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    BENDABLE ELECTRONIC DEVICE MODULE
    4.
    发明公开
    BENDABLE ELECTRONIC DEVICE MODULE 审中-公开

    公开(公告)号：EP3809195A1

    公开(公告)日：2021-04-21

    申请号：EP20213137.1

    申请日：2016-10-13

    申请人： Corning Incorporated

    发明人： HU, Guangli ,  JOSHI, Dhananjay ,  PARK, Eunyoung ,  QAROUSH, Yousef Kayed

    IPC分类号： G02F1/1333 ,  B32B17/06 ,  B32B17/00 ,  B32B27/06 ,  B32B27/28 ,  B32B27/36 ,  B32B7/12

    摘要： A foldable electronic device module includes a glass cover element having a thickness from about 25 µm to about 200 µm, an elastic modulus from about 20 GPa to about 140 GPa and a puncture resistance of at least 1.5 kgf. The module further includes a stack with a thickness between about 100 µm and about 600 µm; and a first adhesive joining the stack to the cover element with a shear modulus between about 1 MPa and about 1 GPa. The stack further includes a panel, an electronic device, and a stack element affixed to the panel with a stack adhesive. Further, the device module is characterized by a tangential stress at a primary surface of the cover element of no greater than about 1000 MPa in tension upon bending the module to a radius from about 20 mm to about 2 mm.