公开(公告)号：EP2786429A4

公开(公告)日：2015-07-29

申请号：EP12853831

申请日：2012-11-30

Applicant: CREE INC

Inventor： LIN SHAOW B D ,  ANDREWS PETER SCOTT

IPC: H01L33/62 ,  H01L33/48

CPC classification number: H01L25/0753 ,  H01L33/44 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

公开(公告)号：EP2780955A4

公开(公告)日：2015-07-15

申请号：EP12849022

申请日：2012-11-14

Applicant: CREE INC

Inventor： ANDREWS PETER SCOTT ,  BRITT JEFFREY CARL

IPC: H01L33/62 ,  H01L23/373 ,  H01L25/075 ,  H01L33/48 ,  H01L33/60 ,  H01L33/64 ,  H05K1/03 ,  H05K3/40

CPC classification number: H01L33/62 ,  H01L23/3735 ,  H01L25/0753 ,  H01L33/60 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12032 ,  H05K1/0269 ,  H05K1/0306 ,  H05K3/06 ,  H05K3/16 ,  H05K2201/0338 ,  H05K2201/09036 ,  H05K2201/09227 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Light emitting diode (LED) packages and methods are disclosed herein. In one aspect, a light emitting package is disclosed. The light emitting package includes one or more areas of conductive material having a thickness of less than approximately 50 microns (mum). The package can further include at least one light emitting diode (LED) electrically connected to the conductive material and at least one thin gap disposed between areas of conductive material.

公开(公告)号：EP2671267A4

公开(公告)日：2015-10-07

申请号：EP12742154

申请日：2012-01-18

Applicant: CREE INC

Inventor： DONOFRIO MATTHEW ,  EDMOND JOHN ADAM ,  ANDREWS PETER SCOTT ,  CHANG DAVID DER CHI

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/48 ,  H01L33/50 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L33/20 ,  H01L33/486 ,  H01L33/505 ,  H01L33/62 ,  H01L2224/16

Abstract: A light emitting device includes a mounting substrate having a reflective layer that defines spaced apart anode and cathode pads, and a gap between them. A light emitting diode die is flip-chip mounted on the mounting substrate, such that the anode contact of the LED die is bonded to the anode pad and the cathode contact of the LED die is bonded to the cathode pad. A lens extends from the mounting substrate to surround the LED die. The reflective layer extends on the mounting substrate to cover substantially all of the mounting substrate that lies beneath the lens, excluding the gap, and may also extend beyond the lens.

公开(公告)号：EP2643862A4

公开(公告)日：2015-05-27

申请号：EP11843026

申请日：2011-10-31

Applicant: CREE INC

Inventor： HUSSELL CHRISTOPHER P ,  ANDREWS PETER SCOTT ,  REIHERZER JESSE COLIN ,  EMERSON DAVID T

IPC: H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  H01L33/52

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014

公开(公告)号：EP2681487A4

公开(公告)日：2014-08-27

申请号：EP12788994

申请日：2012-02-27

Applicant: CREE INC

Inventor： HUSSELL CHRISTOPHER ,  ANDREWS PETER SCOTT ,  TUDORICA FLORIN A ,  EMERSON DAVID T

IPC: F21V3/04 ,  F21K99/00 ,  F21V23/06 ,  F21Y101/02 ,  H01J61/34 ,  H01J61/38

CPC classification number: F21K9/56 ,  F21K9/232 ,  F21K9/64 ,  F21K9/90 ,  F21V3/0481 ,  F21V23/06 ,  F21Y2115/10 ,  H01J61/34 ,  H01J61/38 ,  H01J2261/385 ,  Y02B20/19 ,  Y10T29/49002

Abstract: Remote component devices, systems, and methods are disclosed. In one aspect, remote component devices, systems, and methods can include a body for lockably securing the remote component to a housing. Devices, systems, and methods can also include one or more light emitting devices disposed over the body. An optical material can be remotely located at least a first distance away from the one or more light emitting devices. Remote component devices, systems, and methods disclosed herein can be used as replacements and/or equivalent light products for standard filament light bulbs and compact fluorescent lamp (CFL) bulbs.