公开(公告)号：EP4130114A1

公开(公告)日：2023-02-08

申请号：EP21780239.6

申请日：2021-03-29

申请人： Denka Company Limited

发明人： KANEKO, Eri ,  OKI, Mana ,  INOUE, Saori ,  TSUJI, Kohji

IPC分类号： C08J5/24 ,  C04B41/83

摘要： An aspect of the present invention provides a semi-cured product composite containing: a porous body; and a semi-cured product of a thermally curable composition impregnated in the porous body, wherein the thermally curable composition contains an epoxy compound and a cyanate compound, and an equivalent ratio of an epoxy group of the epoxy compound to a cyanate group of the cyanate compound in the thermally curable composition is 1.0 or more.

公开(公告)号：EP4299550A1

公开(公告)日：2024-01-03

申请号：EP22779629.9

申请日：2022-02-18

申请人： Denka Company Limited

发明人： INOUE, Saori ,  YAMAGATA, Toshitaka ,  KANEKO, Eri ,  YOSHIMATSU, Ryo ,  KOGA, Ryuji

IPC分类号： C04B38/00 ,  H05K3/20

摘要： A method of producing a circuit board of the present invention includes a step of placing, on a semi-cured composite sheet (10), a plate-shaped member (30) having an opening (31); a step of fitting a metal foil cut product (20) into the opening (31) of the plate-shaped member (30) and placing the metal foil cut product (20) on the semi-cured composite sheet (10) on which the plate-shaped member (30) has been placed; a step of pressurizing, while heating, the semi-cured composite sheet (10) on which the plate-shaped member (30) and the metal foil cut product (20) have been placed to produce a first laminate; and a step of removing the plate-shaped member (30) from the first laminate to produce a second laminate, where the absolute value of the difference between the thickness of the metal foil cut product (20) and the thickness of the plate-shaped member (30) is 0.25 mm or less, and the dielectric breakdown voltage is 3.5 kV or more. According to the present invention, it is possible to provide a method of producing a circuit board capable of suppressing occurrence of cracks in a semi-cured composite sheet that contains a porous ceramic and a semi-cured product of a thermosetting composition filling voids of the porous ceramic even when a metal foil cut product obtained by cutting a metal foil is attached to the semi-cured composite sheet and pressure is applied thereto.