SOLID-STATE IMAGE PICKUP DEVICE
    1.
    发明授权

    公开(公告)号:EP2486588B1

    公开(公告)日:2018-07-18

    申请号:EP10770882.8

    申请日:2010-09-29

    IPC分类号: H01L27/146

    摘要: A solid-state image pickup device includes a plurality of pixels, each of the pixels including a photoelectric conversion portion, a charge holding portion, a floating diffusion, and a transfer portion. The pixel also includes a beneath-holding-portion isolation layer and a pixel isolation layer. An end portion on a photoelectric conversion portion side of the pixel isolation layer is away from the photoelectric conversion portion compared to an end portion on a photoelectric conversion portion side of the beneath-holding-portion isolation layer, and an N-type semiconductor region constituting part of the photoelectric conversion portion is disposed under at least part of the beneath-holding-portion isolation layer.

    SOLID-STATE IMAGE PICKUP DEVICE
    3.
    发明公开
    SOLID-STATE IMAGE PICKUP DEVICE 有权
    固态图像拾取设备

    公开(公告)号:EP2486590A1

    公开(公告)日:2012-08-15

    申请号:EP10775918.5

    申请日:2010-10-06

    IPC分类号: H01L27/146

    CPC分类号: H01L27/14643 H01L27/14609

    摘要: A photoelectric conversion portion, a charge holding portion, a transfer portion, and a sense node are formed in a P-type well. The charge holding portion is configured to include an N-type semiconductor region, which is a first semiconductor region holding charges in a portion different from the photoelectric conversion portion. A P-type semiconductor region having a higher concentration than the P-type well is disposed under the N-type semiconductor region.

    摘要翻译: 在P型阱中形成光电转换部分,电荷保持部分,转移部分和感测节点。 电荷保持部分被配置为包括N型半导体区域,该N型半导体区域是在与光电转换部分不同的部分中保持电荷的第一半导体区域。 具有比P型阱更高浓度的P型半导体区域设置在N型半导体区域下方。

    SOLID-STATE IMAGE PICKUP DEVICE
    4.
    发明公开
    SOLID-STATE IMAGE PICKUP DEVICE 有权
    固态图像摇篮

    公开(公告)号:EP2486588A1

    公开(公告)日:2012-08-15

    申请号:EP10770882.8

    申请日:2010-09-29

    IPC分类号: H01L27/146

    摘要: A solid-state image pickup device includes a plurality of pixels, each of the pixels including a photoelectric conversion portion, a charge holding portion, a floating diffusion, and a transfer portion. The pixel also includes a beneath-holding-portion isolation layer and a pixel isolation layer. An end portion on a photoelectric conversion portion side of the pixel isolation layer is away from the photoelectric conversion portion compared to an end portion on a photoelectric conversion portion side of the beneath-holding-portion isolation layer, and an N-type semiconductor region constituting part of the photoelectric conversion portion is disposed under at least part of the beneath-holding-portion isolation layer.

    SOLID-STATE IMAGE PICKUP DEVICE
    5.
    发明授权
    SOLID-STATE IMAGE PICKUP DEVICE 有权
    固态图像拾取设备

    公开(公告)号:EP2486590B1

    公开(公告)日:2013-12-11

    申请号:EP10775918.5

    申请日:2010-10-06

    IPC分类号: H01L27/146

    CPC分类号: H01L27/14643 H01L27/14609

    摘要: A photoelectric conversion portion, a charge holding portion, a transfer portion, and a sense node are formed in a P-type well. The charge holding portion is configured to include an N-type semiconductor region, which is a first semiconductor region holding charges in a portion different from the photoelectric conversion portion. A P-type semiconductor region having a higher concentration than the P-type well is disposed under the N-type semiconductor region.

    SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTURING THE SAME
    6.
    发明公开
    SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
    固态图像拾取装置和用于制造该装置的方法

    公开(公告)号:EP2486589A1

    公开(公告)日:2012-08-15

    申请号:EP10775917.7

    申请日:2010-10-06

    IPC分类号: H01L27/146

    摘要: A solid-state image pickup device includes a photoelectric conversion portion, a charge holding portion configured to include a first-conductivity-type first semiconductor region, and a transfer portion configured to include a transfer gate electrode that controls a potential between the charge holding portion and a sense node. The charge holding portion includes a control electrode. A second-conductivity-type second semiconductor region is disposed on a surface of a semiconductor region between the control electrode and the transfer gate electrode. A first-conductivity-type third semiconductor region is disposed under the second semiconductor region. The third semiconductor region is disposed at a deeper position than the first semiconductor region.

    摘要翻译: 固态图像拾取装置包括光电转换部分,被配置为包括第一导电型第一半导体区域的电荷保持部分以及被配置为包括传输栅极电极的传输部分,传输栅极电极控制电荷保持部分 和一个感应节点。 电荷保持部分包括控制电极。 第二导电类型的第二半导体区域设置在控制电极和传输栅极电极之间的半导体区域的表面上。 第一导电类型的第三半导体区域设置在第二半导体区域下方。 第三半导体区域设置在比第一半导体区域更深的位置处。

    SOLID-STATE IMAGING APPARATUS AND DRIVING METHOD THEREOF
    8.
    发明公开
    SOLID-STATE IMAGING APPARATUS AND DRIVING METHOD THEREOF 审中-公开
    固态成像装置及其驱动方法

    公开(公告)号:EP2274775A1

    公开(公告)日:2011-01-19

    申请号:EP09729941.6

    申请日:2009-04-03

    IPC分类号: H01L27/146

    CPC分类号: H01L27/14609 H01L27/14643

    摘要: A solid-state imaging apparatus includes the carrier holding portion and the amplifying portion in each pixel, wherein a first voltage supplied to a transfer electrode when the transfer portion for transferring carriers from the carrier holding portion to the amplifying portion is placed in a non-conducting state is opposite in polarity to a voltage supplied to the transfer electrode during the turning on period of the transfer portion, and a second voltage supplied to the control electrode of the carrier holding portion during a holding period in which the carriers are retained in the carrier holding portion is the same in polarity as the first voltage and is larger in absolute value than the first voltage.

    PHOTOELECTRIC CONVERSION DEVICE AND IMAGING SYSTEM
    9.
    发明公开
    PHOTOELECTRIC CONVERSION DEVICE AND IMAGING SYSTEM 审中-公开
    光电转换装置和图像系统

    公开(公告)号:EP2195844A1

    公开(公告)日:2010-06-16

    申请号:EP08835419.6

    申请日:2008-10-01

    摘要: A photoelectric conversion device comprises: a plurality of photoelectric conversion elements each having a photo-sensing surface; insulation films; a plurality of light-guiding portions arranged above the insulation films, each of the plurality of light-guiding portions guiding light on the photo-sensing surface of each of the plurality of photoelectric conversion elements; and boundary portions, each of the boundary portions defines a boundary between the adjacent light-guiding portions and is formed of a material lower in refractive index than a material that forms the plurality of light-guiding portions, wherein a width of each of the boundary portions is not more than half a shortest wavelength in a wavelength range of visible light, and a height from a lower surface to an upper surface of each of the plurality of light-guiding portions is not less than double a longest wavelength in the wavelength range of visible light.