摘要:
The present invention relates to an indirect-gap semiconductor substrate, the gap being greater than that of silicon and preferably greater than 1.5 eV, to its use for imaging a specimen by photon-emission scanning tunnel microscopy, and to a photon-emission scanning tunnel imaging method using such an indirect-gap semiconductor substrate. Advantageously, the indirect-gap semiconductor substrate is made of silicon carbide. The present invention also relates to devices for implementing the imaging method according to the invention.
摘要:
The invention concerns a substrate, in particular made of silicon carbide, coated with a thin stoichiometric film of silicon nitride, for making electronic components, and a method for obtaining such a film. The method for obtaining the film on the substrate (1) in the presence of at least one nitrogen-containing gas, consists in coating a layer (2) of a material permeable to said gas and causing the silicon nitride film to be formed at the interface between the substrate and the material layer. The invention is applicable in particular in microelectronics.
摘要:
The invention relates to an antireflection coating, particularly for solar cells, and to a method for producing this coating. An inventive antireflection coating (4) comprises at least one antireflection inner layer (6) made of porous silicon and comprises an outer layer (8) made of silicon oxynitride, which is essentially non-porous, essentially free from foreign species and which is formed on the inner layer.