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1.发明公开CHEMICAL MECHANICAL POLISHING COMPOSITION COMPRISING POLYVINYL PHOSPHONIC ACID AND ITS DERIVATIVES 有权化学 - 机械 - 药理学 - 药理学杂志
公开(公告)号：EP2794790A4
公开(公告)日：2015-07-29
申请号：EP11878201
申请日：2011-12-21
Applicant: BASF SE
Inventor： RAMAN VIJAY IMMANUEL , LI YUZHUO , SCHADE CHRISTIAN , VENKATARAMAN SHYAM SUNDAR , SU EASON YU-SHEN , USMAN IBRAHIM SHEIK ANSAR , GAO NING
IPC: C09G1/02 , C09K3/14 , H01L21/304 , H01L21/306 , H01L21/3105
CPC classification number: C09G1/04 , C09G1/00 , C09G1/02 , C09K3/1463 , C09K13/00 , H01L21/302 , H01L21/30625 , H01L21/31053 , H01L21/461
Abstract: A chemical mechanical polishing (CMP) composition comprising: (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) at least one type of an organic polymeric compound as a dispersing agent or charge reversal agent comprising a phosphonate (P(═O)(OR1)(OR2) or phosphonic acid (P(═O)(OH)2) moiety or their deprotonated forms as pendant groups, wherein R1 is alkyl, aryl, alkylaryl, or arylalkyl, R2 is H, alkyl, aryl, alkylaryl, or arylalkyl, and (C) an aqueous medium.
Abstract translation: 一种化学机械抛光（CMP）组合物，其包含：（A）无机颗粒，有机颗粒或其混合物或复合物，（B）至少一种作为分散剂的有机聚合物或电荷反转剂，其包含膦酸盐 P（ΟO）（OR1）（OR2）或膦酸（P（ΟO）（OH）2）部分或其去质子化形式为侧基，其中R 1为烷基，芳基，烷基芳基或芳基烷基， 烷基，芳基，烷基芳基或芳烷基，和（C）水性介质。
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2.发明公开AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATE MATERIALS FOR ELECTRICAL, MECHANICAL AND OPTICAL DEVICES 有权含水抛光组合物和方法用于化学机械抛光的衬底材料，电力，机械和光学器件
公开(公告)号：EP2614123A4
公开(公告)日：2014-07-30
申请号：EP11823142
申请日：2011-09-06
Applicant: BASF SE
Inventor： LI YUZHUO , CHU JEA-JU , VENKATARAMAN SHYAM SUNDAR , USMAN IBRAHIM SHEIK ANSAR , PINDER HARVEY WAYNE
CPC classification number: C09K3/1409 , C09G1/02 , C09K3/1463 , H01L21/31053
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3.发明公开AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES FOR ELECTRICAL, MECHANICAL AND OPTICAL DEVICES 审中-公开含水抛光组合物和方法用于化学机械抛光底物，电气，机械和光学器件
公开(公告)号：EP2614121A4
公开(公告)日：2016-03-09
申请号：EP11823139
申请日：2011-09-06
Applicant: BASF SE
Inventor： LI YUZHUO , CHU JEA-JU , VENKATARAMAN SHYAM SUNDAR , USMAN IBRAHIM SHEIK ANSAR , PINDER HARVEY WAYNE
CPC classification number: C09K13/00 , C08L33/24 , C09G1/02 , C09K3/1463 , H01L21/31053
Abstract: An aqueous polishing composition having a pH of 3 to 11 and comprising (A) abrasive particles which are positively charged when dispersed in an aqueous medium free from component (B) and of a pH of 3 to 9 as evidenced by the electrophoretic mobility; (B) anionic phosphate dispersing agents; and (C) a polyhydric alcohol component selected from the group consisting of (c1) water-soluble and water-dispersible, aliphatic and cycloaliphatic, monomeric, dimeric and oligomeric polyols having at least 4 hydroxy groups; (c2) a mixture consisting of (c21) water-soluble and water-dispersible, aliphatic and cycloaliphatic polyols having at least 2 hydroxy groups; and (c22) water-soluble or water-dispersible polymers selected from linear and branched alkylene oxide homopolymers and copolymers (c221); and linear and branched, aliphatic and cycloaliphatic poly(N-vinylamide) homopolymers and copolymers (c222); and (c3) mixtures of (c1) and (c2); and a process for polishing substrates for electrical, mechanical and optical devices.
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4.发明公开AQUEOUS POLISHING COMPOSITIONS CONTAINING N-SUBSTITUTED DIAZENIUM DIOXIDES AND/OR N'-HYDROXY-DIAZENIUM OXIDE SALTS 审中-公开WÄSSRIGEREINIGUNGSZUSAMMENSETZUNGEN MIT N-SUBSTITUIERTEN DIAZENIUMDIOXIDEN UND / ODER N'-HYDROXY-DIAZENIUM-OXIDSALZEN
公开(公告)号：EP2614122A4
公开(公告)日：2014-01-15
申请号：EP11823140
申请日：2011-09-06
Applicant: BASF SE
Inventor： NOLLER BASTIAN , FRANZ DIANA , LI YUZHUO , USMAN IBRAHIM SHEIK ANSAR , PINDER HARVEY WAYNE , VENKATARAMAN SHYAM SUNDAR
IPC: C09G1/02 , H01L21/3105
CPC classification number: C09K13/00 , C09G1/02 , C09K3/1463 , H01L21/31053
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