公开(公告)号：EP4365937A1

公开(公告)日：2024-05-08

申请号：EP22831972.9

申请日：2022-06-27

申请人： Origin Quantum Computing Technology (Hefei) Co., Ltd

发明人： YANG, Hui ,  LI, Ye

IPC分类号： H01L23/31 ,  H01L23/498 ,  H01L23/58 ,  H01L23/60

CPC分类号： H01L23/60 ,  H01L23/498 ,  H01L23/58 ,  H01L23/31 ,  H10N69/00

摘要： A quantum device, a manufacturing method thereof, and an electronic device are provided. The quantum device includes: a quantum chip, wherein a signal transmission element and a connecting segment electrically connected to the signal transmission element are formed on the quantum chip; a package substrate, wherein a lead-out segment and a lead-out signal line configured to be electrically connected to a signal connector are formed on the package substrate, and the lead-out signal line is electrically connected to the lead-out segment; and a ball grid array configured to electrically connect the connecting segment to the lead-out segment corresponding to each other. The ball grid array electrically connects the connecting segment to the lead-out segment whose signal transmission properties correspond to each other, thereby realizing electrically connecting the quantum chip to the transmission line, and leading out the connecting segment to an external signal connector. In the present disclosure, the ball grid array does not produce complex field effect, and the electrical connection between the connecting segment and the lead-out segment corresponding to each other by the ball grid array can prevent interference introduced by aluminum wire bonding.

公开(公告)号：EP3187547B1

公开(公告)日：2018-12-05

申请号：EP15837032.0

申请日：2015-08-21

申请人： Lintec Corporation

发明人： NAKAYAMA, Hidekazu ,  MATSUI, Masami ,  KASHIO, Mikihiro

IPC分类号： C08L83/04 ,  C08K3/00 ,  C08K3/36 ,  C08K5/5435 ,  C08K5/544 ,  C08K9/06 ,  C09J11/04 ,  C09J11/06 ,  C09J183/06 ,  C09J183/08 ,  C09K3/10 ,  H01L23/29 ,  H01L23/31 ,  H01L33/56 ,  C09J183/04 ,  C08L83/06

CPC分类号： C09J183/06 ,  C08G77/04 ,  C08G77/16 ,  C08G77/18 ,  C08G77/24 ,  C08G77/388 ,  C08G77/392 ,  C08K3/00 ,  C08K3/36 ,  C08K5/34924 ,  C08K5/5435 ,  C08K5/544 ,  C08K9/06 ,  C08L83/04 ,  C08L83/06 ,  C09J11/04 ,  C09J11/06 ,  C09J183/04 ,  C09K3/10 ,  H01L23/29 ,  H01L23/31 ,  H01L31/0216 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2924/00 ,  C08K5/5442 ,  C08K5/5455

摘要： The present invention is a curable composition comprising a component (A), a component (B), a component (C), and a component (D), the curable composition comprising the component (A) and the component (B) in a mass ratio (component (A):component (B)) of 100:0.3 to 100:20, the component (A) being a silane compound (co)polymer that is represented by a formula (a-1) or a formula (a-2), €ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ(CHR 1 X 0 -D-SiO 3/2 ) m (R 2 SiO 3/2 ) n (CHR 1 X 0 -D-SiZ 1 O 2/2 ) o (R 2 SiZ 2 O 2/2 ) p (CHR 1 X 0 -D-SiZ 3 2 O 1/2 ) q (R 2 SiZ 4 2 O 1/2 )r ···€ƒ€ƒ€ƒ€ƒ€ƒ(a-1) €ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ(R 3 SiO 3/2 ) s (R 3 SiZ 5 O 2/2 ) t (R 3 SiZ 5 2 O 1/2 ) u ···€ƒ€ƒ€ƒ€ƒ€ƒ(a-2) the component (B) being fine particles having an average primary particle size of more than 0.04 µm and 8 µm or less, the component (C) being a silane coupling agent that comprises a nitrogen atom in its molecule, and the component (D) being a silane coupling agent that comprises an acid anhydride structure in its molecule, and an optical element-securing composition, and a cured product, and an optical element-securing material, and a method for using the curable composition, and an optical device.

公开(公告)号：EP3401311A1

公开(公告)日：2018-11-14

申请号：EP16875279.8

申请日：2016-11-08

申请人： DIC Corporation

发明人： OTSU Masato ,  SHIMONO Tomohiro ,  ARITA Kazuo ,  YAMAGUCHI Junji

IPC分类号： C07D265/16 ,  B32B27/42 ,  C08G14/073 ,  C08L61/34 ,  H01L23/14 ,  H01L23/29 ,  H01L23/31

CPC分类号： B32B27/42 ,  B32B2457/08 ,  C07D265/16 ,  C08K7/02 ,  C08L39/00 ,  C08L61/34 ,  H01L23/14 ,  H01L23/29 ,  H01L23/31 ,  H05K1/0373

摘要： The present invention provides an oxazine compound which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon double bond structure so as to achieve an object. The present invention further provides a composition containing the oxazine compound of the present invention, a cured product containing the composition, and a laminate having the cured product layer. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention so as to achieve an object.

公开(公告)号：EP3388461A1

公开(公告)日：2018-10-17

申请号：EP16872827.7

申请日：2016-11-24

申请人： DIC Corporation

发明人： ARITA Kazuo ,  SHIMONO Tomohiro ,  OTSU Masato ,  YAMAGUCHI Junji ,  SUZUKI Etsuko

IPC分类号： C08G14/073 ,  B32B15/08 ,  C07D265/16 ,  C08J5/24 ,  H01L23/29 ,  H01L23/31 ,  H05K1/03

CPC分类号： C07D265/16 ,  B32B15/08 ,  C08J5/24 ,  H01L23/29 ,  H01L23/295 ,  H01L23/31 ,  H05K1/03 ,  H05K1/0373 ,  H05K1/09

摘要： The present invention provides an oxazine compound having a specific structure, which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon triple bond structure. The present invention further provides a composition containing the oxazine compound having a specific structure of the present invention, a cured product containing the composition, and a laminate having a layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention.

公开(公告)号：EP3306651A3

公开(公告)日：2018-08-15

申请号：EP17195021.5

申请日：2017-10-05

申请人： MediaTek Inc.

发明人： CHEN, Nan-Cheng ,  CHOU, Che-Ya ,  LIU, Hsing-Chih ,  KUO, Che-Hung

IPC分类号： H01L21/60 ,  H01L23/14 ,  H01L23/538 ,  H01L25/065

CPC分类号： H01L23/31 ,  H01L23/145 ,  H01L23/147 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/481 ,  H01L23/4824 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/20 ,  H01L25/043 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2225/06541 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/10253 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/014 ,  H01L2924/00014

摘要： A semiconductor device includes a substrate (110), a body structure (120) and an electronic component (130). The body structure is disposed above the substrate and includes a semiconductor die (121), a molding compound (122), a conductive component (123) and a lower redistribution layer (RDL) (124). The semiconductor die has an active surface (121a). The molding compound encapsulates the semiconductor die and has a lower surface (122b), an upper surface (122u) opposite to the lower surface and a through hole (122h) extending to the upper surface from the lower surface. The conductive component is formed within the through hole. The lower RDL is formed on the lower surface of the molding compound, the active surface of the semiconductor die and the conductive component exposed from the lower surface. The electronic component is disposed above the upper surface of the molding compound and electrically connected to the lower RDL through the conductive component.

公开(公告)号：EP3225660A4

公开(公告)日：2018-07-25

申请号：EP15862296

申请日：2015-11-05

申请人： KYOCERA CORP

发明人： UCHIDA KEN ,  KAZAMA SHINICHI ,  TERASHI YOSHITAKE

IPC分类号： C08L63/00 ,  C08K3/04 ,  C08K3/30 ,  C08K3/36 ,  H01L23/00 ,  H01L23/29 ,  H01L23/31

CPC分类号： C08L63/04 ,  C08K3/04 ,  C08L61/04 ,  C08L63/00 ,  C08L91/06 ,  C08L2203/206 ,  H01L21/56 ,  H01L23/00 ,  H01L23/29 ,  H01L23/293 ,  H01L23/295 ,  H01L23/31 ,  H01L2924/0002 ,  H01L2924/186 ,  H01L2924/00

摘要： A resin composition for semiconductor encapsulation, containing (A) an epoxy resin, (B) a phenolic resin-based curing agent, (C) an inorganic filler, and (D) amorphous carbon, wherein the amorphous carbon of the component (D) contains 30 atomic% or more of an SP 3 structure and 55 atomic% or less of an SP 2 structure.

公开(公告)号：EP3141573A4

公开(公告)日：2018-01-03

申请号：EP15788814

申请日：2015-05-07

申请人： LINTEC CORP

发明人： MATSUI MASAMI ,  KASHIO MIKIHIRO

IPC分类号： C08L83/08 ,  C08G77/04 ,  C08G77/06 ,  C08G77/08 ,  C08G77/22 ,  C08K5/54 ,  C09J11/06 ,  C09J183/08 ,  H01L23/29 ,  H01L23/31 ,  H01L33/56

CPC分类号： C08G77/26 ,  C08G77/045 ,  C08G77/06 ,  C08G77/08 ,  C08G77/80 ,  C08K5/54 ,  C08K5/5435 ,  C08K5/5455 ,  C08L83/08 ,  C09J11/06 ,  H01L23/29 ,  H01L23/296 ,  H01L23/31 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention is a curable polysilsesquioxane compound comprising at least one structural unit represented by CHR 1 X 0 -D-SiO 3/2 , the curable polysilsesquioxane compound having a 29 Si nuclear magnetic resonance spectrum that has a first peak top within a range of -73 ppm or more and less than -65 ppm, has a second peak top within a range of -82 ppm or more and less than -73 ppm, and substantially does not have a peak within a range of -65 ppm or more and less than -55 ppm, and a method for producing the curable polysilsesquioxane compound, and a curable composition comprising the curable polysilsesquioxane compound and a silane coupling agent, and a cured product obtained by heating the curable composition, and a method for using the curable polysilsesquioxane compound or the curable composition , as an optical device-securing material.

公开(公告)号：EP3153544A1

公开(公告)日：2017-04-12

申请号：EP15802373.9

申请日：2015-05-29

申请人： Dow Corning Toray Co., Ltd.

发明人： IIMURA, Tomohiro ,  TODA, Nohno ,  INAGAKI, Sawako ,  MIYAMOTO, Yusuke ,  FURUKAWA, Haruhiko

IPC分类号： C08K5/5455 ,  C08L83/05 ,  C08L83/07 ,  C09J183/05 ,  C09J183/07 ,  H01L23/29 ,  H01L23/31 ,  H01L33/56

CPC分类号： C08K5/5455 ,  C08G77/12 ,  C08G77/20 ,  C08G77/26 ,  C08K5/05 ,  C08K5/56 ,  C08L83/00 ,  C08L83/04 ,  C08L83/08 ,  H01L23/29 ,  H01L23/31 ,  H01L33/502 ,  H01L33/56 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00012

摘要： An adhesion promoter represented by the average formula; a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule, (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule, (C) the adhesion promoter, and (D) a hydrosilylation reaction catalyst; and a semiconductor device in which a semiconductor element is encapsulated with a cured product of the curable silicone composition. A novel adhesion promoter, a curable silicone composition that contains the adhesion promoter and that forms a cured product having excellent adhesion to various base materials, and an optical semiconductor device that is formed from the curable silicone composition and that has excellent reliability are provided.

摘要翻译： 由平均式表示的粘合促进剂; 一种可固化有机硅组合物，其包含：（A）在分子中具有至少两个烯基的有机聚硅氧烷，（B）分子中具有至少两个与硅原子键合的氢原子的有机氢聚硅氧烷，（C）粘合促进剂和（D ）氢化硅烷化反应催化剂; 以及其中半导体元件被可固化硅酮组合物的固化产物包封的半导体器件。 提供一种新颖的粘合促进剂，含有粘合促进剂并且形成对各种基材具有优异粘附性的固化产物的可固化有机硅组合物，以及由可固化硅酮组合物形成且具有优异可靠性的光学半导体装置。

公开(公告)号：EP1577944A1

公开(公告)日：2005-09-21

申请号：EP05105068.0

申请日：1997-09-22

申请人： Oki Electric Industry Co., Ltd.

发明人： Sakamoto, Akira

IPC分类号： H01L23/495 ,  H01L23/31

CPC分类号： H01L23/31 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/181 ,  H05K3/3426 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device packaged in a plastic package provided with a semiconductor device chip, a plurality of leads each of which is bonded with each of the bonding pads of the semiconductor device chip, and a plastic mold packaging the semiconductor device chip bonded with the leads, allowing the leads to project themselves from the bottom surface thereof and to extend outward along the bottom surface thereof, wherein each of the leads has a horizontal shape in which the surface of the edge thereof is a half circle, a half ellipse or a half polygon convex toward the inward direction.

摘要翻译： 一种封装在塑料封装中的半导体器件，所述塑料封装设置有半导体器件芯片，多个引线，每个引线与半导体器件芯片的每个接合焊盘接合，以及塑料模具，封装与引线接合的半导体器件芯片， 允许引线从其底面突出并沿其底面向外延伸，其中每个引线具有水平形状，其中其边缘的表面为半圆形，半椭圆形或半多边形 朝向内部方向凸起。

公开(公告)号：EP0860877A3

公开(公告)日：2001-02-28

申请号：EP97116500.6

申请日：1997-09-22

申请人： Oki Electric Industry Co., Ltd.

发明人： Sakamoto, Akira

IPC分类号： H01L23/495 ,  H01L23/31

CPC分类号： H01L23/31 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/181 ,  H05K3/3426 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device packaged in a plastic package (1) provided with a semiconductor device chip (2), a plurality of leads (4) each of which is bonded with each of the bonding pads of the semiconductor device chip (2), and a plastic mold (1) packaging the semiconductor device chip (2) bonded with the leads (4), allowing the leads (4) to project themselves from the bottom surface thereof and to extend outward along the bottom surface thereof, wherein each of the leads has a horizontal shape in which the surface of the edge thereof is a half circle (40), a half ellipse or a half polygon convex toward the inward direction.

摘要翻译： 一种半导体器件，封装在塑料封装（1）中，所述塑料封装（1）设置有半导体器件芯片（2），多个引线（4），每个引线与半导体器件芯片（2）的每个接合焊盘接合， 塑料模具（1）封装与引线（4）结合的半导体器件芯片（2），使引线（4）从其底表面突出并沿其底表面向外延伸，其中每个引线 具有其边缘的表面为半圆（40），向内凸出的半椭圆或半多边形的水平形状。