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公开(公告)号:EP3014766A1
公开(公告)日:2016-05-04
申请号:EP14816830.5
申请日:2014-06-26
申请人: Cree, Inc.
发明人: PRIBBLE, William , MILLIGAN, James , WOOD, Simon
IPC分类号: H03F3/195
CPC分类号: H03F3/195 , H03F1/0288 , H03F1/56 , H03F3/245 , H03F2200/387 , H03H7/383
摘要: A microwave integrated circuit includes a substrate and a power amplifier on the substrate. The power amplifier includes a power divider circuit having an input configured to receive an input RF signal, a base amplifier having an input coupled to a first output of the power divider circuit and a peaking amplifier having an input coupled to a second output of the power divider circuit and an output coupled to an output combining node. The power amplifier further includes an impedance inverter circuit coupling the output of the base amplifier to the output combining node and a load matching circuit having an input coupled to the output combining node and an output configured to be coupled to a load.
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公开(公告)号:EP3014766B1
公开(公告)日:2018-09-12
申请号:EP14816830.5
申请日:2014-06-26
申请人: Cree, Inc.
发明人: PRIBBLE, William , MILLIGAN, James , WOOD, Simon
CPC分类号: H03F3/195 , H03F1/0288 , H03F1/56 , H03F3/245 , H03F2200/387 , H03H7/383
摘要: A microwave integrated circuit includes a substrate and a power amplifier on the substrate. The power amplifier includes a power divider circuit having an input configured to receive an input RF signal, a base amplifier having an input coupled to a first output of the power divider circuit and a peaking amplifier having an input coupled to a second output of the power divider circuit and an output coupled to an output combining node. The power amplifier further includes an impedance inverter circuit coupling the output of the base amplifier to the output combining node and a load matching circuit having an input coupled to the output combining node and an output configured to be coupled to a load.
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公开(公告)号:EP3619738A1
公开(公告)日:2020-03-11
申请号:EP18795054.8
申请日:2018-05-03
申请人: Cree, Inc.
IPC分类号: H01L23/482 , H01L29/423 , H01L29/43 , H01L29/739
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