METHOD FOR MANUFACTURING CIRCUIT BOARD AND CIRCUIT BOARD

    公开(公告)号:EP4299550A1

    公开(公告)日:2024-01-03

    申请号:EP22779629.9

    申请日:2022-02-18

    IPC分类号: C04B38/00 H05K3/20

    摘要: A method of producing a circuit board of the present invention includes a step of placing, on a semi-cured composite sheet (10), a plate-shaped member (30) having an opening (31); a step of fitting a metal foil cut product (20) into the opening (31) of the plate-shaped member (30) and placing the metal foil cut product (20) on the semi-cured composite sheet (10) on which the plate-shaped member (30) has been placed; a step of pressurizing, while heating, the semi-cured composite sheet (10) on which the plate-shaped member (30) and the metal foil cut product (20) have been placed to produce a first laminate; and a step of removing the plate-shaped member (30) from the first laminate to produce a second laminate, where the absolute value of the difference between the thickness of the metal foil cut product (20) and the thickness of the plate-shaped member (30) is 0.25 mm or less, and the dielectric breakdown voltage is 3.5 kV or more. According to the present invention, it is possible to provide a method of producing a circuit board capable of suppressing occurrence of cracks in a semi-cured composite sheet that contains a porous ceramic and a semi-cured product of a thermosetting composition filling voids of the porous ceramic even when a metal foil cut product obtained by cutting a metal foil is attached to the semi-cured composite sheet and pressure is applied thereto.