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公开(公告)号：EP1144190B2
公开(公告)日：2008-09-17
申请号：EP99949525.2
申请日：1999-05-20
发明人： XU, Guo, Feng , REPECKA, Linas , MORTIMER, Steve , PEAKE, Steve , BOYD, Jack
IPC分类号： B32B27/00
CPC分类号： B32B5/26 , B29C70/44 , B29C70/546 , B32B27/04 , C08G59/32 , C08G59/3218 , C08G59/38 , C08J5/24 , C08J2363/00 , C08L63/00 , Y10T428/249928 , Y10T428/249933 , Y10T428/24994 , Y10T428/249942 , Y10T428/249944 , Y10T428/249945 , Y10T428/249947
摘要： The invention provides a method of forming a void-free laminate, comprising the steps of: (a) enclosing a partially impregnated prepreg (6) in a vacuum envelope (22), said partially impregnated prepreg comprising a fiber layer partially impregnated with a resin composition; and (b) heating said partially impregnated prepreg under vacuum (24) to withdraw air present in said partially impregnated prepreg and to cause said resin composition (i) to fully infuse into said fiber layer and (ii) to cure thereby forming said void-free laminate. The present invention further provides novel combinations of modified epoxy resins that may be employed with the methods disclosed. The void-free laminates may be utilized for the manufacture of parts for the aerospace and aircraft industries.
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公开(公告)号：EP1144190A3
公开(公告)日：2002-02-27
申请号：EP99949525.2
申请日：1999-05-20
发明人： XU, Guo, Feng , REPECKA, Linas , MORTIMER, Steve , PEAKE, Steve , BOYD, Jack
IPC分类号： B32B27/00
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公开(公告)号：EP1144190B1
公开(公告)日：2003-12-17
申请号：EP99949525.2
申请日：1999-05-20
发明人： XU, Guo, Feng , REPECKA, Linas , MORTIMER, Steve , PEAKE, Steve , BOYD, Jack
IPC分类号： B32B27/00
CPC分类号： B32B5/26 , B29C70/44 , B29C70/546 , B32B27/04 , C08G59/32 , C08G59/3218 , C08G59/38 , C08J5/24 , C08J2363/00 , C08L63/00 , Y10T428/249928 , Y10T428/249933 , Y10T428/24994 , Y10T428/249942 , Y10T428/249944 , Y10T428/249945 , Y10T428/249947
摘要： The invention provides a method of forming a void-free laminate, comprising the steps of: (a) enclosing a partially impregnated prepreg (6) in a vacuum envelope (22), said partially impregnated prepreg comprising a fiber layer partially impregnated with a resin composition; and (b) heating said partially impregnated prepreg under vacuum (24) to withdraw air present in said partially impregnated prepreg and to cause said resin composition (i) to fully infuse into said fiber layer and (ii) to cure thereby forming said void-free laminate. The present invention further provides novel combinations of modified epoxy resins that may be employed with the methods disclosed. The void-free laminates may be utilized for the manufacture of parts for the aerospace and aircraft industries.
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公开(公告)号：EP1144190A2
公开(公告)日：2001-10-17
申请号：EP99949525.2
申请日：1999-05-20
发明人： XU, Guo, Feng , REPECKA, Linas , MORTIMER, Steve , PEAKE, Steve , BOYD, Jack
IPC分类号： B32B27/00
CPC分类号： B32B5/26 , B29C70/44 , B29C70/546 , B32B27/04 , C08G59/32 , C08G59/3218 , C08G59/38 , C08J5/24 , C08J2363/00 , C08L63/00 , Y10T428/249928 , Y10T428/249933 , Y10T428/24994 , Y10T428/249942 , Y10T428/249944 , Y10T428/249945 , Y10T428/249947
摘要： The invention provides a method of forming a void-free laminate, comprising the steps of: (a) enclosing a partially impregnated prepreg (6) in a vacuum envelope (22), said partially impregnated prepreg comprising a fiber layer partially impregnated with a resin composition; and (b) heating said partially impregnated prepreg under vacuum (24) to withdraw air present in said partially impregnated prepreg and to cause said resin composition (i) to fully infuse into said fiber layer and (ii) to cure thereby forming said void-free laminate. The present invention further provides novel combinations of modified epoxy resins that may be employed with the methods disclosed. The void-free laminates may be utilized for the manufacture of parts for the aerospace and aircraft industries.
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