过氧化氢水的浓度添加到第一抛光浆料中， 并且通过使用第二抛光浆料进行抛光。 这提供了一种用于抛光锗晶片的方法，其可以使得抛光的Ge表面的表面粗糙度足够小，并且可以充分地抑制用于待接合的晶片时产生界面缺陷如空隙和气泡。

公开(公告)号：EP3121239A1

公开(公告)日：2017-01-25

申请号：EP15764933.6

申请日：2015-03-09

申请人： Fujimi Incorporated

发明人： YAMATO, Yasuyuki

IPC分类号： C09K3/14 ,  B24B37/00 ,  H01L21/304

CPC分类号： C09G1/02 ,  C09G1/04 ,  C09K3/14 ,  C09K3/1409 ,  C09K3/1436 ,  C09K3/1454 ,  C09K3/1463 ,  H01L21/30625 ,  H01L21/31053 ,  H01L21/32115 ,  H01L21/3212 ,  H01L21/7684

摘要： To provide a polishing composition that can be used as an alternative of a polishing composition containing cerium oxide abrasive grains in STI and other such CMP applications, and to provide a polishing method and a method for producing a substrate using this polishing composition.
A polishing composition being used in applications for polishing a layer that contains a substance having a pH range presenting a positive zeta potential in an aqueous solution of pH 6 or lower, wherein the polishing composition contains abrasive grains (A), abrasive grains (B), and a pH adjusting agent, and the abrasive grains (B) has a negative zeta potential in an aqueous solution of pH 6 or lower, and the value of the average secondary particle diameter of the abrasive grains (B) is less than the value of the average secondary particle diameter of the abrasive grains (A) and is 15 nm or less and the polishing composition has a pH of 6 or lower.

摘要翻译： 本发明提供一种抛光剂组合物，其可以用作STI等CMP应用中含有氧化铈磨粒的抛光剂组合物的替代物，并提供一种抛光方法和使用该抛光剂组合物的基板的制造方法。 一种抛光组合物，其用于抛光含有在pH6或更低的水溶液中呈现正ζ电位的pH范围的物质的层的应用，其中所述抛光组合物包含磨粒（A），磨粒（B） （B）在pH6以下的水溶液中具有负的Z电位，并且磨粒（B）的平均二次粒径的值小于上述值 的磨粒（A）的平均二次粒径为15nm以下，研磨用组合物的pH为6以下。

公开(公告)号：EP3013919A1

公开(公告)日：2016-05-04

申请号：EP14730141.0

申请日：2014-06-11

申请人： Robert Bosch GmbH

发明人： WIRZ, Viktor

IPC分类号： C09K3/14 ,  B24D3/34 ,  B24D18/00

CPC分类号： B24D3/346 ,  B24D18/00 ,  C09K3/14

摘要： The invention relates to a grinding element (10, 110, 210) with a main part (12, 112, 212) which comprises at least one base material (14, 114, 214). The main part (12, 112, 212) comprises at least one additional active material (16, 116, 216) which is provided in order to at least partly influence at least one machining parameter at least in an operating state.

摘要翻译： 本发明涉及一种具有主要部分（12,112,212）的磨削元件（10,110,210），其包括至少一个基础材料（14,114,214）。 主要部件（12,112,212）包括至少一个额外的活性材料（16,116,216），其被设置成至少在操作状态下至少部分地影响至少一个加工参数。

公开(公告)号：EP2636657B1

公开(公告)日：2016-04-20

申请号：EP11837864.5

申请日：2011-10-18

申请人： Showa Denko K.K.

发明人： TOMIKAWA, Shinichiro ,  MIYAZAWA, Hirokazu ,  IEMURA, Takeshi

IPC分类号： C04B35/10 ,  B24D3/00

CPC分类号： C09K3/14 ,  B24D3/06 ,  B82Y30/00 ,  C04B35/117 ,  C04B35/6263 ,  C04B35/62685 ,  C04B2235/3208 ,  C04B2235/3222 ,  C04B2235/3234 ,  C04B2235/3274 ,  C04B2235/3418 ,  C04B2235/3463 ,  C04B2235/349 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/5454 ,  C04B2235/72 ,  C04B2235/77 ,  C04B2235/786 ,  C04B2235/85 ,  C04B2235/96

公开(公告)号：EP2611574A2

公开(公告)日：2013-07-10

申请号：EP11822752.9

申请日：2011-09-02

申请人： Saint-Gobain Abrasives, Inc. ,  Saint-Gobain Abrasifs

发明人： RAMANATH, Srinivasan ,  SAUCIER, Kenneth, A. ,  UPADHYAY, Rachana

IPC分类号： B24D3/02 ,  B24D3/34 ,  B24B1/00 ,  C09K3/14 ,  C09C1/68

CPC分类号： B24D3/14 ,  B24D3/06 ,  C09K3/14

摘要： An abrasive tool having a bonded abrasive body including abrasive grains contained within a bond material comprising a metal. During a grinding operation, the bonded abrasive body has a power variance [(Po−Pn)/Po]×100% of not greater than about 40%, wherein Po represents the grinding power to grind a workpiece with the bonded abrasive body at an initial grinding cycle and Pn represents the grinding power to grind the workpiece for a nth grinding cycle, wherein n>4.

公开(公告)号：EP1339545B1

公开(公告)日：2004-07-21

申请号：EP01984794.6

申请日：2001-11-30

申请人： Treibacher Schleifmittel GmbH

发明人： KUNZ, Reiner

IPC分类号： B32B27/04 ,  B32B27/20 ,  B32B29/00 ,  B28B3/00 ,  B44C5/04 ,  C09K3/14

CPC分类号： B32B5/16 ,  B32B21/02 ,  B32B21/06 ,  B32B29/00 ,  B32B29/04 ,  B32B2255/12 ,  B32B2260/025 ,  B32B2260/046 ,  B32B2305/30 ,  B32B2307/554 ,  B32B2315/08 ,  B32B2317/12 ,  B32B2317/16 ,  B32B2419/04 ,  B44C5/04 ,  B44C5/0469 ,  B44C5/0476 ,  B44F1/02 ,  C09K3/14 ,  D21H27/28 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/2993 ,  Y10T428/31993

摘要： The invention relates to a protective layer against wear based on artificial resin according to figure 2. Hard particles (1) having a hardness of at least 6 on the Mohs scale are embedded in said layer, as are compact, round, solid particles (2) which are essentially free of sharp edges and have a hardness of at least 5 on the Mohs scale. The grain size distribution of the round solid particles (2) begins at least with the smallest grain diameter of the hard particles (1) and reaches a maximum of five times the value of the largest hard particle diameter, the average grain diameter of the solid particles (2) being larger than the average grain diameter of the hard particles (1). The invention also relates to a mixture of hard particles and round solid particles for producing a protective layer against wear, a method for producing a protective layer against wear, and the use of one such layer for producing wear-resistant surfaces.

公开(公告)号：EP1371707A1

公开(公告)日：2003-12-17

申请号：EP02710420.7

申请日：2002-01-31

申请人： Mitsui Mining & Smelting Co., Ltd.

发明人： ITO, T., c/o MITSUI MINING & SMELTING CO., LTD. ,  MOCHIZUKI,N., c/oMITSUI MINING & SMELTING CO., LTD ,  WATANABE, H., c/oMITSUI MINING & SMELTING CO., LTD ,  UCHINO, Y., c/o MITSUI MINING & SMELTING CO., LTD. ,  SHIMOGAWARA, A.,c/oMITSUI MINING & SMELTING CO.LTD

IPC分类号： C09K3/14 ,  C01F17/00 ,  B24B57/04 ,  B24B37/00

CPC分类号： C09K3/14 ,  C01F17/0043 ,  C01P2006/12 ,  C01P2006/60 ,  C09K3/1409

摘要： A cerium-based abrasive and a production method of the cerium-based abrasive excellent in polishing properties of a high polishing speed and scarce formation of polishing scratches are provided by keeping the color of the abrasive in specified ranges or stably making fluorine be contained in the abrasive. For example, as such a cerium-based abrasive, examples include a cerium-based abrasive containing cerium oxide as a main component and having an L* value in a range not lower than 65 and or lower 90, an a* value in a range 0 or higher but 15 or lower, and a b* value in a range 10 or higher but 30 or lower in the case the color is expressed by an L*a*b* color system.

摘要翻译： 通过将研磨剂的颜色保持在规定范围内，或者稳定地使氟含有的方法，可以提供高抛光速度的抛光性能和抛光痕迹的形成极少的铈系研磨剂和铈系研磨剂的制造方法 磨料。 例如，作为这样的铈系研磨剂，例如可以举出含有氧化铈作为主要成分且L *值在65以上或90以下的铈基研磨剂，a *值范围 0以上且15以下，并且在颜色由L * a * b *颜色系统表示的情况下，ab *值在10以上且30以下的范围内。

公开(公告)号：EP1339545A2

公开(公告)日：2003-09-03

申请号：EP01984794.6

申请日：2001-11-30

申请人： Treibacher Schleifmittel GmbH

发明人： KUNZ, Reiner

IPC分类号： B32B27/04 ,  B32B27/20 ,  B32B29/00 ,  B28B3/00 ,  B44C5/04 ,  C09K3/14

CPC分类号： B32B5/16 ,  B32B21/02 ,  B32B21/06 ,  B32B29/00 ,  B32B29/04 ,  B32B2255/12 ,  B32B2260/025 ,  B32B2260/046 ,  B32B2305/30 ,  B32B2307/554 ,  B32B2315/08 ,  B32B2317/12 ,  B32B2317/16 ,  B32B2419/04 ,  B44C5/04 ,  B44C5/0469 ,  B44C5/0476 ,  B44F1/02 ,  C09K3/14 ,  D21H27/28 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/2993 ,  Y10T428/31993

摘要： The invention relates to a protective layer against wear based on artificial resin according to figure 2. Hard particles (1) having a hardness of at least 6 on the Mohs scale are embedded in said layer, as are compact, round, solid particles (2) which are essentially free of sharp edges and have a hardness of at least 5 on the Mohs scale. The grain size distribution of the round solid particles (2) begins at least with the smallest grain diameter of the hard particles (1) and reaches a maximum of five times the value of the largest hard particle diameter, the average grain diameter of the solid particles (2) being larger than the average grain diameter of the hard particles (1). The invention also relates to a mixture of hard particles and round solid particles for producing a protective layer against wear, a method for producing a protective layer against wear, and the use of one such layer for producing wear-resistant surfaces.