摘要:
An electronic device module comprises: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising an ethylene multi-block copolymer. Typically, the polyolefin material is an ethylene multi-block copolymer with a density of less than about 0,90 grams per cubic centimeter (g/cc). The polymeric material can fully encapsulate the electronic device, or it can be laminated to one face surface of the device. Optionally, the polymeric material can further comprise a scorch inhibitor, and the copolymer can remain uncrosslinked or it can be crosslinked.
摘要:
Laminated structures comprising a (i) glass layer, (ii) first alkoxysilane-containing polyolefin (PO) layer, (iii) catalyst layer, and (iv) second alkoxysilane-containing polyolefin layer, each layer having opposing facial surfaces, are prepared by a method comprising the steps of applying in adhering contact: A. One facial surface of the first PO layer to one facial surface of the glass layer; B. The catalyst layer to the facial surface of the first PO layer opposite the facial surface of the first PO layer in adhering contact with the glass layer; and C. The second PO layer to the facial surface of the catalyst layer opposite the facial surface of the catalyst layer in adhering contact with the first PO layer.
摘要:
An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) a polyolefin copolymer with at least one of (a) a density of less than about 0.90 g/cc, (b) a 2% secant modulus of less than about 150 megaPascal (mPa) as measured by ASTM D-882-02), (c) a melt point of less than about 95C, (d) an α-olefin content of at least about 15 and less than about 50 wt% based on the weight of the polymer, (e) a Tg of less than about -35C, and (f) a SCBDI of at least about 50, (2) optionally, free radical initiator, e.g., a peroxide or azo compound, or a photoinitiator, e.g., benzophenone, and (3) optionally, a co-agent. Typically, the polyolefin copolymer is an ethylene/α-olefin copolymer. Optionally, the polymeric material can further comprise a vinyl silane and/or a scorch inhibitor, and the copolymer can remain uncrosslinked or be crosslinked.
摘要:
A method to join a substrate to an object is disclosed using a curable one or two part adhesive composition comprising an effective amount of a stabilized organoborane amine complex initiator and one or more monomers, oligomers, polymers or mixtures thereof having olefinic unsaturation which is capable of polymerization by free radical polymerization.
摘要:
Compositions having good impact performance can be made from a thermoplastic (e.g., a polyolefin such as polypropylene or HDPE) and an ethylene multi-block copolymer. The compositions are easily molded and often have particular utility in making, for example, automotive facia, parts and other household articles.
摘要:
Compositions having good impact performance can be made from a thermoplastic (e.g., a polyolefin such as polypropylene or HDPE) and an ethylene multi-block copolymer. The compositions are easily molded and often have particular utility in making, for example, automotive facia, parts and other household articles.
摘要:
An electronic device module comprises: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising an ethylene multi-block copolymer. Typically, the polyolefin material is an ethylene multi-block copolymer with a density of less than about 0,90 grams per cubic centimeter (g/cc). The polymeric material can fully encapsulate the electronic device, or it can be laminated to one face surface of the device. Optionally, the polymeric material can further comprise a scorch inhibitor, and the copolymer can remain uncrosslinked or it can be crosslinked.
摘要:
A composite is formed by inserting a ceramic powder into a channel of a preform to form a ceramic powder filled preform. The ceramic powder has at least one reactive ceramic powder. The preform is a ceramic, ceramic-metal composite, metal or combination thereof that has walls that define a plurality of channels each channel having an opening at a surface of the preform. The ceramic powder filled preform is infiltrated with a molten metal to form the ceramic-metal body, which has at least one ceramic phase that is a reaction product of the reactive ceramic and molten infiltrated metal.
摘要:
The present invention is a crosslinkable, expandable polymeric composition comprising a free-radical crosslinkable polymer, a free-radical inducing species, a crosslinking-profile modifier, and a blowing agent. Preferably, the free-radical inducing species is a low temperature free-radical inducing species.