摘要:
The present invention relates to the production of porous thin films, in particular by atomic layer deposition. The present invention relates to a process for producing porous films comprising the steps (a) exposing a solid substrate to a vapor containing an organic compound (A), whereby a submonolayer of the organic compound (A) covalently bound to the surface of the solid substrate is formed, (b) exposing the solid substrate to a vapor containing a compound of general formula (I) SiX 4 (I), wherein X is hydrogen, a halogen, an alkoxy, an aryloxy, or an amine group, (c) exposing the solid substrate to a vapor containing an organic compound (B) which has at least two functional groups out of which at least one can form a covalent bond with the surface-bound organic compound (A), (d) performing the steps (d1) exposing the solid substrate to a vapor containing water, and (d2) exposing the solid substrate to a vapor containing a compound of general formula (I), (e) exposing the solid substrate to a vapor containing an organic compound (C) which has at least two functional groups out of which at least one can form a covalent bond to the surface-bound organic compound (B),
(f) removing organic parts from the film formed on the surface of the solid substrate.
摘要:
The present invention relates to the production of porous thin films, in particular by atomic layer deposition. The present invention relates to a process for producing porous films comprising (a) performing a sequence of depositing a compound of general formula (I) from the gaseous state on a solid substrate at a temperature below 400 °C and contacting the deposited compound of general formula (I) with a compound capable of removing A 1 from the compound of general formula (I),
wherein R is an alkyl or aryl group, X is hydrogen, a halogen, an amine, an alkoxy group or an aryloxy group, A 1 , A 2 , A 3 are independent of each other hydrogen, alkyl groups, or aryl groups and
(b) removing R from the deposited compound of general formula (I).