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    FABRICATION OF MEMS BASED CANTILEVER SWITCHES BY EMPLOYING A SPLIT LAYER CANTILEVER DEPOSITION SCHEME
    2.
    发明公开
    FABRICATION OF MEMS BASED CANTILEVER SWITCHES BY EMPLOYING A SPLIT LAYER CANTILEVER DEPOSITION SCHEME 有权
    悬臂接通MEMS BASIS的使用的零件层悬臂存款计划生产

    公开(公告)号：EP2389336A2

    公开(公告)日：2011-11-30

    申请号：EP10700934.2

    申请日：2010-01-20

    申请人： Cavendish Kinetics Inc.

    发明人： LACEY, Joseph, Damian, Gordon

    IPC分类号： B81B3/00

    CPC分类号： B81B3/007 ,  B81B2201/014 ,  B81B2203/0118 ,  H01L41/094

    摘要： Embodiments discussed herein generally disclose novel alternative methods that can be employed to overcome the gradient stress formed in refractory materials to be used for thin film MEMS cantilever switches. The use of a ‘split layer’ cantilever fabrication method, as described herein enables thin film MEMS cantilever switches to be fabricated resulting in low operating voltage devices while maintaining the mechanical rigidity of the landing portion of the final fabricated cantilever switch.

    摘要翻译： 在基因集会讨论的实施例公开了新颖的替代方法也可以用来克服形成在耐火材料用于薄膜MEMS悬臂开关梯度应力。 使用“分割层”悬臂的制造方法，如在描述的启用导致低工作电压的装置，同时保持最终制造的悬臂式开关的着陆部分的机械刚度要制造的薄膜MEMS悬臂开关。