摘要:
The invention relates to a method for producing an emitting pixel screen, which includes forming an active pixel matrix (1), along which a first electrode-forming layer (2) runs, said pixels being arranged according to a predetermined distribution; forming an anisotropic substrate (3) made up of a set of light-emitting diodes, each of which is made up of parallel nanowires (4) distributed in an insulating matrix (5) transversely to the body thereof, i.e. vertically, at a higher density than the pixels, regardless of the predetermined distribution of the pixels; connecting the substrate to the active pixel matrix, such that only sub-groups (4A, 4B) of said nanowires are connected, by means of a first end, to separate pixel electrodes (2A, 2B) defined in the electrode-forming layer according to the distribution of the pixels in the active pixel matrix, while at least said sub-groups of nanowires are electrically connected, by means of another end, to a common electrode (6), said sub-groups being defined during said connection step by rendering the nanowires of the substrate which are arranged between said sub-groups emissively inactive.
摘要:
The method comprises, for the production of an electronic subassembly: an assembly step, in which a semiconductor layer (103) bearing at least a first transistor (110) having an adjustable threshold voltage, is joined to an insulator layer (102, 105); and a formation step, in which a first trapping zone (220) is formed in the insulating layer at a predetermined first depth, said first trapping zone extending at least beneath a channel of said first transistor and having traps of greater density than the density of traps outside said first trapping zone, in such a way that the semiconductor layer and the first trapping zone are capacitively coupled, the useful information from said first transistor being the charge transport within this transistor. In certain embodiments, a second trapping zone extending at least beneath a channel of a second transistor is formed by a second implantation with an energy and/or a dose and/or atoms that differ from those used for the first trapping zone.
摘要:
The invention relates to an electronic chip, comprising: a semiconductor substrate (6) having an active area (8) formed by at least one P doped region and at least one N doped region which form one or more P-N junctions through which most of the useful current flows when said electronic chip is in a conductive state, and at least one channel (44) through which a heat transport coolant can flow, the channel(s) passing through at least said P or N doped region of the active area. Each channel (44) is rectilinear and passes through the substrate (6) in a direction which is collinear with a direction F to the nearest ± 45°, where the direction F is perpendicular to the plane of the substrate.
摘要:
The invention relates to an acoustic wave device comprising at least one surface acoustic wave (SAW) filter and one bulk acoustic wave (BAW) filter, characterized in that it includes, on a substrate comprising a second piezoelectric material (P iézo2 ): a stack of layers comprising at least a first metal layer (M 1 ) and a layer of a first monocrystalline piezoelectric material (P iézo1 ), wherein the stack of layers is partially etched so as to define a first area in which the first and second piezoelectric materials are present and a second area in which the first piezoelectric material is absent; a second metallization (M 2 ) at the first area for defining the bulk acoustic wave filter integrating the first piezoelectric material, and a third metallization (M 3 ) at the second area for defining the surface acoustic wave filter integrating the second piezoelectric material. The invention also relates to a method for making the device of the invention, advantageously using application steps similar to those used is the Smart Cut TM method or mechanical bonding/thinning steps.
摘要:
The invention relates to a method for producing a hybrid substrate comprising the following steps: - a first substrate (10) is prepared, comprising a mixed layer extended by an underlying electrically insulating continuous layer (11) and made up of first single-crystal areas (12A) and second adjacent areas (12B) in an amorphous material, said second areas making up at least part of the free surface of said first substrate; a second substrate (20) that comprises, on the surface thereof, a reference layer with a predetermined crystallographic orientation, is bonded to said first substrate by hydrophobic molecular bonding at least onto said amorphous areas; recrystallisation of at least part of the amorphous areas to solid phase is carried out according to the crystallographic orientation of the reference layer, and the two substrates are separated at the bonding interface.
摘要:
A process for forming a thin film of a given material comprises the following steps: a first substrate 10 having, on the surface, an amorphous and/or polycrystalline film 12 of said given material is prepared; a second substrate 20 is bonded to this first substrate by hydrophobic direct bonding (molecular adhesion), said second substrate having a single-crystal reference film 21 of a given crystallographic orientation on the surface thereof; a heat treatment is applied at least to the amorphous and/or polycrystalline film, said heat treatment being designed to cause at least a portion of this amorphous and/or polycrystalline film 12 to undergo solid-phase recrystallization along the crystallographic orientation of the reference film 21, this reference film acting as recrystallization seed; and the at least partly recrystallized film is separated from at least a portion of the reference film.