LASER PRODUCED PLASMA EUV LIGHT SOURCE
    3.
    发明公开
    LASER PRODUCED PLASMA EUV LIGHT SOURCE 有权
    LASERPRODUZIERTE PLASMA-EUV-LICHTQUELLE

    公开(公告)号:EP2095693A4

    公开(公告)日:2010-11-03

    申请号:EP07862537

    申请日:2007-12-04

    申请人: CYMER INC

    IPC分类号: H05G2/00 G01J3/10

    摘要: An EUV light source is disclosed which may comprise a plurality of targets, e.g., tin droplets, and a system generating pre-pulses and main-pulses with the pre-pulses for irradiating targets to produce expanded targets. The system may further comprise a continuously pumped laser device generating the main pulses with the main pulses for irradiating expanded targets to produce a burst of EUV light pulses. The system may also have a controller varying at least one pre-pulse parameter during the burst of EUV light pulses. In addition, the EUV light source may also include an instrument measuring an intensity of at least one EUV light pulse within a burst of EUV light pulses and providing a feedback signal to the controller to vary at least one pre-pulse parameter during the burst of EUV light pulses to produce a burst of EUV pulses having a pre-selected dose.

    摘要翻译: 公开了一种EUV光源,其可以包括多个目标,例如锡滴,以及产生预脉冲和主脉冲的系统,其中具有用于照射目标的预脉冲以产生扩展的目标。 该系统还可以包括连续泵浦的激光器装置,其产生具有用于照射扩展的目标的主脉冲以产生EUV光脉冲的脉冲的主脉冲。 该系统还可以具有在EUV光脉冲的突发期间改变至少一个预脉冲参数的控制器。 此外,EUV光源还可以包括测量EUV光脉冲的脉冲串内的至少一个EUV光脉冲的强度的仪器,并且向控制器提供反馈信号以在脉冲串期间改变至少一个预脉冲参数 EUV光脉冲以产生具有预选剂量的EUV脉冲的脉冲串。

    GAS MANAGEMENT SYSTEM FOR A LASER-PRODUCED-PLASMA EUV LIGHT SOURCE
    4.
    发明公开
    GAS MANAGEMENT SYSTEM FOR A LASER-PRODUCED-PLASMA EUV LIGHT SOURCE 审中-公开
    基于等离子体LASERERZEUGTEM气体处理系统用于EUV光源

    公开(公告)号:EP2181448A4

    公开(公告)日:2012-02-08

    申请号:EP08795347

    申请日:2008-08-15

    申请人: CYMER INC

    IPC分类号: G21G4/00

    摘要: Devices and corresponding methods of use are described herein which may comprise an enclosing structure defining a closed loop flow path and a system generating a plasma at a plasma site, e.g. laser produced plasma system, where the plasma site may be in fluid communication with the flow path. For the device, a gas may be disposed in the enclosing structure which may include an ion-stopping buffer gas and/or an etchant. A pump may be provided to force the gas through the closed loop flow path. One or more heat exchangers removing heat from gas flowing in the flow path may be provided. In some arrangements, a filter may be used to remove at least a portion of a target species from gas flowing in the flow path.