公开(公告)号：EP1634326A2

公开(公告)日：2006-03-15

申请号：EP04732932.1

申请日：2004-05-14

申请人： Curamik Electronics GmbH

发明人： SCHULZ-HARDER, Jürgen ,  MITTEREGGER, Kurt ,  EXEL, Karl ,  WEISSER, Jürgen

IPC分类号： H01L21/48

CPC分类号： H01L21/4807 ,  B23K2201/40 ,  B28D1/221 ,  B28D5/0011 ,  H01L21/481 ,  H01L23/142 ,  H01L23/3735 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/0052 ,  H05K2201/0355 ,  H05K2203/081 ,  H05K2203/102 ,  H05K2203/107 ,  H05K2203/1105 ,  H05K2203/1121 ,  H05K2203/302 ,  H01L2924/00

摘要： The invention relates to a novel method for producing a metal/ceramic substrate, which is characterized by applying at least one metal area to at least one top surface of a ceramic layer.