摘要:
A deflector which deflects a charged particle beam includes a substrate having an opening through which the charged particle beam should pass, and a deflection electrode which is arranged in the opening to deflect the charged particle beam and has a first conductive member and second conductive member, which are formed by plating. The second conductive member is formed on the surface of the first conductive member and is made of a material that is more difficult to oxidize than the first conductive member. The first conductive member is made of a material having smaller residual stress than the second conductive member.
摘要:
The present invention relates to a high-precision and high-speed electron beam exposure technique which corrects the position of each beam in a multi-beam exposure method without using a deflection array and a huge and high-precision driving circuit. In an electron beam exposure method for forming a desired pattern onto a specimen (217) by independently controlling emission and scanning of a plurality of electron beams (202), a deviation between a pattern formed by each of the plurality of electron beams (202) and the desired pattern is controlled by shifting the position of pattern data of the pattern formed by each of the plurality of electron beams (202).
摘要:
The dimension of the main field as a unit region for exposure is set to an integral submultiple of the arrangement pitch of the LSI to be exposed, by the control computer 62, and the exposure data stored in the form associated with electron beams from a data generation circuit 64 is limited to one-chip data alone in units of a stripe. This data is repeatedly read out to write the stripe. Further, a storage circuit 66 is provided to store the exposure data by means of a double buffer memory unit for each electron beam. While LSI is written according to one of the buffers, the next exposure stripe data is prepared on the other buffer, thereby bringing about a substantial reduction in the required speed of the exposure data generation circuit.
摘要:
A high-precision multi-charged-particle-beam exposure apparatus is provided without increasing the performance of a reduction electron optical system. The multi-charged-particle-beam exposure apparatus includes a charged particle source (ES) for emitting a charged particle beam, an aperture array (AA) obtained by arranging a plurality of apertures that divide the charged particle beam from the charged particle source (ES) into a plurality of charged particle beams, a lens array (LA) obtained by arranging a plurality of electron lens for forming a plurality of intermediate images of the charged particle source (ES) on substantially one plane with the plurality of charged particle beams from the aperture array (AA), a blanker array (BA) located on the plane where the plurality of intermediate images are to be formed and having a plurality of blankers, and a reduction electron optical system for reducing and projecting the images of the charged particle source (ES) onto a substrate.
摘要:
A deflector which deflects a charged particle beam includes a substrate having an opening through which the charged particle beam should pass, and a deflection electrode which is arranged in the opening to deflect the charged particle beam and has a first conductive member and second conductive member, which are formed by plating. The second conductive member is formed on the surface of the first conductive member and is made of a material that is more difficult to oxidize than the first conductive member. The first conductive member is made of a material having smaller residual stress than the second conductive member.
摘要:
A deflector which deflects a charged particle beam includes a substrate (1202) in which an opening (200), through which the charged particle beam should pass, is formed, a first deflection electrode (1204a) and second deflection electrode (1204b) which oppose each other in the opening to deflect the charged particle beam, and a first insulating layer (1208a) and second insulating layer (1208b) which are formed between said substrate and said first deflection electrode and between said substrate and said second deflection electrode, respectively. In a direction substantially perpendicular to a direction from the first deflection electrode to the second deflection electrode and an irradiation direction of the charged particle beam, a length of each of the first and second insulating layers is smaller than a length of each of the first and second deflection electrodes so as to shield the first and second insulating layers from the charged particle beam by the first and second deflection electrodes, respectively.