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1.发明公开SEMICONDUCTOR DIE ENCAPSULATION OR CARRIER-MOUNTING METHOD, AND CORRESPONDING SEMICONDUCTOR DIE ENCAPSULATION OR CARRIER-MOUNTING APPARATUS 有权程序的案件，安装或为组合体的情况的半导体芯片及相关设备或半导体芯片的支持支持
公开(公告)号：EP2954550A1
公开(公告)日：2015-12-16
申请号：EP14703936.6
申请日：2014-02-05
发明人： DE BEIJER, Johannes Cornelis , RUTTEN, Michiel Hendrikus Antonius Wilhelmus , HUIZING, Ger , HOEDEMAKER, Mike Louis Theodoor
CPC分类号： H01L21/67126 , B29C45/14065 , B29C45/14336 , B29C45/14655 , B29C45/2628 , B29C45/82 , B29C2045/822 , H01L21/561 , H01L21/67092 , H01L21/67144 , H01L21/67253 , H01L22/10 , H01L23/3107 , H01L23/495 , H01L23/498 , H01L24/97
摘要： A semiconductor die encapsulation or carrier-mounting method comprises the steps of providing a first tool part for holding multiple semiconductor dies and providing the semiconductor dies on the first tool part; providing a second tool part, one of the first and second tool parts comprising displaceable insert members to allow applying a pressure by each displaceable insert member on a surface area of a semiconductor die; and bringing together the first and second tool parts such as to define a space between the first and second tool parts, the semiconductor products being arranged in the space. The displaceable insert members apply a pressure onto the surface area of the semiconductor dies. The pressure applied by the displaceable insert members is monitored and regulated to a predetermined pressure. Subsequently, the first and second tool parts are separated and the processed semiconductor dies are removed.
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2.发明授权
公开(公告)号：EP2954550B1
公开(公告)日：2017-06-28
申请号：EP14703936.6
申请日：2014-02-05
发明人： DE BEIJER, Johannes Cornelis , RUTTEN, Michiel Hendrikus Antonius Wilhelmus , HUIZING, Ger , HOEDEMAKER, Mike Louis Theodoor
CPC分类号： H01L21/67126 , B29C45/14065 , B29C45/14336 , B29C45/14655 , B29C45/2628 , B29C45/82 , B29C2045/822 , H01L21/561 , H01L21/67092 , H01L21/67144 , H01L21/67253 , H01L22/10 , H01L23/3107 , H01L23/495 , H01L23/498 , H01L24/97
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