公开(公告)号：EP4397720A1

公开(公告)日：2024-07-10

申请号：EP22864318.5

申请日：2022-08-22

申请人： Dow Toray Co., Ltd.

发明人： YAMAZAKI Ryosuke ,  HAYASHI Masayuki ,  MATSUSHIMA Hidenori ,  OZAKI Koichi ,  IMAIZUMI Toru

IPC分类号： C08L83/07 ,  C08J5/00 ,  C08K3/013 ,  C08K5/544 ,  C08L83/05 ,  C08L91/06 ,  H01L23/29 ,  H01L23/31

CPC分类号： C08J5/00 ,  C08K3/013 ,  C08K5/544 ,  C08L83/04 ,  C08L91/06 ,  H01L23/29 ,  H01L23/31

摘要： [Problem] To provide a curable silicone composition or the like having excellent handleability and curing properties during sealing due to good hot-melt properties and excellent melting properties, in addition to having excellent cured product mechanical strength and substrate bonding strength, making the composition suitable as a sealant for semiconductor devices. [Solution] Provided is a curable silicone composition comprising: (A) a hot-melt MDT-type organopolysiloxane resin having a specific siloxane unit ratio; (B) an organohydrogensiloxane compound; (C) a hydrosilylation catalyst; and (D) a functional inorganic filler in an amount of 400 to 3,000 parts by mass per 100 parts by mass of the total of components (A) to (C), wherein the curable silicone composition is solid at 25°C and has hot-melt properties at a temperature of 200°C or lower, along with the use thereof.

公开(公告)号：EP4174137A1

公开(公告)日：2023-05-03

申请号：EP21833019.9

申请日：2021-06-21

申请人： Dow Toray Co., Ltd.

发明人： YAMAZAKI Ryosuke ,  YAMAMOTO Shinichi ,  HAYASHI Masayuki

IPC分类号： C08L83/07 ,  C08L83/05 ,  H01L21/52 ,  H01L23/29 ,  H01L23/31

摘要： [Problem]
To provide: a curable silicone composition that can be handled as a liquid at room temperature, where a cured product thereof has excellent adhesive and mechanical properties and exhibits relatively high hardness; and an application thereof.
[Resolution Means]
A curable silicone composition containing (A1) an organopolysiloxane resin having a curing reactive functional group that contains a carbon-carbon double bond, (A2) an organopolysiloxane resin not having the curing reactive functional group, and (B) a linear organopolysiloxane in a liquid state at 25°C having the curing reactive functional group, in specific mass% ranges, as well as (C) a curing agent, wherein the viscosity of the entire composition is 50 Pa·s or less, and the amount of the curing reactive functional groups in 100 g of the composition is 1.5 mol% or more; a cured product thereof; and a use thereof in a semiconductor application and the like.