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1.发明公开PROCESS FOR REMOVING A BULK MATERIAL LAYER FROM A SUBSTRATE AND A CHEMICAL MECHANICAL POLISHING AGENT SUITABLE FOR THIS PROCESS 审中-公开除去方法基板和化学机械清洗机的材料，近地层这个过程
公开(公告)号：EP2507824A4
公开(公告)日：2013-09-25
申请号：EP10832736
申请日：2010-11-25
Applicant: BASF SE
Inventor： RAMAN VIJAY IMMANUEL , EBERT SOPHIA , BRANDS MARIO , LAN YONGQING , ZACHARIAS PHILIPP , GUBAYDULLIN ILSHAT , LI YUZHUO
IPC: H01L21/321 , C09G1/02
CPC classification number: C09G1/02 , C09K3/1463 , H01L21/3212
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2.发明公开
公开(公告)号：EP2499210A4
公开(公告)日：2015-04-29
申请号：EP10829604
申请日：2010-11-10
Applicant: BASF SE
Inventor： LAUTER MICHAEL , RAMAN VIJAY IMMANUEL , LI YUZHUO , VENKATARAMAN SHYAM SUNDAR , SHEN DANIEL KWO-HUNG
CPC classification number: C09G1/02 , C09K3/1409 , C09K3/1463 , H01L21/31053
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Patent Agency Ranking3.发明公开PROCESS FOR REMOVING BULK MATERIAL LAYER FROM SUBSTRATE AND CHEMICAL MECHANICAL POLISHING AGENT SUITABLE FOR THIS PROCESS 审中-公开VERFAHREN ZUR ENTFERNUNG EINER MATERIALMASSESCHICHT VON EINEM SUBSTRAT UND CHEMISCH-MECHANISCHES REINIGUNGSMITTELFÜRDIESES VERFAHREN
公开(公告)号：EP2507332A4
公开(公告)日：2017-08-02
申请号：EP10832737
申请日：2010-11-25
Applicant: BASF SE
Inventor： RAMAN VIJAY IMMANUEL , LI YUZHUO , BRANDS MARIO , LAN YONGQING , RUSHING KENNETH , RAMJI KARPAGAVALLI
IPC: C09G1/02 , B01J13/14 , C09K3/14 , H01L21/321
CPC classification number: H01L21/3212 , C09G1/02 , C09K3/1436 , C09K3/1463
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4.发明公开AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES HAVING PATTERNED OR UNPATTERNED LOW-K DIELECTRIC LAYERS 有权含水抛光组合物和方法与结构化或非结构化介电Low-k膜的化学机械抛光SUBSTRATES
公开(公告)号：EP2625236A4
公开(公告)日：2014-05-14
申请号：EP11830272
申请日：2011-10-04
Applicant: BASF SE
Inventor： RAMAN VIJAY IMMANUEL , RITTIG FRANK , LI YUZHUO , CHIU WEI LAN WILLIAM
IPC: C09G1/02 , C09K3/14 , H01L21/306 , H01L21/3105 , H01L21/321
CPC classification number: H01L21/30625 , C09G1/02 , C09G1/04 , G09G1/02 , H01L21/31053 , H01L21/3212 , H01L21/7684
Abstract: An aqueous polishing composition comprising (A) abrasive particles and (B) an amphiphilic nonionic surfactant selected from the group consisting of water-soluble or water-dispersible surfactants having (b1) hydrophobic groups selected from the group consisting of branched alkyl groups having 10 to 18 carbon atoms; and (b2) hydrophilic groups selected from the group consisting of polyoxyalkylene groups comprising (b21) oxyethylene monomer units and (b22) substituted oxyalkylene monomer units wherein the substituents are selected from the group consisting of alkyl, cycloalkyl, or aryl, alkyl-cycloalkyl, alkyl-aryl, cycloalkyl-aryl and alkyl-cycloalkyl-aryl groups, the said polyoxyalkylene group containing the monomer units (b21) and (b22) in random, alternating, gradient and/or blocklike distribution; a CMP process for substrates having patterned or unpatterned low-k or ultra-low-k dielectric layers making use of the said aqueous polishing composition; and the use of the said aqueous polishing composition for manufacturing electrical, mechanical and optical devices.
Abstract translation: 在wässrige抛光组合物，包括（A）磨粒和（B）以选自水溶性或水分散性表面活性剂的由具有（B1）选自疏水性基团具有10到支链烷基的由...组成选定的两亲性非离子表面活性剂 18个碳原子; 和（b2）选自聚氧化烯基团，其包含（B21）氧化乙烯单体单元和所选择的亲水性基团（B22）substituiertem氧化烯单体单元worin所述取代基选自烷基，环烷基，或芳基，烷基 - 环烷基的选择， 烷基 - 芳基，环烷基 - 芳基和烷基 - 环烷基 - 芳基，聚氧化烯基团，所述含单体单元（B21）和（B22）在无规，交替，梯度和/或嵌段状分布; 用于基板CMP工艺具有图案化或非图案化的低k或超低k介电层使采用了所述的wässrige抛光组合物; 并且由于使用上述的wässrige研磨用组合物用于制造电子，机械和光学器件。
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5.发明公开CHEMICAL MECHANICAL POLISHING COMPOSITION COMPRISING POLYVINYL PHOSPHONIC ACID AND ITS DERIVATIVES 有权化学 - 机械 - 药理学 - 药理学杂志
公开(公告)号：EP2794790A4
公开(公告)日：2015-07-29
申请号：EP11878201
申请日：2011-12-21
Applicant: BASF SE
Inventor： RAMAN VIJAY IMMANUEL , LI YUZHUO , SCHADE CHRISTIAN , VENKATARAMAN SHYAM SUNDAR , SU EASON YU-SHEN , USMAN IBRAHIM SHEIK ANSAR , GAO NING
IPC: C09G1/02 , C09K3/14 , H01L21/304 , H01L21/306 , H01L21/3105
CPC classification number: C09G1/04 , C09G1/00 , C09G1/02 , C09K3/1463 , C09K13/00 , H01L21/302 , H01L21/30625 , H01L21/31053 , H01L21/461
Abstract: A chemical mechanical polishing (CMP) composition comprising: (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) at least one type of an organic polymeric compound as a dispersing agent or charge reversal agent comprising a phosphonate (P(═O)(OR1)(OR2) or phosphonic acid (P(═O)(OH)2) moiety or their deprotonated forms as pendant groups, wherein R1 is alkyl, aryl, alkylaryl, or arylalkyl, R2 is H, alkyl, aryl, alkylaryl, or arylalkyl, and (C) an aqueous medium.
Abstract translation: 一种化学机械抛光（CMP）组合物，其包含：（A）无机颗粒，有机颗粒或其混合物或复合物，（B）至少一种作为分散剂的有机聚合物或电荷反转剂，其包含膦酸盐 P（ΟO）（OR1）（OR2）或膦酸（P（ΟO）（OH）2）部分或其去质子化形式为侧基，其中R 1为烷基，芳基，烷基芳基或芳基烷基， 烷基，芳基，烷基芳基或芳烷基，和（C）水性介质。
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6.发明公开
公开(公告)号：EP2688688A4
公开(公告)日：2014-12-31
申请号：EP12760859
申请日：2012-02-28
Applicant: BASF SE
Inventor： KLIPP ANDREAS , RAMAN VIJAY IMMANUEL , VENKATARAMAN SHYAM SUNDAR , MELLIES RAIMUND , ZHONG MINGJIE
CPC classification number: H01L21/02074 , C11D1/662 , C11D1/72 , C11D1/721 , C11D1/722 , C11D1/825 , C11D3/0073 , C11D3/2041 , C11D3/2065 , C11D3/2082 , C11D3/3757 , C11D11/0047 , G03F7/422 , G03F7/426
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7.发明公开AQUEOUS POLISHING AGENT AND GRAFT COPOLYMERS AND THEIR USE IN PROCESS FOR POLISHING PATTERNED AND UNSTRUCTURED METAL SURFACES 审中-公开水基清洗剂和移植物及它们在一种用于清洁EYED化和非结构化的金属表面
公开(公告)号：EP2539412A4
公开(公告)日：2013-07-31
申请号：EP11746939
申请日：2011-01-19
Applicant: BASF SE
Inventor： RAMAN VIJAY IMMANUEL , GUBAYDULLIN ILSHAT , BRANDS MARIO , LI YUZHUO , PERETOLCHIN MAXIM
IPC: C09G1/02 , C08F271/02 , C09K3/14
CPC classification number: C09G1/02 , C08F283/00 , C09K3/1463 , C08F220/32
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